VNI4140K, VNI4140K-32
Datasheet
Quad high-side smart power solid-state relay
Features
•
•
•
•
•
•
•
•
•
Operating output current: 0.6 A (VNI4140K) or 1.0 A (VNI4140K-32) per channel
Per channel short-circuit protection
Per channel overtemperature protection
Thermal case protection
Not simultaneous channel reactivation at Thermal case reset
All type of loads (resistive, capacitive, inductive load) are driven
Loss of GND protection
Undervoltage shutdown with hysteresis
Overvoltage protection (VCC clamping)
•
•
•
•
•
•
Very low supply current
Per channel open drain thermal fault pins
5 V and 3.3 V compatible I/Os
Fast demagnetization of inductive loads
Designed to meet IEC61131-2, IEC61000-4-4, and IEC61000-4-5
ESD according to IEC 61000-4-2 up to ±25 kV
Applications
Product status
VNI4140K
VNI4140K-32
Product label
•
•
•
Programmable logic control
Industrial PC peripheral input/output
Numerical control machines
Description
The VNI414K (for loads up to 0.6 A) and VNI4140K-32 (for loads up to 1.0 A) are
monolithic 4-channel drivers featuring very low RDS(on) and per-channel diagnostic.
The ICs, realized in STMicroelectronics™ VIPower™ technology, are intended to
drive any kind of load with one side connected to ground.
Active channel current limitation combined with thermal shutdown, independent for
each channel, and automatic restart, protect the device against overload.
A channel in an overload condition overheats and turns OFF and back ON
automatically in order to maintain its junction temperature between TTSD and TR.
If this condition makes case temperature reach TCSD, the overloaded channel is
turned OFF and restarts only when case temperature has decreased down to TCR. In
case of more than one channel in overload, restart of the overloaded channels is not
simultaneous, in order to avoid high peak current from the supply. Non-overloaded
(non-overheated) channels continue operating normally.
The four open drain STATUSX output pins indicate per-channel overtemperature
conditions.
DS13837 - Rev 1 - October 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
VNI4140K, VNI4140K-32
Block diagram
1
Block diagram
Figure 1. Block diagram
DS13837 - Rev 1
page 2/29
VNI4140K, VNI4140K-32
Pin connection
2
Pin connection
Figure 2. Pin connection (top view)
Table 1. Pin description
Pin
DS13837 - Rev 1
Name
Type
Description
1,
TAB
VCC
Supply
IC supply voltage.
2
IN1
Logic input
Channel 1 input, 3.3 V CMOS/TTL compatible.
3
STAT1
Output/Open Drain
Channel 1 overtemperature status (active low).
4
IN2
Logic input
Channel 2 input, 3.3 V CMOS/TTL compatible.
5
STAT2
Output/Open Drain
Channel 2 overtemperature status (active low).
6
GND
Ground
Device ground connection.
7
STAT3
Output/Open Drain
Channel 3 overtemperature status (active low).
8
IN3
Logic input
Channel 3 input, 3.3 V CMOS/TTL compatible.
9
STAT4
Output/Open Drain
Channel 4 overtemperature status (active low).
10
IN4
Logic input
Channel 4 input, 3.3 V CMOS/TTL compatible.
11, 12 NC
-
Not connected.
13,
14,
15
OUT4
Output
Channel 4 power stage output, internally protected.
16,
17,
18
OUT3
Output
Channel 3 power stage output, internally protected.
19,
20,
21
OUT2
Output
Channel 2 power stage output, internally protected.
22,
23,
24
OUT1
Output
Channel 1 power stage output, internally protected.
page 3/29
VNI4140K, VNI4140K-32
Maximum ratings
3
Maximum ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
VCC
Power supply voltage
IGND
DC ground reverse current
Value
Unit
-0.3 to 41
V
-250
IOUT
DC output current
IR
DC reverse output current (per channel)
IIN
Internally limited
mA
(1)
A
-5
A
Input pin current (per channel)
+/-10
mA
VIN
Input pin voltage
+VCC
V
VSTAT
Status pin voltage
+VCC
V
ISTAT
Status pin current (per pin)
+/-10
mA
VESD
Electrostatic discharge (R = 1.5k Ω; C = 100 pF)
2000
V
EAS
Single channel/single pulse avalanche energy @Tamb = 125 °C, IOUT =
0.5 A
5
J
PTOT
Power dissipation at TC = 25 °C
Internally limited (1)
W
TJ
Junction operating temperature
Internally limited (1)
°C
TSTG
Storage temperature
-55 to 150
°C
1. Protection functions are intended to avoid IC damage in fault conditions and are not intended for continuous operation.
Continuous and repetitive operation of protection functions may reduce the IC lifetime.
Table 3. Thermal data
Symbol
Rth(JC)
Rth(JA)
Parameter
Thermal resistance junction-case
(1)
Thermal resistance junction-ambient
Value
Unit
2
°C/W
See
Figure 13. RTH(JA)
vs. PCB copper area
in open box free
air condition (one
channel ON)
°C/W
1. per channel
DS13837 - Rev 1
page 4/29
VNI4140K, VNI4140K-32
Recommended operating
4
conditions
Recommended operating conditions
Table 4. Input switching limits
Symbol
FVIN(MAX)
DS13837 - Rev 1
Parameter
Maximum input switching frequency
Value
Unit
10
kHz
page 5/29
VNI4140K, VNI4140K-32
Electrical characteristics
5
Electrical characteristics
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified
5.1
Power section
Table 5. Power section
Symbol
VCC
RDS(on)
Parameter
Test conditions
Supply voltage
ON-state resistance
Min.
10.5
VCC supply current
V
0.14
VNI4140K-32,
IOUT = 0.7 A at TJ = 25 °C
0.08
VNI4140K-32, IOUT = 0.7 A
0.14
0.25
All channels in ON-state,
Clamp on VCC
IS = 20 mA
VOUT(OFF)
OFF-state output voltage
VIN = 0 V, IOUT = 0 A
IOUT(OFF)
OFF-state output current
VIN = VOUT = 0 V
41
mA
4
mA
45
52
V
1
V
5
μA
1.0
mA
0.5
mA
0
VCC = VIN = VSTAT = VGND = 24 V;
V
OUT = 0 V
VNI4140K-32 output current
at GND disconnection
Channel in ON-state (1)
Ω
2.4
VNI4140K output current at
GND disconnection
Charge pump frequency
36
VNI4140K, IOUT = 0.5 A
VCC clamp
FCP
Unit
0.08
with VIN1..4 = 5 V
ILGND
Max.
VNI4140K,
IOUT = 0.5 A at TJ = 25 °C
All channels in OFF-state
IS
Typ.
1.45
MHz
1. To cover EN55022 class A and class B normative.
5.2
Switching
Table 6. Switching
Symbol
DS13837 - Rev 1
Parameter
Test conditions
Min.
Typ.
Max.
Unit
tPD(L-H)
Turn-on delay time
-
16
35
µs
tr
Rise time
-
8
25
µs
tPD(H-L)
Turn-off delay time
-
21
36
µs
tf
Fall time
-
4
12
µs
dV(ON)/dtr
Turn-on voltage slope
-
2
-
V/µs
dV(OFF)/dtf
Turn-off voltage slope
-
4
-
V/µs
VCC = 24 V, RL = 48 Ω, input rise
time < 0.1 µs. See Figure 4. Timing in
normal operation
page 6/29
VNI4140K, VNI4140K-32
Logic inputs
Figure 3. Timing in normal operation
5.3
Logic inputs
Table 7. Logic inputs
Symbol
DS13837 - Rev 1
Parameter
VIL
Input low level voltage
VIH
Input high level voltage
VI(HYST)
Input hysteresis voltage
IIN
Input current
Test conditions
Min.
Typ.
Max.
Unit
0.8
V
2.20
V
0.15
V
VIN = 15 V
10
VIN = 36 V
210
µA
page 7/29
VNI4140K, VNI4140K-32
Protection and diagnostic
5.4
Protection and diagnostic
Table 8. Protection and diagnostic
Symbol
Test conditions
Min.
VSTAT
Status voltage output low
VUSD
Undervoltage protection
7
VUSDHYS
Undervoltage hysteresis
0.4
IPEAK
ILIM
5.5
Parameter
VNI4140K maximum DC
output current
VNI4140K-32 maximum DC
output current
VNI4140K, DC short-circuit
current
VNI4140K-32, DC shortcircuit current
Typ.
ISTAT = 1.6 mA
Max.
Unit
0.6
V
10.5
V
0.5
V
1.3
Dynamic load
A
1.6
0.7
1.0
1.7
VCC = 24 V, RLOAD = < 10 mΩ
A
1.1
VCC = VSTAT = 36 V
1.5
ILSTAT
Status leakage current
TTSD
Junction shutdown
temperature
150
TR
Junction reset temperature
135
THIST
Junction thermal hysteresis
7
15
TCSD
Case shutdown temperature
125
130
TCR
Case reset temperature
110
TCHYST
Case thermal hysteresis
7
15
VDEMAG
Output voltage at turn-OFF
VCC - 41
VCC - 45
IOUT = 0.5 A; LLOAD ≥ 1 mH
2.6
30
170
μA
190
°C
°C
°C
135
°C
°C
°C
VCC - 52
V
Current and voltage conventions
Figure 4. Current and voltage conventions
DS13837 - Rev 1
page 8/29
VNI4140K, VNI4140K-32
Truth table
6
Truth table
Table 9. Truth table
InputN
OutputN
StatusN
L
L
H
H
H
H
L
L
H
H
L
L
L
L
X
H
L
X
Output overload
L
L
H
(current limitation before overtemperature)
H
X
H
Condition
Normal operation
Overtemperature
Undervoltage
Note:
DS13837 - Rev 1
X = don't care
page 9/29
VNI4140K, VNI4140K-32
Typical application
7
circuit
Typical application circuit
Figure 5. Typical application circuit
DS13837 - Rev 1
page 10/29
VNI4140K, VNI4140K-32
Thermal management
8
Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of the device in the
application. Therefore, it must be considered very carefully. Furthermore, the available space on the PCB should
be chosen considering the power dissipation. Heat sinking can be achieved using copper on the PCB with proper
area and thickness. Two different protections have been implemented to guarantee safety of the device if it
overheats due to an overloaded condition or high environment temperature. The following flowchart explains in
detail this protection functionality.
Figure 6. Thermal behavior
Vin(i) = H
OUT(i) On
STAT(i) Off (H)
1
NO
YES
Tj(i) > Ttsd
OUT(i) Off
STAT(i) On (L)
YES
Tc > Tcsd
2
NO
4
YES
NO
Tc > Tcr
NO
3
Note:
DS13837 - Rev 1
Tj(i) > Tjr
YES
GIPG030420151405LM
1 Thermal shutdown
2 Junction hysteresis
3 Restore to idle condition
4 Case hysteresis
page 11/29
VNI4140K, VNI4140K-32
Switching waveforms
9
Switching waveforms
Figure 7. Switching waveforms
DS13837 - Rev 1
page 12/29
VNI4140K, VNI4140K-32
Pin function description
10
Pin function description
Figure 8. Input circuit
Figure 9. Status circuit
DS13837 - Rev 1
page 13/29
VNI4140K, VNI4140K-32
Pin function description
Figure 10. Charge pump switching frequency (typical) vs. temperature
DS13837 - Rev 1
page 14/29
VNI4140K, VNI4140K-32
Package and PCB thermal
11
Package and PCB thermal data
11.1
Thermal data
data
Figure 11. PCB for thermal tests
Layout condition of RTH and ZTH measurements (PCB: double layer, thermal vias, FR4 area = 77 mm x 86 mm,
PCB thickness = 1.6 mm, Cu thickness = 70 mm (front and back side), copper areas: from minimum pad layout to
8 cm2).
Figure 12. RTH(JA) vs. PCB copper area in open box free air condition (one channel ON)
DS13837 - Rev 1
page 15/29
VNI4140K, VNI4140K-32
Thermal data
Figure 13. Thermal impedance junction-ambient single pulse (one channel ON)
DS13837 - Rev 1
page 16/29
VNI4140K, VNI4140K-32
Reverse polarity protection
12
Reverse polarity protection
Reverse polarity protection can be implemented on-board using two different solutions:
1.
Placing a resistor (RGND) between IC GND pin and load GND
2.
Placing a diode between IC GND pin and load GND
If option 1 is selected, the minimum resistance value has to be selected according to the following equation:
RGND ≥ VCC / IGND
where IGND is the DC reverse ground pin current and can be found in Maximum ratings of this datasheet.
Power dissipated by RGND (when VCC < 0: during reverse polarity situations) is:
PD = (VCC)2/RGND
If option 2 is selected, the diode has to be chosen by taking into account VRRM >|VCC| and its power dissipation
capability:
PD ≥ IS*VF
Note:
In normal conditions (no reverse polarity), due to the diode, there is a voltage drop between GND of the device
and GND of the system.
Figure 14. Reverse polarity protection
+Vcc
Intputi
Outputi
Statusi
GND
Load
RGND
Diode
GIPG020420151344LM
This schematic can be used with any type of load.
DS13837 - Rev 1
page 17/29
VNI4140K, VNI4140K-32
Demagnetization energy
13
Demagnetization energy
Figure 15. Maximum demagnetization energy vs. load current, typical values
DS13837 - Rev 1
page 18/29
VNI4140K, VNI4140K-32
Package mechanical data
14
Package mechanical data
Figure 16. PowerSSO-24 package dimensions [mm]
Table 10. PowerSSO24, mechanical data
Dim.
[mm]
Min.
Max.
A
2.15
A2
2.15
a1
0
0.075
b
0.33
0.51
c
0.23
0.32
D
10.10
10.50
E
7.4
7.6
2.47
-
e
0.8
e3
8.8
2.40
G
0.1
G1
0.06
H
10.1
h
L
10.5
0.4
0.55
N
DS13837 - Rev 1
Typ.
0.85
10deg
X
4.1
4.7
Y
6.5
7.1
page 19/29
VNI4140K, VNI4140K-32
Package mechanical data
Figure 17. PowerSSO24 suggested footprint [mm]
STMicroelectronics is not responsible for any PCB related issues. The footprint shown in the above figure is a
suggestion which might not be in line with the customer PCB supplier design rules.
DS13837 - Rev 1
page 20/29
VNI4140K, VNI4140K-32
PowerSSO24, packing information
15
PowerSSO24, packing information
Figure 18. PowerSSO-24 tube shipment (no suffix)
Table 11. PowerSSO24, tube shipment information
Note:
Description
Value
Base quantity
49
Bulk quantity
1225
Tube lenght (± 0.5)
532
A
3.5
B
13.8
C (± 0.1)
0.6
All dimensions are in mm.
Figure 19. PowerSSO24, reel shipment
DS13837 - Rev 1
page 21/29
VNI4140K, VNI4140K-32
PowerSSO24, packing information
Table 12. PowerSSO24, reel information
Description
Note:
Value
Base quantity
1000
Bulk quantity
1000
A (max.)
330
B (min.)
1.5
C (± 0.2)
13
F
20.2
G (2 ± 0)
24.4
N (min.)
100
T (max.)
30.4
All dimensions are in mm.
Figure 20. PowerSSO24, tape drawings
Table 13. PowerSSO24, tape dimension
DS13837 - Rev 1
Description
Symbol
Value
Tape width
W
24
Tape hole spacing
P0 (± 0.1)
4
Component spacing
P
12
page 22/29
VNI4140K, VNI4140K-32
PowerSSO24, packing information
Description
Symbol
Value
Hole diameter
D (± 0.05)
1.55
Hole diameter
D1 (min.)
1.5
Hole position
F (± 0.1)
11.5
Compartment depth
K (max.)
2.85
Hole spacing
P1 (± 0.1)
2
Note:
All dimensions are in mm.
Note:
According to the Electronic Industries Association (EIA) standard 481 rev. A, Feb 1986.
DS13837 - Rev 1
page 23/29
VNI4140K, VNI4140K-32
Ordering information
16
Ordering information
Table 14. Order codes
Order code
Package
VNI4140K
VNI4140KTR
VNI4140K-32
VNI4140KTR-32
DS13837 - Rev 1
Package marking
VNI4140K
PowerSSO-24
VNI4140K-32
Packaging
Tube
Tape and reel
Tube
Tape and reel
page 24/29
VNI4140K, VNI4140K-32
Revision history
Table 15. Document revision history
DS13837 - Rev 1
Date
Version
05-Oct-2021
1
Changes
Initial release.
page 25/29
VNI4140K, VNI4140K-32
Contents
Contents
1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
4
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.2
Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.3
Logic inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.4
Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.5
Current and voltage conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
7
Typical application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
8
Thermal management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9
Switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10
Pin function description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
11
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
11.1
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
12
Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
13
Demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
14
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
15
PowerSSO24, packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
16
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
DS13837 - Rev 1
page 26/29
VNI4140K, VNI4140K-32
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Pin description . . . . . . . . . . . . . . . . . .
Absolute maximum ratings . . . . . . . . . .
Thermal data. . . . . . . . . . . . . . . . . . . .
Input switching limits . . . . . . . . . . . . . .
Power section . . . . . . . . . . . . . . . . . . .
Switching . . . . . . . . . . . . . . . . . . . . . .
Logic inputs. . . . . . . . . . . . . . . . . . . . .
Protection and diagnostic . . . . . . . . . . .
Truth table . . . . . . . . . . . . . . . . . . . . .
PowerSSO24, mechanical data . . . . . . .
PowerSSO24, tube shipment information
PowerSSO24, reel information. . . . . . . .
PowerSSO24, tape dimension . . . . . . .
Order codes . . . . . . . . . . . . . . . . . . . .
Document revision history . . . . . . . . . . .
DS13837 - Rev 1
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. 3
. 4
. 4
. 5
. 6
. 6
. 7
. 8
. 9
19
21
22
22
24
25
page 27/29
VNI4140K, VNI4140K-32
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
DS13837 - Rev 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing in normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current and voltage conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switching waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Status circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charge pump switching frequency (typical) vs. temperature . . . . . . . . . . . . .
PCB for thermal tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTH(JA) vs. PCB copper area in open box free air condition (one channel ON)
Thermal impedance junction-ambient single pulse (one channel ON). . . . . . .
Reverse polarity protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum demagnetization energy vs. load current, typical values. . . . . . . . .
PowerSSO-24 package dimensions [mm] . . . . . . . . . . . . . . . . . . . . . . . . .
PowerSSO24 suggested footprint [mm] . . . . . . . . . . . . . . . . . . . . . . . . . . .
PowerSSO-24 tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . .
PowerSSO24, reel shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PowerSSO24, tape drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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. 2
. 3
. 7
. 8
10
11
12
13
13
14
15
15
16
17
18
19
20
21
21
22
page 28/29
VNI4140K, VNI4140K-32
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
DS13837 - Rev 1
page 29/29