0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
VND7040AJ-E

VND7040AJ-E

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    PowerLFSOP16

  • 描述:

    IC DVR HIGH-SIDE 2CH POWERSSO16

  • 数据手册
  • 价格&库存
VND7040AJ-E 数据手册
VND7040AJ-E Double channel high-side driver with MultiSense analog feedback for automotive applications Datasheet - production data – Configurable latch-off on overtemperature or power limitation with dedicated fault reset pin – Loss of ground and loss of VCC – Reverse battery with external components – Electrostatic discharge protection PowerSSO-16 GAPGCFT00327 Applications • All types of Automotive resistive, inductive and capacitive loads Features Max transient supply voltage VCC 40 V Operating voltage range VCC 4 to 28 V Typ. on-state resistance (per Ch) RON 40 mΩ Current limitation (typ) ILIMH 34 A Standby current (max) ISTBY 0.5 µA • General – Double channel smart high side driver with MultiSense analog feedback – Very low standby current – Compatible with 3 V and 5 V CMOS outputs • MultiSense diagnostic functions – Multiplexed analog feedback of: load current with high precision proportional current mirror, VCC supply voltage and TCHIP device temperature – Overload and short to ground (power limitation) indication – Thermal shutdown indication – Off-state open-load detection – Output short to VCC detection – Sense enable/ disable • Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients October 2014 This is information on a product in full production. • Specially intended for Automotive Signal Lamps (up to P27W or SAE1156 and R5W paralleled or LED Rear Combinations) Description The VND7040AJ-E is a double channel high-side driver manufactured using ST proprietary VIPower® technology and housed in PowerSSO-16 package. The device is designed to drive 12 V automotive grounded loads through a 3 V and 5 V CMOS-compatible interface, providing protection and diagnostics. The device integrates advanced protective functions such as load current limitation, overload active management by power limitation and overtemperature shutdown with configurable latch-off. A FaultRST pin unlatches the output in case of fault or disables the latch-off functionality. A dedicated multifunction multiplexed analog output pin delivers sophisticated diagnostic functions including high precision proportional load current sense, supply voltage feedback and chip temperature sense, in addition to the detection of overload and short circuit to ground, short to VCC and off-state open-load. A sense enable pin allows off-state diagnosis to be disabled during the module low-power mode as well as external sense resistor sharing among similar devices. DocID018823 Rev 9 1/48 www.st.com Contents VND7040AJ-E Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Main electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.1 Power limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.2 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.3 Current limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.4 Negative voltage clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 30 4.1.1 4.2 Immunity against transient electrical disturbances . . . . . . . . . . . . . . . . . . 31 4.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.4 Multisense - analog current sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.5 5 2/48 4.4.1 Principle of Multisense signal generation . . . . . . . . . . . . . . . . . . . . . . . 34 4.4.2 TCASE and VCC monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.4.3 Short to VCC and OFF-state open-load detection . . . . . . . . . . . . . . . . . 37 Maximum demagnetization energy (VCC = 16 V) . . . . . . . . . . . . . . . . . . . 38 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1 6 Diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 PowerSSO-16 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 6.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 6.2 PowerSSO-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 DocID018823 Rev 9 VND7040AJ-E Contents 7 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 DocID018823 Rev 9 3/48 3 List of tables VND7040AJ-E List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. 4/48 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Switching (VCC = 13 V; -40°C < Tj < 150°C, unless otherwise specified). . . . . . . . . . . . . . 11 Logic inputs (7 V < VCC < 28 V; -40°C < Tj < 150°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Protections (7 V < VCC < 18 V; -40°C < Tj < 150°C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 MultiSense multiplexer addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 ISO 7637-2 - electrical transient conduction along supply line . . . . . . . . . . . . . . . . . . . . . 31 Multisense pin levels in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 PCB properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 PowerSSO-16 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 DocID018823 Rev 9 VND7040AJ-E List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Current sense precision vs. IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Switching times and Pulse skew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 MultiSense timings (current sense mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 MultiSense timings (chip temperature and VCC sense mode) . . . . . . . . . . . . . . . . . . . . . . 20 TDSTKON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Latch functionality - behavior in hard short circuit condition (TAMB —$@ 9LO/9)5/96(//96(Q/>9@                                         7>ƒ&@ 7>ƒ&@ ("1($'5 DocID018823 Rev 9 ("1($'5 25/48 47 Electrical specification VND7040AJ-E Figure 21. Low level logic input current Figure 22. Logic Input hysteresis voltage 9L K\VW 9)5 K\VW 96(/ K\VW 96(Q K\VW >9@ ,L/,)5/,6(//,6(Q/>—$@                                         7>ƒ&@ 7>ƒ&@ ("1($'5 ("1($'5 Figure 23. FaultRST Input clamp voltage Figure 24. Undervoltage shutdown 986'>9@ 9)5&/>9@     ,LQ P$            ,LQ P$                         7>ƒ&@ 7>ƒ&@ ("1($'5 ("1($'5 Figure 25. On-state resistance vs. Tcase Figure 26. On-state resistance vs. VCC 5RQ>P2KP@ 5RQ>P2KP@       7  ƒ&  7  ƒ&  ,RXW $ 9FF 9      7  ƒ&   7  ƒ&                         9FF>9@ 7>ƒ&@ ("1($'5 26/48  DocID018823 Rev 9 ("1($'5 VND7040AJ-E Electrical specification Figure 27. Turn-on voltage slope Figure 28. Turn-off voltage slope G9RXWGW 2Q>9—V@ G9RXWGW 2II>9—V@       9FF 9 5O ȍ  9FF 9 5O ȍ                               7>ƒ&@      7>ƒ&@ ("1($'5 ("1($'5 Figure 30. Woff vs. Tcase Figure 29. Won vs. Tcase :RQ>P-@ :RII>P-@                                     7>ƒ&@       7>ƒ&@ ("1($'5 ("1($'5 Figure 31. ILIMH vs. Tcase Figure 32. OFF-state open-load voltage detection threshold ,OLPK>$@  92/>9@      9FF 9                     7>ƒ&@  ("1($'5          7>ƒ&@ ("1($'5 DocID018823 Rev 9 27/48 47 Electrical specification VND7040AJ-E Figure 33. Vsense clamp vs. Tcase Figure 34. Vsenseh vs. Tcase 96(16(+>9@ 96(16(B&/>9@        ,LQ P$             ,LQ P$                 ("1($'5 28/48         7>ƒ&@ 7>ƒ&@ DocID018823 Rev 9 ("1($'5 VND7040AJ-E 3 Protections 3.1 Power limitation Protections The basic working principle of this protection consists of an indirect measurement of the junction temperature swing ΔTj through the direct measurement of the spatial temperature gradient on the device surface in order to automatically shut off the output MOSFET as soon as ΔTj exceeds the safety level of ΔTj_SD. According to the voltage level on the FaultRST pin, the output MOSFET switches on and cycles with a thermal hysteresis according to the maximum instantaneous power which can be handled (FaultRST = Low) or remains off (FaultRST = High). The protection prevents fast thermal transient effects and, consequently, reduces thermo-mechanical fatigue. 3.2 Thermal shutdown In case the junction temperature of the device exceeds the maximum allowed threshold (typically 175°C), it automatically switches off and the diagnostic indication is triggered. According to the voltage level on the FaultRST pin, the device switches on again as soon as its junction temperature drops to TR (see Table 8, FaultRST = Low) or remains off (FaultRST = High). 3.3 Current limitation The device is equipped with an output current limiter in order to protect the silicon as well as the other components of the system (e.g. bonding wires, wiring harness, connectors, loads, etc.) from excessive current flow. Consequently, in case of short circuit, overload or during load power-up, the output current is clamped to a safety level, ILIMH, by operating the output power MOSFET in the active region. 3.4 Negative voltage clamp In case the device drives inductive load, the output voltage reaches negative value during turn off. A negative voltage clamp structure limits the maximum negative voltage to a certain value, VDEMAG (see Table 8), allowing the inductor energy to be dissipated without damaging the device. DocID018823 Rev 9 29/48 47 Application information 4 VND7040AJ-E Application information Figure 35. Application diagram +5V VDD OUT V CC Rprot OUT FaultRST INPUT Rprot OUT Logic OUT Dld Rprot SEn Rprot SEL OUTPUT Rprot ADC in Multisense Current mirror GND Cext Rsense OUT R GND D GND GND GND GND GND GND 4.1 GND protection network against reverse battery Figure 36. Simplified internal structure 9 9FF 5SURW 5SURW ,1387 6(Q 0&8 'OG 5SURW )DXOW567 287387 5SURW 0XOWLVHQVH *1' 5VHQVH ' *1' 5 *1' *1' *$3*&)7 30/48 DocID018823 Rev 9 GND VND7040AJ-E 4.1.1 Application information Diode (DGND) in the ground line A resistor (typ. RGND = 4.7 kΩ) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (≈600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network. 4.2 Immunity against transient electrical disturbances The immunity of the device against transient electrical emissions, conducted along the supply lines and injected into the VCC pin, is tested in accordance with ISO7637-2:2011 (E) and ISO 16750-2:2010. The related function performance status classification is shown in Table 12. Test pulses are applied directly to DUT (Device Under Test) both in ON and OFF-state and in accordance to ISO 7637-2:2011(E), chapter 4. The DUT is intended as the present device only, without components and accessed through VCC and GND terminals. Status II is defined in ISO 7637-1 Function Performance Status Classification (FPSC) as follows: “The function does not perform as designed during the test but returns automatically to normal operation after the test”. Table 12. ISO 7637-2 - electrical transient conduction along supply line Test Pulse 2011(E) Test pulse severity level with Status II functional performance status Minimum number of pulses or test time Burst cycle / pulse repetition time Pulse duration and pulse generator internal impedance Level US(1) 1 III -112V 500 pulses 0,5 s 2a III +55V 500 pulses 0,2 s 5s 50μs, 2Ω 3a IV -220V 1h 90 ms 100 ms 0.1μs, 50Ω 3b IV +150V 1h 90 ms 100 ms 0.1μs, 50Ω 4(2) IV -7V 1 pulse min max 2ms, 10Ω 100ms, 0.01Ω Load dump according to ISO 16750-2:2010 Test B(3) 40V 5 pulse 1 min 400ms, 2Ω 1. US is the peak amplitude as defined for each test pulse in ISO 7637-2:2011(E), chapter 5.6. 2. Test pulse from ISO 7637-2:2004(E). 3. With 40 V external suppressor referred to ground (-40°C < Tj < 150°C). DocID018823 Rev 9 31/48 47 Application information 4.3 VND7040AJ-E MCU I/Os protection If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line both to prevent the microcontroller I/O pins to latch-up and to protect the HSD inputs. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. Equation 1 VCCpeak/Ilatchup ≤ Rprot ≤ (VOHμC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = -150 V; Ilatchup ≥ 20mA; VOHμC ≥ 4.5V 7.5 kΩ ≤ Rprot ≤ 140 kΩ. Recommended values: Rprot = 15 kΩ 4.4 Multisense - analog current sense Diagnostic information on device and load status are provided by an analog output pin (Multisense) delivering the following signals: • Current monitor: current mirror of channel output current • VCC monitor: voltage propotional to VCC • TCASE: voltage propotional to chip temperature Those signals are routed through an analog multiplexer which is configured and controlled by means of SELx and SEn pins, according to the address map in Table 11. 32/48 DocID018823 Rev 9 VND7040AJ-E Application information VCC Figure 37. Multisense and diagnostic – block diagram Internal Supply VCC – GND Clamp Undervoltage shut-down Control & Diagnostic VCC – OUT Clamp FaultRST INPUT Gate Driver VCC T SEL1 SEL0 VON Limitation VCC SEn Current Limitation MONITOR MultiSense MUX ISENSE RPROT TEMP Fault Diagnostic Power Limitation Overtemperature Temp MONITOR Short to VCC Open-Load in OFF To uC ADC K factor RSENSE Current Sense CURRENT MONITOR Fault IOUT OUT VSENSEH GND DocID018823 Rev 9 33/48 47 Application information 4.4.1 VND7040AJ-E Principle of Multisense signal generation Figure 38. Multisense block diagram 9FF ).054 6HQVH026 0DLQ026 287 &XUUHQWVHQVH 9EDW0RQLWRU 7HPSHUDWXUHPRQLWRU 0XOWLVHQVH6ZLWFK%ORFN )DXOW 08/7,6(16( 7RX&$'& 53527 56(16( *$3*&)7 Current monitor When current mode is selected in the Multisense, this output is capable to provide: • Current mirror proportional to the load current in normal operation, delivering current proportional to the load according to known ratio named K • Diagnostics flag in fault conditions delivering fixed voltage VSENSEH The current delivered by the current sense circuit, ISENSE, can be easily converted to a voltage VSENSE by using an external sense resistor, RSENSE, allowing continuous load monitoring and abnormal condition detection. Normal operation (channel ON, no fault, SEn active) While device is operating in normal conditions (no fault intervention), VSENSE calculation can be done using simple equations Current provided by Multisense output: ISENSE = IOUT/K 34/48 DocID018823 Rev 9 VND7040AJ-E Application information Voltage on RSENSE: VSENSE = RSENSE . ISENSE = RSENSE . IOUT/K Where : • VSENSE is voltage measurable on RSENSE resistor • ISENSE is current provided from Multisense pin in current output mode • IOUT is current flowing through output • K factor represent the ratio between PowerMOS cells and SenseMOS cells; its spread includes geometric factor spread, current sense amplifier offset and process parameters spread of overall circuitry specifying ratio between IOUT and ISENSE. Failure flag indication In case of power limitation/overtemperature, the fault is indicated by the Multisense pin which is switched to a “current limited” voltage source, VSENSEH (see Table 9). In any case, the current sourced by the Multisense in this condition is limited to ISENSEH (see Table 9). The typical behavior in case of overload or hard short circuit is shown in Figure 10, Figure 11 and Figure 12. Figure 39. Analogue HSD – open-load detection in off-state 9 9EDW 9EDW Q) 9 Q) 5SXOOXS *1' 0LFURFRQWUROOHU *1' 9 && 9'' )DXOW567 287 N ,1387 ([WHUQDO 3XOO 8S VZLWFK 287 /RJLF N 6(Q 287 6(/ N 287387 287387 0XOWLVHQVH 287 &X UUHQWPLUURU N *1' $'&LQ N 5VHQVH 5 *1 ' N '*1 ' Q) 9 287 N *1' *1' &(;7 *1' *1' DocID018823 Rev 9 *1' *1' *$3*&)7 35/48 47 Application information VND7040AJ-E Figure 40. Open-load / short to VCC condition 9,1 96(16( 3XOOXSFRQQHFWHG 96(16(+ 2SHQORDG 96(16(  96(16( 3XOOXS GLVFRQQHFWHG W'67.21 6KRUWWR9&& 96(16(+ *$3*&)7 Table 13. Multisense pin levels in off-state Condition Output VOUT > VOL Open-load VOUT < VOL 4.4.2 Short to VCC VOUT > VOL Nominal VOUT < VOL Multisense SEn Hi-Z L VSENSEH H Hi-Z L 0 H Hi-Z L VSENSEH H Hi-Z L 0 H TCASE and VCC monitor In this case, MultiSense output operates in voltage mode and output level is referred to device GND. Care must be taken in case a GND network protection is used, because of a voltage shift is generated between device GND and the microcontroller input GND reference. Figure 41 shows link between VMEASURED and real VSENSE signal. 36/48 DocID018823 Rev 9 VND7040AJ-E Application information Figure 41. GND voltage shift 9%$7 Q)9 0XOWLVHQVHYROWDJHPRGH 96(16(+ 9&&PRQLWRU 7&$6(PRQLWRU )DXOW567 9&& ,1 6(Q 287 6(/ 6(/ 53527 90($685(' 56(16( 93527 96(16( 0XOWLVHQVH 7RX&$'& *1' 53527 N '*1' '!0'#&4 VCC monitor Battery monitoring channel provides VSENSE = VCC / 4. Case temperature monitor Case temperature monitor is capable to provide information about actual device temperature. Since diode is used for temperature sensing, following equation describe link between temperature and output VSENSE level: VSENSE_TC (T) = VSENSE_TC (T0) + dVSENSE_TC / dT * (T - T0) where dVSENSE_TC / dT ~ typically -5.5 mV/K (for temperature range (-40oC to +150oC). 4.4.3 Short to VCC and OFF-state open-load detection Short to VCC A short circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device off-state. Small or no current is delivered by the current sense during the on-state depending on the nature of the short circuit. OFF-state open-load with external circuitry Detection of an open-load in off mode requires an external pull-up resistor RPU connecting the output to a positive supply voltage VPU. It is preferable VPU to be switched off during the module standby mode in order to avoid the overall standby current consumption to increase in normal conditions, i.e. when load is connected. RPU must be selected in order to ensure VOUT > VOLmax in accordance with to following equation: Equation 2 R PU V –4 PU < -----------------------------------------------I L ( off2 )min @ 4V DocID018823 Rev 9 37/48 47 Application information 4.5 VND7040AJ-E Maximum demagnetization energy (VCC = 16 V) Figure 42. Maximum turn off current versus inductance 91'$- 0D[LPXPWXUQRII&XUUHQWYHUVXVLQGXFWDQFH  , $   91'$-6LQJOH3XOVH 5HSHWLWLYHSXOVH7MVWDUW ƒ& 5HSHWLWLYHSXOVH7MVWDUW ƒ&     / P+   ("1($'5 A: Tjstart = 150 °C single pulse B: Tjstart = 100 °C repetitive pulse C: Tjstart = 125 °C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: 38/48 Values are generated with RL = 0 Ω. In case of repetitive pulses, Tjstart (at the beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. DocID018823 Rev 9 VND7040AJ-E Package and PCB thermal data 5 Package and PCB thermal data 5.1 PowerSSO-16 thermal data Figure 43. PowerSSO-16 on two-layers PCB (2s0p to JEDEC JESD 51-5) ("1($'5 Figure 44. PowerSSO-16 on four-layers PCB (2s2p to JEDEC JESD 51-7) 5PQ (/%QMBOF 7$$QMBOF #PUUPN ("1($'5 Table 14. PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 77 mm x 86 mm Board material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal via separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on via 0.025 mm Footprint dimension (top layer) 2.2 mm x 3.9 mm Heatsink copper area dimension (bottom layer) DocID018823 Rev 9 Footprint, 2 cm2 or 8 cm2 39/48 47 Package and PCB thermal data VND7040AJ-E Figure 45. Rthj-amb vs PCB copper area in open box free air condition (one channel on) 57+MDPE  57+MDPE             ("1($'5 Figure 46. PowerSSO-16 thermal impedance junction ambient single pulse (one channel on) =7+ ƒ&:    &X FP &X FP &X IRRWSULQW /D\HU      7LPH V     *$3*&)7 Equation 3: pulse calculation formula Z THδ = R TH • δ+Z where δ = tP/T 40/48 DocID018823 Rev 9 THtp (1 – δ) VND7040AJ-E Package and PCB thermal data Figure 47. Thermal fitting model of a double-channel HSD in PowerSSO-16 ("1($'5 Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Table 15. Thermal parameters Area/island (cm2) Footprint 2 8 4L R1 = R7 (°C/W) 2.3 R2 = R8 (°C/W) 1.8 R3 (°C/W) 7 7 7 5 R4 (°C/W) 16 6 6 4 R5 (°C/W) 30 20 10 3 R6 (°C/W) 26 20 18 7 C1 = C7 (W.s/°C) 0.00045 C2 = C8 (W.s/°C) 0.03 C3 (W.s/°C) 0.1 C4 (W.s/°C) 0.2 0.3 0.3 0.4 C5 (W.s/°C) 0.4 1 1 4 C6 (W.s/°C) 3 5 7 18 DocID018823 Rev 9 41/48 47 Package information VND7040AJ-E 6 Package information 6.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at www.st.com. ECOPACK® is an ST trademark. 6.2 PowerSSO-16 package information Figure 48. PowerSSO-16 package dimensions  ("1($'5 42/48 DocID018823 Rev 9 VND7040AJ-E Package information Table 16. PowerSSO-16 mechanical data Millimeters Symbol Min. Typ. Max. Θ 0° Θ1 0° Θ2 5° 15° Θ3 5° 15° 8° A 1.70 A1 0.00 0.10 A2 1.10 1.60 b 0.20 0.30 b1 0.20 c 0.19 c1 0.19 D D1 0.25 0.28 0.25 0.20 0.23 4.90 BSC 3.60 4.20 e 0.50 BSC E 6.00 BSC E1 3.90 BSC E2 1.90 2.50 h 0.25 0.50 L 0.40 0.60 L1 1.00 REF N 16 R 0.07 R1 0.07 S 0.20 0.85 Tolerance of form and position aaa 0.10 bbb 0.10 ccc 0.08 ddd 0.08 eee 0.10 fff 0.10 ggg 0.15 DocID018823 Rev 9 43/48 47 Order codes 7 VND7040AJ-E Order codes Table 17. Device summary Order codes Package PowerSSO-16 44/48 Tube Tape and reel VND7040AJ-E VND7040AJTR-E DocID018823 Rev 9 VND7040AJ-E 8 Revision history Revision history Table 18. Revision history Date Revision 08-Jun-2011 1 Initial release. 2 Updated Features list Updated Table 2: Suggested connections for unused and not connected pins Updated Figure 2: Configuration diagram (top view) Table 3: Absolute maximum ratings: – ISENSE, -IOUT: updated value – VCCPK, VCCJS: added row – -VSENSE, VCC: removed row Table 5: Power section: – VUSDReset, IGND(ON): added row Updated following tables: – Table 6: Switching (VCC = 13 V; -40°C < Tj < 150°C, unless otherwise specified) – Table 7: Logic inputs (7 V < VCC < 28 V; -40°C < Tj < 150°C) Table 8: Protections (7 V < VCC < 18 V; -40°C < Tj < 150°C): – tLATCH_RST: updated typ and max values; – VDEMAG: updated test conditions Table 9: MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C): – updated several values; – VOUT_MSD, VSENSE_SAT, ISENSE_SAT, tD_OL_V: added rows Updated Figure 6: Switching times and Pulse skew Removed Figure 5: Pulse skew Added Figure 9: TDSTKON Updated Section 2.4: Waveforms Added following chapters: – Chapter 3: Protections – Chapter 4: Application information Updated Section 5.1: PowerSSO-16 thermal data 3 Table 5: Power section: – IGND(ON): Updated max value Updated Table 6: Switching (VCC = 13 V; -40°C < Tj < 150°C, unless otherwise specified) Table 9: MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C): – VSENSE_CL: updated test conditions and min value – KOL, KLED, dKLED/KLED, K0, dK0/K0, K1, dK1/K1, K2, dK2/K2, K3, dK3/K3, VSENSEH: updated values 20-Sep-2012 17-Oct-2012 Changes DocID018823 Rev 9 45/48 47 Revision history VND7040AJ-E Table 18. Revision history (continued) Date 18-Feb-2013 17-Jun-2013 46/48 Revision Changes 4 Updated Table 2: Suggested connections for unused and not connected pins and Table 4: Thermal data Table 5: Power section: – tD_STBY: updated max value Table 6: Switching (VCC = 13 V; -40°C < Tj < 150°C, unless otherwise specified): – WON, WOFF, tSKEW: updated values Table 9: MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C): – dKcal/Kcal: added row – VSENSE_TC: updated values and test conditions – VSENSE_VCC: updated test conditions Updated Table 11: MultiSense multiplexer addressing Removed following tables: Table: Electrical transient requirements (part 1/3) Table: Electrical transient requirements (part 2/3) Table: Electrical transient requirements (part 3/3) Updated Section 3.1: Power limitation, Section 3.2: Thermal shutdown, Section 3.4: Negative voltage clamp and Section 4.1.1: Diode (DGND) in the ground line Removed Section: Load dump protection Added Section 4.2: Immunity against transient electrical disturbances Updated Section 4.4.1: Principle of Multisense signal generation Updated Figure 41: GND voltage shift Added Section 4.5: Maximum demagnetization energy (VCC = 16 V) Updated Section 5.1: PowerSSO-16 thermal data 5 Table 3: Absolute maximum ratings: – VCCPK: updated parameter – -IOUT, ISENSE: updated value – EMAX: updated parameter and value Table 5: Power section: – VF: updated test conditions Table 6: Switching (VCC = 13 V; -40°C < Tj < 150°C, unless otherwise specified): – (dVOUT/dt)on, (dVOUT/dt)off, WON, WOFF: updated values Table 8: Protections (7 V < VCC < 18 V; -40°C < Tj < 150°C): – THYST, tLATCH_RST: added note Table 9: MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C): – KOL, KLED, K0, K1, K3: updated values Added Figure 4: IOUT/ISENSE versus IOUT and Figure 5: Current sense precision vs. IOUT Added Section 2.5: Electrical characteristics curves Updated Section 4.5: Maximum demagnetization energy (VCC = 16 V) and Section 6.2: PowerSSO-16 package information DocID018823 Rev 9 VND7040AJ-E Revision history Table 18. Revision history (continued) Date Revision Changes 05-Jul-2013 6 Table 9: MultiSense (7 V < VCC < 18 V; -40°C < Tj < 150°C): – K1: updated values Updated Figure 4: IOUT/ISENSE versus IOUT 20-Sep-2013 7 Updated disclaimer. 04-Jun-2014 8 Updated Section 6.2: PowerSSO-16 package information 21-Oct-2014 9 Updated Table 16: PowerSSO-16 mechanical data DocID018823 Rev 9 47/48 47 VND7040AJ-E IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 48/48 DocID018823 Rev 9
VND7040AJ-E 价格&库存

很抱歉,暂时无法提供与“VND7040AJ-E”相匹配的价格&库存,您可以联系我们找货

免费人工找货