VN820-E
High-side driver
Datasheet − production data
Features
Type
RDS(on)
IOUT
10
VCC
1
VN820-E
VN820SP-E
VN820B5-E
VN820PT-E
VN820-12-E
VN820-11-E
PowerSO-10
40 mΩ
9A
36 V
■
ECOPACK®: lead free and RoHS compliant
■
Automotive Grade: compliance with AEC
guidelines
■
Very low stadby current
■
CMOS compatible input
■
On-state open-load detection
■
Off-state open-load detection
■
Thermal shutdown protection and diagnosis
■
Undervoltage shutdown
■
Overvoltage clamp
■
Output stuck to VCC detection
■
Load current limitation
■
Reverse battery protection
■
Electrostatic discarge protection
Table 1.
P2PAK
PPAK
PENTAWATT
Description
The VN820-E is a monolithic device designed in
STMicroelectronic's VIPower® M0-3 technology.
The VN820-E is intended for driving any type of
load with one side connected to ground. The
active VCC pin voltage clamp protects the device
against low energy spikes.
Active current limitation combined with thermal
shutdown and automatic restart protect the device
against overload. The device detects the openload condition in both on- and off-state mode. In
the off-state the device detects if the output is
shorted to VCC. The device automatically turns off
where the ground pin becomes disconnected.
Device summary
Order codes
Package
Tube
Tape and reel
PENTAWATT
VN820-E
VN820-12-E
VN820-11-E
-
PowerSO-10
VN820SP-E
VN820SPTR-E
P2PAK
VN820B5-E
VN820B5TR-E
PPAK
VN820PT-E
VN820PTTR-E
September 2013
This is information on a product in full production.
Doc ID 10890 Rev 8
1/44
www.st.com
1
Contents
VN820-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
4
5
2/44
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18
3.1.1
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 18
3.1.2
Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 19
3.2
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.5
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum demagnetization
energy (VCC = 13.5V) 21
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1
P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.2
PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.3
PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.2
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.3
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.6
PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.7
P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.8
PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Doc ID 10890 Rev 8
VN820-E
Contents
5.9
6
PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Doc ID 10890 Rev 8
3/44
List of tables
VN820-E
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
4/44
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
P2PAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PPAK thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
PowerSO-10 thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Doc ID 10890 Rev 8
VN820-E
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ilim vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum turn-off current versus inductance
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
P2PAK Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . . . . . 22
P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23
Thermal fitting model of a single channel HSD in P2PAK. . . . . . . . . . . . . . . . . . . . . . . . . . 23
PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
PPAK Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . . . . . . 25
PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 26
Thermal fitting model of a single channel HSD in PPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PowerSO-10 Rthj-amb vs PCB copper area in open box free air conditions . . . . . . . . . . . 28
PowerSO-10 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . 29
Thermal fitting model of a single channel HSD in PowerSO-10 . . . . . . . . . . . . . . . . . . . . . 29
PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
P2PAK tape and reel (suffix “TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Doc ID 10890 Rev 8
5/44
List of figures
Figure 48.
Figure 49.
Figure 50.
Figure 51.
6/44
VN820-E
PPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
PowerSO-10 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Doc ID 10890 Rev 8
VN820-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
6
##
/6%26/,4!'%
$%4%#4)/.
6 ##
#,!-0
5.$%26/,4!'%
$%4%#4)/.
'.$
0OWER #,!-0
$2)6%2
).054
/54054
,/')#
#522%.4 ,)-)4%2
/.
34!4% /0%.
,/!$
$%4%#4)/.
34!453
/6%24%-0%2!452%
$%4%#4)/.
/&&
34!4% /0%.
,/!$
!.$ /54054 3(/24%$ 4/ 6 ##
$%4%#4)/.
'!0'-3
Figure 2.
Configuration diagram (top view)
*5281'
,1387
287387
67$786
1&
1&
287387
287387
287387
287387
287387
67$786
9 &&
,1387
*1'
00!+00!+0%.4!7!44
9 &&
'!0'2)
0OWER3/
'!0'2)
Table 2.
Suggested connections for unused and not connected pins
Connection / pin
Status
N.C.
Output
Input
Floating
X
X
X
X
To ground
X
Doc ID 10890 Rev 8
Through 10 KΩ resistor
7/44
Electrical specifications
2
VN820-E
Electrical specifications
Figure 3.
Current and voltage conventions
,6
9)
,,1
,1387
9&&
,67$7
,287
67$786
9&&
287387
*1'
9,1
967$7
9287
,*1'
'!0'2)
2.1
Absolute maximum ratings
Stressing the device above the rating listed in theTable 3 may cause permanent damage to
the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to Absolute maximum rating conditions for extended periods may affect device
reliability.
Table 3.
Absolute maximum ratings
Value
Symbol
VCC
DC supply voltage
-VCC
PowerSO-10 PENTAWATT P2PAK PPAK
Unit
41
V
Reverse DC supply voltage
- 0.3
V
-Ignd
DC reverse ground pin current
- 200
mA
IOUT
DC output current
Internally limited
A
-IOUT
Reverse DC output current
-9
A
DC input current
+/- 10
mA
ISTAT
DC Status current
+/- 10
mA
VESD
Electrostatic discharge
(human body model:
R = 1.5 KΩ; C = 100 pF)
– INPUT
– STATUS
– OUTPUT
– VCC
4000
4000
5000
5000
V
V
V
V
IIN
8/44
Parameter
Doc ID 10890 Rev 8
VN820-E
Electrical specifications
Table 3.
Absolute maximum ratings (continued)
Value
Symbol
PowerSO-10 PENTAWATT P2PAK PPAK
Unit
EMAX
Maximum switching energy
(L = 1.4 mH; RL= 0 Ω;
Vbat = 13.5 V; Tjstart = 150 ºC;
IL = 13 A)
156
mJ
Ptot
Power dissipation TC = 25 °C
65.8
W
Internally limited
°C
Tj
Junction operating temperature
Tc
Case operating temperature
- 40 to 150
°C
Storage temperature
- 55 to 150
°C
Tstg
2.2
Parameter
Thermal data
Table 4.
Thermal data
Max. value
Symbol
Parameter
Unit
PowerSO-10
PENTAWATT
P2PAK
PPAK
Rthj-case
Thermalresistance
junction-case
1.9
1.9
1.9
1.9
°C/W
Rthj-lead
Thermalresistance
junction-lead
-
-
-
-
°C/W
Thermalresistance
junction-ambient
51.9(1)
61.9(2)
51.9(2)
76.9(2)
°C/W
Rthj-amb
37(2)
-
37(4)
45(4)
°C/W
2
1. When mounted on a standard single-sided FR-4 board with 0.5cm of Cu (at least 35µm thick).
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick).
Doc ID 10890 Rev 8
9/44
Electrical specifications
2.3
VN820-E
Electrical characteristics
Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless
otherwise stated.
Table 5.
Symbol
Parameter
Min.
Typ.
VCC
Operating supply voltage
5.5
13
36
V
VUSD
Undervoltage shutdown
3
4
5.5
V
VUSDhyst
Undervoltage shutdown
hysteresis
VOV
Overvoltage shutdown
RON
On-state resistance
IS
Test conditions
0.5
V
36
V
IOUT = 3 A; Tj = 25 °C; VCC > 8 V
IOUT = 3 A; VCC > 8 V
Supply current
Max. Unit
40
80
mΩ
mΩ
Off-state; VCC = 13 V;
VIN = VOUT = 0 V
10
25
µA
Off-state; VCC = 13 V;
VIN = VOUT = 0 V; Tj = 25 °C
10
20
µA
On-state; VCC = 13 V; VIN = 5 V;
IOUT = 0 A
2
3.5
mA
0
50
µA
-75
0
µA
IL(off1)
Off-state output current
VIN = VOUT = 0 V
IL(off2)
Off-state output current
VIN = 0 V; VOUT = 3.5 V
IL(off3)
Off-state output current
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125°C
5
µA
IL(off4)
Off-state output current
VIN = VOUT = 0 V; VCC = 13 V;
Tj = 25 °C
3
µA
Table 6.
Symbol
10/44
Power
Switching (VCC = 13 V)
Parameter
Test conditions
Min.
Typ.
Max. Unit
td(on)
Turn-on delay time
RL = 4.3 Ω from VIN rising edge to
VOUT = 1.3 V
30
µs
td(off)
Turn-off delay time
RL = 4.3 Ω from VIN falling edge to
VOUT = 11.7 V
30
µs
dVOUT/dt(on) Turn-on voltage slope
RL = 4.3 Ω from VOUT = 1.3 V to
VOUT=10.4 V
See Figure 21
V/µs
dVOUT/dt(off) Turn-off voltage slope
RL = 4.3 Ω from VOUT = 11.7 V to
VOUT = 1.3 V
See Figure 22
V/µs
Doc ID 10890 Rev 8
VN820-E
Electrical specifications
Table 7.
Symbol
Input pin
Parameter
Test conditions
VIL
Input low-level
IIL
Low-level input current
VIH
Input high-level
IIH
High-level input current
Vhyst
Input hysteresis voltage
VICL
Input clamp voltage
Table 8.
Symbol
VF
Table 9.
Symbol
Min.
VIN = 1.25 V
Typ.
Max.
Unit
1.25
V
1
µA
3.25
V
VIN = 3.25 V
10
0.5
IIN = 1m A
IIN = -1m A
µA
V
6
6.8
- 0.7
8
V
V
VCC output diode
Parameter
Test conditions
Forward on voltage
- IOUT = 2 A; Tj = 150 °C
Min.
Typ.
Max.
Unit
-
-
0.6
V
Min.
Typ.
Max.
Unit
Status pin
Parameter
Test conditions
VSTAT
Status low output voltage
ISTAT = 1.6 mA
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT = 5 V
10
µA
CSTAT
Status pin input capacitance Normal operation; VSTAT = 5 V
100
pF
VSCL
Status clamp voltage
8
V
V
Table 10.
Protections(1)
Symbol
Parameter
ISTAT = 1m A
ISTAT = - 1m A
6.8
- 0.7
Min.
Typ.
Max.
Unit
Shutdown temperature
150
175
200
°C
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
tSDL
Status delay in overload
Tj > Tjsh
condition
Ilim
Current limitation
9 V < VCC < 36 V
5.5 V < VCC < 36 V
Turn-off output clamp
voltage
IOUT = 3 A;
VIN = 0V;
L = 6 mH
TTSD
Vdemag
Test conditions
6
9
°C
15
13
°C
20
ms
20
20
A
A
VCC - 41 VCC - 48 VCC - 55
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device operates under
abnormal conditions this software must limit the duration and number of activation cycles.
Doc ID 10890 Rev 8
11/44
Electrical specifications
Table 11.
VN820-E
Open-load detection
Symbol
Parameter
Test conditions
IOL
Open-load on-state
detection threshold
VIN = 5 V
tDOL(on)
Open-load on-state
detection delay
IOUT = 0 A
VOL
Open-load off-state
voltage detection
threshold
VIN = 0 V
tDOL(off)
Open-load detection
delay at turn-off
Figure 4.
Min.
Typ.
Max.
Unit
70
150
300
mA
200
µs
3.5
V
1000
µs
1.5
2.5
Status timings
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9 ,1
9 ,1
9 67$7
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W '2/ RQ
W 6'/
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Figure 5.
Switching time waveforms
9 287
G 9 287 GW RII
G 9 287 GW R Q
W
9 ,1
W G RQ
W G RII
W
'!0'-3
12/44
Doc ID 10890 Rev 8
VN820-E
Electrical specifications
Table 12.
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Overtemperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
Table 13.
Electrical transient requirements
ISO T/R
Test level
7637/1
Test pulse
I
II
III
IV
Delays and impedance
1
- 25V(1)
- 50V(1)
- 75V(1)
- 100V(1)
2ms, 10Ω
2
(1)
+
50V(1)
75V(1)
+
100V(1)
0.2ms, 10Ω
-
50V(1)
-
150V(1)
0.1µs, 50Ω
+
50V(1)
+
100V(1)
0.1µs, 50Ω
3a
3b
+ 25V
-
25V(1)
+
25V(1)
+
-
100V(1)
+
75V(1)
4
- 4V(1)
- 5V(1)
- 6V(1)
- 7V(1)
5
26.5V(1)
46.5V(2)
66.5V(2)
86.5V(2)
+
+
+
+
100ms, 0.01Ω
400ms, 2Ω
1. All functions of the device are performed as designed after exposure to disturbance.
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
Doc ID 10890 Rev 8
13/44
Electrical specifications
Figure 6.
VN820-E
Waveforms
NORMAL OPERATION
INPUT
LOAD VOLTAGE
STATUS
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
INPUT
LOAD VOLTAGE
STATUS
undefined
OVERVOLTAGE
VCC VOV
VCC
INPUT
LOAD VOLTAGE
STATUS
OPEN-LOAD with external pull-up
INPUT
VOUT > VOL
LOAD VOLTAGE
VOL
STATUS
OPEN-LOAD without external pull-up
INPUT
LOAD VOLTAGE
STATUS
Tj
TTSD
TR
OVERTEMPERATURE
INPUT
LOAD CURRENT
STATUS
14/44
Doc ID 10890 Rev 8
VN820-E
2.4
Electrical specifications
Electrical characteristics curves
Figure 7.
Off-state output current
Figure 8.
IL(off1) (µA)
Iih (uA)
5
5
4.5
4.5
Off state
Vcc=36V
Vin=Vout=0V
4
3.5
High-level input current
Vin=3.25V
4
3.5
3
3
2.5
2.5
2
2
1.5
1.5
1
1
0.5
0.5
0
0
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
Figure 9.
50
75
100
125
150
175
Tc (°C)
Tc (ºC)
Input clamp voltage
Figure 10. Status leakage current
Ilstat (uA)
Vicl (V)
8
0.05
7.8
Iin=1mA
0.04
7.6
Vstat=5V
7.4
0.03
7.2
7
0.02
6.8
6.6
0.01
6.4
6.2
0
6
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
Figure 11.
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Status low output voltage
Figure 12. Status clamp voltage
Vscl (V)
Vstat (V)
8
0.8
7.8
0.7
Istat=1mA
Istat=1.6mA
7.6
0.6
7.4
0.5
7.2
0.4
7
0.3
6.8
6.6
0.2
6.4
0.1
6.2
0
6
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Doc ID 10890 Rev 8
15/44
Electrical specifications
VN820-E
Figure 13. On-state resistance vs Tcase
Figure 14. On-state resistance vs VCC
Ron (mOhm)
Ron (mOhm)
100
100
90
90
Iout=3A
Vcc=8V; 13V; 36V
80
80
Tc= 150ºC
70
70
60
60
50
50
40
40
30
30
20
20
10
10
0
Tc= 25ºC
Tc= - 40ºC
0
-50
-25
0
25
50
75
100
125
150
175
5
10
15
20
Tc (ºC)
25
30
35
40
Vcc (V)
Figure 15. Open-load on-state detection Figure 16. Input high-level
threshold
Iol (mA)
Vih (V)
150
3.6
140
3.4
Vcc=13V
Vin=5V
130
3.2
120
110
3
100
2.8
90
2.6
80
2.4
70
2.2
60
50
2
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
150
175
Tc (°C)
Figure 17. Input low-level
Figure 18. Input hysteresis voltage
Vil (V)
Vhyst (V)
2.6
1.5
1.4
2.4
1.3
2.2
1.2
2
1.1
1.8
1
0.9
1.6
0.8
1.4
0.7
1.2
0.6
1
0.5
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
16/44
-50
-25
0
25
50
75
Tc (°C)
Doc ID 10890 Rev 8
100
125
150
175
VN820-E
Electrical specifications
Figure 19. Overvoltage shutdown
Figure 20. Open-load off-state voltage
detection threshold
Vov (V)
Vol (V)
50
5
48
4.5
46
4
44
3.5
Vin=0V
42
3
40
2.5
38
2
36
1.5
34
1
32
0.5
0
30
-50
-25
0
25
50
75
100
125
150
-50
175
-25
0
25
50
75
100
125
150
175
Tc (°C)
Tc (°C)
Figure 21. Turn-on voltage slope
Figure 22. Turn-off voltage slope
dVout/dt/(on) (V/ms)
dVout/dt(off) (V/ms)
1000
1000
900
900
Vcc=13V
Rl=6.5Ohm
800
Vcc=13V
Rl=4.3Ohm
800
700
700
600
600
500
500
400
400
300
300
200
200
100
100
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (ºC)
Tc (ºC)
Figure 23. Ilim vs Tcase
Ilim (A)
20
18
Vcc=13V
16
14
12
10
8
6
4
2
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Doc ID 10890 Rev 8
17/44
Application information
3
VN820-E
Application information
Figure 24. Application schematic
9
9
9 &&
5 SURW
67$786
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P&
5 SURW
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9 *1'
5 *1'
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3.1
GND protection network against reverse battery
3.1.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to set a dimension the RGND resistor.
1.
RGND ≤ 600 mV / (IS(on)max).
2.
RGND ≥ (- VCC) / (- IGND)
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (- VCC)2/ RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift does not vary depending on how many devices are ON in case of several
high-side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
18/44
Doc ID 10890 Rev 8
VN820-E
3.1.2
Application information
Solution 2: diode (DGND) in the ground line
A resistor (RGND = 1kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network produces a shift (≈600 mV) in the input threshold
and in the status output values if the microprocessor ground is not common to the device
ground. This shift not varies if more than one HSD shares the same diode/resistor network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
The safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2
Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3
MCU I/Os protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/Os pins from latching-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
μC I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
5 kΩ ≤ Rprot ≤ 65 kΩ.
Recommended values: Rprot =10 kΩ .
3.4
Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1.
no false open-load indication when load is connected: in this case we have to avoid
VOUT to be higher than VOlmin; this results in the following condition
VOUT = (VPU / (RL+RPU)) RL < VOlmin.
2.
no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU – VOLmax) / IL(off2).
Doc ID 10890 Rev 8
19/44
Application information
VN820-E
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched off when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics
section.
Figure 25. Open-load detection in off-state
9 E D WW
9 38
9 &&
5 38
,1387
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, / RII
287
5
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20/44
Doc ID 10890 Rev 8
VN820-E
3.5
Application information
PowerSO-10, P2PAK, PPAK, PENTAWATT maximum
demagnetization energy (VCC = 13.5V)
Figure 26. PowerSO-10, P2PAK, PPAK, PENTAWATT maximum turn-off current
versus inductance
,PD[ $
$
%
&
/ P+
!4JSTART #SINGLEPULSE
"4JSTART #REPETITIVEPULSE
#4JSTART #REPETITIVEPULSE
6). ),
$EMAGNETIZATION
$EMAGNETIZATION
$EMAGNETIZATION
T
("1(.4
Note:
Values are generated with RL = 0 Ω. In case of repetitive pulses, Tjstart (at beginning of each
demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
Doc ID 10890 Rev 8
21/44
Package and PCB thermal data
VN820-E
4
Package and PCB thermal data
4.1
P2PAK thermal data
Figure 27. P2PAK PC board
Note:
("1(.4
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness = 35 μm , Copper areas: 0.97 cm2, 8 cm2).
Figure 28. P2PAK Rthj-amb vs PCB copper area in open box free air conditions
57+MBDPE &:
7M7DP E &
3&%&XKHDWVLQNDUHD FPA
("1(.4
22/44
Doc ID 10890 Rev 8
VN820-E
Package and PCB thermal data
Figure 29. P2PAK thermal impedance junction ambient single pulse
=7+ &:
FP
FP
7LPH V
("1(.4
Equation 1: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 30. Thermal fitting model of a single channel HSD in P2PAK
("1(.4
Doc ID 10890 Rev 8
23/44
Package and PCB thermal data
Table 14.
24/44
VN820-E
P2PAK thermal parameters
Area/island (cm2)
0.97
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.3
R4 (°C/W)
4
R5 (°C/W)
9
R6 (°C/W)
37
C1 (W·s/°C)
0.0008
C2 (W·s/°C)
0.007
C3 (W·s/°C)
0.015
C4 (W·s/°C)
0.4
C5 (W·s/°C)
2
C6 (W·s/°C)
3
Doc ID 10890 Rev 8
6
22
5
VN820-E
4.2
Package and PCB thermal data
PPAK thermal data
Figure 31. PPAK PC board
GAPGRI00172
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 μm , Copper areas: 0.44 cm2, 8 cm2).
Figure 32. PPAK Rthj-amb vs PCB copper area in open box free air conditions
57+MBDPE &:
3&%&XKHDWVLQNDUHD FPA
'!0'2)
Doc ID 10890 Rev 8
25/44
Package and PCB thermal data
VN820-E
Figure 33. PPAK thermal impedance junction ambient single pulse
=7+ &:
FP
FP
7LPH V
'!0'2)
Equation 2: pulse calculation formula
Z
THδ
= R
TH
⋅δ+Z
THtp
(1 – δ)
where δ = tP/T
Figure 34. Thermal fitting model of a single channel HSD in PPAK
("1(.4
26/44
Doc ID 10890 Rev 8
VN820-E
Package and PCB thermal data
Table 15.
PPAK thermal parameters
Area/island (cm2)
0.44
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.3
R4 (°C/W)
2
R5 (°C/W)
15
R6 (°C/W)
61
C1 (W·s/°C)
0.0008
C2 (W·s/°C)
0.007
C3 (W·s/°C)
0.02
C4 (W·s/°C)
0.3
C5 (W·s/°C)
0.45
C6 (W·s/°C)
0.8
Doc ID 10890 Rev 8
6
24
5
27/44
Package and PCB thermal data
4.3
VN820-E
PowerSO-10 thermal data
Figure 35. PowerSO-10 PC board
GAPGRI00280
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
8 cm2).
Figure 36. PowerSO-10 Rthj-amb vs PCB copper area in open box free air conditions
24(J?AMB #7
4J
4AMB #
0#"#UHEATSINKAREACM>
'!0'2)
28/44
Doc ID 10890 Rev 8
VN820-E
Package and PCB thermal data
Figure 37. PowerSO-10 thermal impedance junction ambient single pulse
:4( #7
CM
CM
4IMES
("1($'5
Equation 3: pulse calculation formula
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where
δ = tp ⁄ T
Figure 38. Thermal fitting model of a single channel HSD in PowerSO-10
7M
&
&
&
&
&
&
5
5
5
5
5
5
3G
7BDPE
'!0'2)
Doc ID 10890 Rev 8
29/44
Package and PCB thermal data
Table 16.
30/44
VN820-E
PowerSO-10 thermal parameters
Area / island (cm2)
Footprint
R1 (°C/W)
0.04
R2 (°C/W)
0.25
R3 (°C/W)
0.25
R4 (°C/W)
0.8
R5 (°C/W)
12
R6 (°C/W)
37
C1 (W.s/°C)
0.0008
C2 (W.s/°C)
7E-03
C3 (W.s/°C)
0.015
C4 (W.s/°C)
0.3
C5 (W.s/°C)
0.75
C6 (W.s/°C)
3
Doc ID 10890 Rev 8
6
22
5
VN820-E
Package and packing information
5
Package and packing information
5.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
PENTAWATT mechanical data
Figure 39. PENTAWATT package dimensions
GAPGRI00283
Doc ID 10890 Rev 8
31/44
Package and packing information
Table 17.
VN820-E
PENTAWATT mechanical data
mm
Dim.
Min.
Typ.
A
4.8
C
1.37
D
2.4
2.8
D1
1.2
1.35
E
0.35
0.55
F
0.8
1.05
F1
1
1.4
G
3.2
3.4
3.6
G1
6.6
6.8
7
H2
H3
10.4
10.05
10.4
L
17.85
L1
15.75
L2
21.4
L3
22.5
L5
2.6
3
L6
15.1
15.8
L7
6
6.6
M
4.5
M1
4
Diam.
32/44
Max.
3.65
Doc ID 10890 Rev 8
3.85
VN820-E
5.3
Package and packing information
P2PAK mechanical data
Figure 40. P2PAK package dimensions
("1($'5
Doc ID 10890 Rev 8
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Package and packing information
VN820-E
P2PAK mechanical data
Table 18.
mm
Dim.
Min.
Max.
A
4.30
4.80
A1
2.40
2.80
A2
0.03
0.23
b
0.80
1.05
c
0.45
0.60
c2
1.17
1.37
D
8.95
9.35
D2
E
8.00
10.00
E1
10.40
8.50
e
3.20
3.60
e1
6.60
7.00
L
13.70
14.50
L2
1.25
1.40
L3
0.90
1.70
L5
1.55
2.40
0.40
R
V2
0º
Package weight
34/44
Typ.
8º
1.40 Gr (typ)
Doc ID 10890 Rev 8
VN820-E
5.4
Package and packing information
PPAK mechanical data
Figure 41. PPAK package dimensions
'!0'2)
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Package and packing information
Table 19.
VN820-E
PPAK mechanical data
mm
Dim.
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
B
0.40
0.60
B2
5.20
5.40
C
0.45
0.60
C2
0.48
0.60
D1
5.1
D
6.00
6.20
E
6.40
6.60
E1
4.7
e
1.27
G
4.90
5.25
G1
2.38
2.70
H
9.35
10.10
L2
0.8
L4
0.60
L5
1
2.80
R
0.2
0º
Package weight
8º
Gr. 0.3
Doc ID 10890 Rev 8
1.00
1.00
L6
V2
36/44
Typ.
VN820-E
5.5
Package and packing information
PowerSO-10 mechanical data
Figure 42. PowerSO-10 package dimensions
%
$
%
+
(
(
(
6($7,1*
3/$1(
H
%
'(7$,/$
$
&
K
(
'
'
6($7,1*
3/$1(
$
)
$
$
/
'(7$,/$
D
'!0'2)
Doc ID 10890 Rev 8
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Package and packing information
Table 20.
VN820-E
PowerSO-10 mechanical data
mm
Dim.
Min.
Max.
A
3.35
3.65
A(1)
3.4
3.6
A1
0
0.10
B
0.40
0.60
B(1)
0.37
0.53
C
0.35
0.55
C(1)
0.23
0.32
D
9.40
9.60
D1
7.40
7.60
E
9.30
9.50
E2
7.20
7.60
E2(1)
7.30
7.50
E4
5.90
6.10
E4(1)
5.90
6.30
e
1.27
F
1.25
1.35
F(1)
1.20
1.40
H
13.80
14.40
H(1)
13.85
14.35
h
0.50
L
1.20
1.80
L(1)
0.80
1.10
α
0°
8°
α(1)
2°
8°
1. Muar only POA P013P.
38/44
Typ.
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VN820-E
5.6
Package and packing information
PENTAWATT packing information
Figure 43. PENTAWATT tube shipment (no suffix)
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
"
#
50
1000
532
18
33.1
1
All dimensions are in mm.
!
("1($'5
5.7
P2PAK packing information
Figure 44. P2PAK tube shipment (no suffix)
"
#
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
50
1000
532
18
33.1
1
All dimensions are in mm.
!
("1($'5
Doc ID 10890 Rev 8
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Package and packing information
VN820-E
Figure 45. P2PAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm
.
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
1000
1000
330
1.5
13
20.2
24.4
60
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
24
4
12
1.5
1.5
11.5
6.5
2
All dimensions are in mm.
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
5.8
PPAK packing information
Figure 46. PPAK suggested pad layout
3
40/44
No components
1.8
Doc ID 10890 Rev 8
6.7
500mm min
VN820-E
Package and packing information
Figure 47. PPAK tube shipment (no suffix)
A
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
75
3000
532
6
21.3
0.6
All dimensions are in mm.
B
Figure 48. PPAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
8
1.5
1.5
7.5
2.75
2
End
Start
Top
cover
tape
No components
Components
No components
500mm min
Empty components pockets
saled with cover tape.
500mm min
User direction of feed
Doc ID 10890 Rev 8
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Package and packing information
5.9
VN820-E
PowerSO-10 packing information
Figure 49. PowerSO-10 suggested Figure 50. PowerSO-10 tube shipment (no
pad layout
suffix)
CASABLANCA
B
MUAR
C
C
A
A
B
All dimensions are in mm.
Casablanca
Muar
Base Q.ty Bulk Q.ty Tube length (± 0.5) A
B C (± 0.1)
50
1000
532
10.4 16.4
0.8
50
1000
532
4.9 17.2
0.8
("1($'5
Figure 51. PowerSO-10 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
Tape dimensions
According to Electronic Industries Association (EIA)
Standard 481 rev. A, Feb. 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
24
4
24
1.5
1.5
11.5
6.5
2
End
All dimensions are in mm.
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
42/44
Doc ID 10890 Rev 8
500mm min
VN820-E
6
Revision history
Revision history
Table 21.
Document revision history
Date
Revision
07-Dec-2004
1
Initial release.
09-Feb-2005
2
Text changed.
23-Mar-2005
3
Configuration diagram (PowerSO-10) modification.
03-May-2006
4
SO-16L mechanical and shipment data insertion.
5
Document reformatted and restructured.
Added content, list of figures and tables.
Added ECOPACK® packages information.
Updated Figure 45: P2PAK tape and reel (suffix “TR”):
– changed component spacing (P) in tape dimensions table from 16
mm to 12 mm.
29-Mar-2010
6
Updated features list.
Updated Table 1: Device summary.
Updated Table 3: Absolute maximum ratings.
Updated Section 3.5: PowerSO-10, P2PAK, PPAK, PENTAWATT
maximum demagnetization energy (VCC = 13.5V).
Removed SO-16L package into the document.
07-June-2012
7
Updated Section 5.8: PPAK packing information.
24-Sep-2013
8
Updated Disclaimer.
17-Dec-2008
Changes
Doc ID 10890 Rev 8
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VN820-E
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