VNLD5160TR-E

VNLD5160-E OMNIFET III fully protected low-side driver for automotive applications Datasheet - production data Description The VNLD5160-E is a monolithic device made using STMicroelectronics® VIPower® technology, intended for driving resistive or inductive loads with one side connected to the battery. Built-in thermal shutdown protects the chip from overtemperature and short-circuit. Output current limitation protects the device in an overload condition. In case of long duration overload, the device limits the dissipated power to a safe level up to thermal shutdown intervention.Thermal shutdown, with automatic restart, allows the device to recover normal operation as soon as a fault condition disappears. Fast demagnetization of inductive loads is achieved at turn-off. SO-8 Features Type Vclamp RDS(on) ID VNLD5160-E 41 V 160 m 3.5 A  AEC-Q100 qualified  Drain current: 3.5 A  ESD protection  Overvoltage clamp  Thermal shutdown  Current and power limitation  Very low standby current  Very low electromagnetic susceptibility  Compliant with European directive 2002/95/EC  Specially intended for R10W or 2xR5W automotive signal lamps Table 1. Devices summary Order codes Package SO-8 October 2017 This is information on a product in full production. Tube Tape and reel VNLD5160-E VNLD5160TR-E DocID027681 Rev 3 1/20 www.st.com Contents VNLD5160-E Contents 1 Block diagrams and pins configurations . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 5 6 2/20 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 DocID027681 Rev 3 VNLD5160-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PowerMOS section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Input section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Switching characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 DocID027681 Rev 3 3/20 3 List of figures VNLD5160-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 4/20 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Configuration diagrams (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 13 SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal fitting model of a LSD in SO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 SO-8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 DocID027681 Rev 3 VNLD5160-E 1 Block diagrams and pins configurations Block diagrams and pins configurations Figure 1. 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DI /2*,& 2))6WDWH 2SHQORDG &XUUHQW /LPLWDWLRQ 3RZHU &ODPS ,196833/ 20 mA  VOHμC > 4.5 V  35  Rprot  100 K Then, the recommended value is Rprot = 10 K Figure 6 shows the turn-off current drawn during the demagnetization. Figure 6. Maximum demagnetization energy (VCC = 13.5 V) 91/'[0D[LPXPWXUQRIIFXUUHQWYHUVXVLQGXFWDQFH ,$   91/'[6LQJOH3XOVH  5HSHWLWLYHSXOVH7MVWDUW ƒ& 5HSHWLWLYHSXOVH7MVWDUW ƒ&    /P+  91/'[0D[LPXPWXUQRII(QHUJ\YHUVXV7GHPDJ (>P-@  91/'[6LQJOH3XOVH    5HSHWLWLYHSXOVH7MVWDUW ƒ& 5HSHWLWLYHSXOVH7MVWDUW ƒ&    7GHPDJ>PV@  ("1($'5 1. Values are generated with RL = 0. In case of repetitive pulses, Tjstart (at the beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B 12/20 DocID027681 Rev 3 VNLD5160-E Package and PC board thermal data 4 Package and PC board thermal data 4.1 SO-8 thermal data Figure 7. SO-8 PC board ("1($'5 1. Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%; Board double layer; Board dimension 78 mm x 86 mm; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm). Figure 8. Rthj-amb vs PCB copper area in open box free air condition 57+MDPE             1$#
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MBZPVU ("1($'5 DocID027681 Rev 3 13/20 19 Package and PC board thermal data VNLD5160-E Figure 9. SO-8 thermal impedance junction ambient single pulse =7+ƒ&:  &X IRRWSULQW &X FP          7LPHV ("1($'5 Equation 2: pulse calculation formula Z TH = R TH   + Z THtp  1 –   where  = tP/T Figure 10. Thermal fitting model of a LSD in SO-8 ("1($'5 Note: 14/20 The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. DocID027681 Rev 3 VNLD5160-E Package and PC board thermal data Table 13. Thermal parameters Area/island (cm2) Footprint 2 R1 = R7 (°C/W) 1 1 R2 = R8 (°C/W) 2 2 R3 = R9 (°C/W) 3.5 3.5 R4 = R10 (°C/W) 34 25 R5 (°C/W) 36 20 R6 (°C/W) 35 27 C1 = C7 (W.s/°C) 0.00005 0.00005 C2 = C8 (W.s/°C) 0.002 0.002 C3 = C9 (W.s/°C) 0.005 0.005 C4 = C10 (W.s/°C) 0.02 0.02 C5 (W.s/°C) 0.15 0.15 C6 (W.s/°C) 2.5 3.5 DocID027681 Rev 3 15/20 19 Package and packing information 5 VNLD5160-E Package and packing information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 5.1 SO-8 package information Figure 11. SO-8 package outline ("1($'5 16/20 DocID027681 Rev 3 VNLD5160-E Package and packing information Table 14. SO-8 mechanical data Millimeters Symbol Min. Typ. A Max. 1.75 A1 0.10 A2 1.25 b 0.28 0.48 c 0.17 0.23 D(1) 4.80 4.90 5.00 E 5.80 6.00 6.20 E1(2) 3.80 3.90 4.00 e 0.25 1.27 h 0.25 0.50 L 0.40 1.27 L1 k 1.04 0° ccc 8° 0.10 1. Dimensions D does not include mold flash, protrusions or gate burrs. Mold flash, potrusions or gate burrs shall not exceed 0.15 mm in total (both side). 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. DocID027681 Rev 3 17/20 19 Package and packing information 5.2 VNLD5160-E SO-8 packing information Figure 12. SO-8 tube shipment (no suffix) B Base q.ty Bulk q.ty Tube length (± 0.5) A B C (± 0.1) C A 100 2000 532 3.2 6 0.6 All dimensions are in mm. Figure 13. SO-8 tape and reel shipment (suffix “TR”) Reel dimensions Base q.ty Bulk q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4 All dimensions are in mm. Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape hole spacing Component spacing Hole diameter Hole diameter Hole position Compartment depth Hole spacing W P0 (± 0.1) P D (+ 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 12 4 8 1.5 1.5 5.5 4.5 2 All dimensions are in mm. End Start Top cover tape No components Components Empty components pockets saled with cover tape. User direction of feed 18/20 DocID027681 Rev 3 No components 500mm min 500mm min VNLD5160-E 6 Revision history Revision history Table 15. Document revision history Date Revision Changes 02-Apr-2015 1 Initial release. 14-Sep-2015 2 Updated Table 5: Thermal data Updated Chapter 4: Package and PC board thermal data 26-Oct-2017 3 Added in cover page “automotive” word in the title and the icon of the car. Updated Features on page 1. DocID027681 Rev 3 19/20 19 VNLD5160-E IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 20/20 DocID027681 Rev 3