VNQ600AP

® P VNQ600AP QUAD CHANNEL HIGH SIDE SOLID STATE RELAY TYPE VNQ600AP (*) Per each channel RDS(on) (*) 35mΩ Ilim 22A VCC 36 V DC SHORT CIRCUIT CURRENT: 22A s CMOS COMPATIBLE INPUTS s PROPORTIONAL LOAD CURRENT SENSE s UNDERVOLTAGE & OVERVOLTAGE nSHUT-DOWN s O VERVOLTAGE CLAMP s T HERMAL SHUT-DOWN s CURRENT LIMITATION s VERY LOW STAND-BY POWER DISSIPATION s PROTECTION AGAINST: nLOSS OF GROUND & LOSS OF VCC s REVERSE BATTERY PROTECTION (**) s SO-28 (DOUBLE ISLAND) ORDER CODES PACKAGE SO-28 TUBE VNQ600AP T&R VNQ600AP13TR DESCRIPTION The VNQ600AP is a quad HSD formed by ABSOLUTE MAXIMUM RATING Symbol VCC -VCC IOUT IR IIN VCSENSE IGND assembling two VND600 chips in the same SO-28 package. The VND600 is a monolithic device designed in| STMicroelectronics VIPower M0-3 Technology. The VNQ600A is intended for driving any type of multiple loads with one side connected to ground. This device has four independent channels and four analog sense outputs which deliver currents proportional to the outputs currents. Active current limitation combined with thermal shut-down and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. Parameter Supply voltage (continuous) Reverse supply voltage (continuous) Output current (continuous), for each channel Reverse output current (continuous), for each channel Input current Current sense maximum voltage Ground current at Tpins < 25°C (continuous) Electrostatic Discharge (Human Body Model: R=1.5KΩ; C=100pF) - INPUT - CURRENT SENSE - OUTPUT - VCC Maximum Switching Energy (L=0.11mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=40A) Power dissipation (per island) at Tlead=25°C Junction operating temperature Storage temperature Value 41 -0.3 15 -15 +/- 10 -3 +15 -200 4000 2000 5000 5000 126 6.25 Internally Limited -55 to 150 Unit V V A A mA V V mA V V V V mJ W °C °C VESD EMAX Ptot Tj Tstg (**) See application schematic at page 9. April 2004 1/18 VNQ600AP BLOCK DIAGRAM VCC 1,2 OVERVOLTAGE UNDERVOLTAGE DEMAG 1 DRIVER 1 OUTPUT 1 ILIM1 INPUT 1 LOGIC INPUT 2 GND 1,2 OVERTEMP. 1 OVERTEMP. 2 IOUT2 DRIVER 2 IOUT1 K CURRENT SENSE 1 OUTPUT 2 DEMAG 2 ILIM2 K CURRENT SENSE 2 OVERVOLTAGE UNDERVOLTAGE DEMAG 3 DRIVER 3 VCC 3,4 OUTPUT 3 ILIM3 INPUT 3 LOGIC INPUT 4 GND 3,4 OVERTEMP. 3 OVERTEMP. 4 IOUT4 DRIVER 4 IOUT3 K CURRENT SENSE 3 OUTPUT 4 DEMAG 4 ILIM4 K CURRENT SENSE 4 2/18 VNQ600AP CURRENT AND VOLTAGE CONVENTIONS IS1,2 IS3,4 VCC1,2 VCC3,4 IOUT1 OUTPUT1 IOUT2 OUTPUT2 OUTPUT3 IOUT3 IOUT4 OUTPUT4 VOUT4 GND3,4 IGND1,2 VOUT3 VOUT1 VOUT2 VCC1,2 IIN1 VIN1 VSENSE1 VIN2 VSENSE2 VIN3 ISENSE1 IIN2 ISENSE2 IIN3 ISENSE3 INPUT1 CUR. SENSE1 INPUT2 CUR. SENSE2 INPUT3 CUR. SENSE3 INPUT4 CUR. SENSE4 GND1,2 VCC3,4 VSENSE3 IIN4 VIN4 ISENSE4 VSENSE4 IGND3,4 CONNECTION DIAGRAM (TOP VIEW) VCC1,2 GND 1,2 INPUT2 INPUT1 CURRENT SENSE 1 CURRENT SENSE 2 VCC1,2 VCC3,4 GND 3,4 INPUT4 INPUT3 CURRENT SENSE 3 CURRENT SENSE 4 VCC3,4 1 28 VCC1,2 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 3 OUTPUT 3 OUTPUT 3 OUTPUT 4 OUTPUT 4 OUTPUT 4 14 15 VCC3,4 3/18 VNQ600AP THERMAL DATA (Per island) Symbol Rthj-lead Rthj-amb Rthj-amb Parameter Thermal resistance Junction-lead Thermal resistance Junction-ambient (one chip ON) Thermal resistance Junction-ambient (two chips ON) Value 20 60 (*) 46 (*) Unit °C/W °C/W °C/W (*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. ELECTRICAL CHARACTERISTICS (8V