VNQ810
Quad channel high side driver
Features
Type
RDS(on)
IOUT
VCC
VNQ810
160mΩ(1)
3.5A(1)
36V
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1. Per each channel.
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SO-28 (double island)
■
CMOS compatible inputs
■
Open Drain status outputs
■
On state open load detection
■
Off state open load detection
■
Shorted load protection
■
Undervoltage and overvoltage shutdown
■
Loss of ground protection
■
Very low standby current
■
Reverse battery protection(a)
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Description
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The VNQ810 is a quad HSD formed by
assembling two VND810 chips in the same SO-28
package. The VND810 is a monolithic device
made using| STMicroelectronics VIPower M0-3
Technology. The VNQ830 is intended for driving
any type of multiple load with one side connected
to ground.
The Active VCC pin voltage clamp protects the
device against low energy spikes (see ISO7637
transient compatibility table). Active current
limitation combined with thermal shutdown and
automatic restart protects the device against
overload. The device detects the open load
condition in both the on and off state.
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In the off state the device detects if the output is
shorted to VCC. The device automatically turns off
in the case where the ground pin becomes
disconnected.
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a. See Application schematic on page 18
Table 1.
Device summary
Order codes
Package
SO-28 (double island)
September 2013
Tube
Tape and reel
VNQ810
VNQ81013TR
Rev 4
1/28
www.st.com
28
Contents
VNQ810
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
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3.1.1
Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 18
3.1.2
Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 19
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Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3
MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.4
Open load detection in off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5
Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . . 21
)
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Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5
SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
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Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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2/28
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GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 18
3.2
4.1
6
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5.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2
SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
VNQ810
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Openload detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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3/28
List of figures
VNQ810
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
On state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
On state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Openload On state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Openload Off state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Openload detection in Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 23
Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Thermal fitting model of a quad channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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VNQ810
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
VCC1,2
Vcc
OVERVOLTAGE
CLAMP
UNDERVOLTAGE
GND1,2
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CLAMP 1
OUTPUT1
INPUT1
DRIVER 1
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CLAMP 2
STATUS1
CURRENT LIMITER 1
Pr
DRIVER 2
LOGIC
OVERTEMP. 1
OPENLOAD ON 1
ete
OUTPUT2
CURRENT LIMITER 2
INPUT2
ol
OPENLOAD OFF 1
STATUS2
)
(s
OVERTEMP. 2
Vcc
CLAMP
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GND3,4
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INPUT3
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OPENLOAD ON 2
OPENLOAD OFF 2
VCC3,4
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 3
OUTPUT3
DRIVER 3
CLAMP 4
STATUS3
CURRENT LIMITER 3
LOGIC
DRIVER 4
OUTPUT4
OVERTEMP. 3
OPENLOAD ON 3
CURRENT LIMITER 4
INPUT4
OPENLOAD OFF 3
OPENLOAD ON 4
STATUS4
OPENLOAD OFF 4
OVERTEMP. 4
5/28
Block diagram and pin description
Figure 2.
VNQ810
Configuration diagram (top view)
VCC1,2
1
VCC1,2
28
GND 1,2
OUTPUT1
INPUT1
OUTPUT1
STATUS1
OUTPUT1
STATUS2
OUTPUT2
INPUT2
OUTPUT2
VCC1,2
OUTPUT2
VCC3,4
OUTPUT3
GND 3,4
OUTPUT3
INPUT3
OUTPUT3
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OUTPUT4
STATUS3
STATUS4
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INPUT4
VCC3,4
Table 2.
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Floating
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To ground
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OUTPUT4
OUTPUT4
VCC3,4
Suggested connections for unused and not connected pins
Connection / pin
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Status
N.C.
Output
Input
X
X
X
X
X
Through 10KΩ
resistor
VNQ810
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3.
Symbol
VCC
Parameter
Reverse DC supply voltage
- IGND
DC reverse ground pin current
- IOUT
IIN
du
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DC output current
DC input current
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DC Status current
VESD
Electrostatic discharge (human body model: R=1.5KΩ;
C = 100pF)
- INPUT
- STATUS
- OUTPUT
- VCC
)
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Maximum switching energy
(L = 2.5mH; RL = 0Ω; Vbat = 13.5V; Tjstart = 150ºC; IL = 9A)
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Reverse DC output current
ISTAT
EMAX
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Value
DC supply voltage
- VCC
IOUT
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Absolute maximum ratings
Power dissipation (per island) at Tlead = 25°C
Junction operating temperature
Storage temperature
Unit
V
- 0.3
V
- 200
mA
Internally limited
A
-6
A
+/- 10
mA
+/- 10
mA
4000
4000
5000
5000
V
V
V
V
23
mJ
6.25
W
Internally limited
°C
- 55 to 150
°C
7/28
Electrical specifications
2.2
VNQ810
Thermal data
Table 4.
Thermal data (per island)
Symbol
Parameter
Value
Unit
20
°C/W
Rthj-lead
Thermal resistance junction-lead
Rthj-amb
Thermal resistance junction-ambient
(one chip ON)
60(1)
44(2)
°C/W
Rthj-amb
Thermal resistance junction-ambient
(two chips ON)
46(1)
31(2)
°C/W
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected
to all VCC pins. Horizontal mounting and no artificial air flow.
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2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow.
2.3
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Electrical characteristics
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Values specified in this section are for 8V < VCC < 36V; -40°C < Tj < 150°C, unless
otherwise stated.
Figure 3.
Current and voltage conventions
IS3,4
)-
VCC3,4
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IIN1
ISTAT1
VIN1
IIN2
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VSTAT1
VIN2
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Note:
8/28
ISTAT2
IIN3
VSTAT2
ISTAT3
VIN3
VSTAT3
IIN4
VIN4 ISTAT4
VSTAT4
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VCC3,4
IS1,2
VCC1,2
VF1 (*)
INPUT1
STATUS1
IOUT1
OUTPUT1
OUTPUT2
INPUT4
VOUT2
IOUT3
INPUT3
STATUS3
VOUT1
IOUT2
INPUT2
STATUS2
VCC1,2
OUTPUT3
IOUT4
OUTPUT4
STATUS4
GND3,4
VOUT4
GND1,2
IGND3,4
VFn = VCCn - VOUTn during reverse battery condition.
IGND1,2
VOUT3
VNQ810
Electrical specifications
Table 5.
Power output
Symbol
Parameter
VCC
Operating supply
voltage
VUSD
Test conditions
Min.
5.5
13
36
V
Undervoltage shutdown
3
4
5.5
V
VOV
Overvoltage shutdown
36
RON
On state resistance
IS
160
320
mΩ
mΩ
40
µA
12
25
µA
5
7
mA
0
50
µA
-75
0
µA
VIN = VOUT = 0V; VCC = 13V;
Tj = 125°C
5
µA
VIN = VOUT = 0V; VCC = 13V;
Tj =25°C
3
µA
12
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Off State; VCC = 13V;
VIN = VOUT = 0V;
Tj = 25°C
Supply current
Off state output current VIN = VOUT = 0V
IL(off2)
Off state output current VIN = 0V; VOUT = 3.5V
IL(off3)
Off state output current
IL(off4)
Off state output current
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Min.
Typ.
Max.
Unit
Parameter
Test conditions
Shutdown temperature
150
175
200
°C
TR
Reset temperature
135
Thyst
Thermal hysteresis
7
tSDL
Status delay in overload
conditions
Ilim
Current limitation
P
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TTSD
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Vdemag
Note:
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Protections
Symbol
O
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IL(off1)
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On State; VCC = 13V; VIN = 5V;
IOUT = 0A
Table 6.
V
IOUT = 1A; Tj = 25°C
IOUT = 1A; VCC > 8V
Off State; VCC = 13V;
VIN = VOUT = 0V
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Typ. Max. Unit
Turn-off output clamp
voltage
°C
15
Tj > TTSD
VCC = 13V
5.5V < VCC < 36V
IOUT = 1A; L = 6mH
3.5
5
°C
20
µs
7.5
7.5
A
A
VCC - VCC - VCC 41
48
55
V
To ensure long term reliability under heavy overload or short circuit conditions, protection
and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.
9/28
Electrical specifications
Table 7.
VNQ810
VCC - output diode
Symbol
Parameter
Test conditions
VF
Forward on voltage
- IOUT = 0.5A; Tj = 150°C
Table 8.
Min.
Parameter
Test conditions
Min.
Typ.
td(on)
Turn-on delay time
RL = 13Ω from VIN rising edge
to VOUT = 1.3V (see Figure 5)
30
td(off)
Turn-off delay time
RL = 13Ω from VIN falling edge
to VOUT = 11.7V
(see Figure 5)
30
RL = 13Ω from VOUT = 1.3V to
dVOUT/dt(on) Turn-on voltage slope
VOUT = 10.4V (see Figure 5)
dVOUT/dt(off) Turn-off voltage slope
Table 9.
Input low level
IIL
Low level input current
VIH
Input high level
IIH
High level input current
VI(hyst)
Input hysteresis voltage
10/28
Symbol
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Input clamp voltage
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Parameter
VIL
Table 10.
RL = 13Ω from VOUT = 11.7V
to VOUT = 1.3V (see Figure 5)
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Logic inputs
Symbol
VICL
Max.
Unit
0.6
V
Switching (VCC = 13V; Tj = 25°C)
Symbol
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s
b
Typ.
Test conditions
s
b
O
Max. Unit
µs
)
s
(
ct
µs
See
Figure 10
V/µs
See
Figure 12
V/µs
u
d
o
Pr
Min.
VIN = 1.25V
Typ.
Max.
Unit
1.25
V
1
µA
3.25
V
VIN = 3.25V
10
0.5
IIN = 1mA
IIN = -1mA
µA
V
6
6.8
- 0.7
8
V
V
Status pin
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VSTAT
Status low output voltage
ISTAT = 1.6mA
0.5
V
ILSTAT
Status leakage current
Normal operation; VSTAT = 5V
10
µA
CSTAT
Status pin Input capacitance Normal operation; VSTAT = 5V
100
pF
VSCL
Status clamp voltage
8
V
V
ISTAT = 1mA
ISTAT = - 1mA
6
6.8
- 0.7
VNQ810
Electrical specifications
Table 11.
Openload detection
Symbol
IOL
tDOL(on)
Parameter
Test conditions
Min.
Openload On state detection threshold
VIN = 5V
20
Openload On state detection delay
IOUT = 0A
VOL
Openload Off state voltage detection
threshold
tDOL(off)
Openload detection delay at turn-off
Figure 4.
VIN = 0V
2.5
80
mA
200
µs
3.5
V
1000
µs
)
s
(
ct
OVER TEMP STATUS TIMING
Tj > TTSD
VINn
u
d
o
VINn
VSTATn
r
P
e
VSTATn
tDOL(off)
Figure 5.
let
o
s
b
tDOL(on)
tSDL
tSDL
O
)
Switching characteristics
s
(
t
c
VOUT
du
90%
80%
o
r
P
dVOUT/dt(off)
dVOUT/dt(on)
o
s
b
40
Unit
Status timings
OPEN LOAD STATUS TIMING (with external pull-up)
IOUT < IOL
VOUT > VOL
e
t
e
l
1.5
Typ. Max.
tr
10%
tf
t
ISENSE
90%
O
INPUT
t
tDSENSE
td(on)
td(off)
t
11/28
Electrical specifications
Table 12.
VNQ810
Truth table
Conditions
Input
Output
Status
Normal operation
L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Overtemperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
Output voltage > VOL
L
H
H
H
Output current < IOL
L
H
L
H
)
(s
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
12/28
r
P
e
u
d
o
s
b
O
t
e
l
o
)
s
(
ct
H
H
L
H
H
L
VNQ810
Electrical specifications
Table 13.
Electrical transient requirements
ISO T/R
Test level
7637/1
Test pulse
I
II
III
IV
Delays and impedance
1
- 25V
- 50V
- 75V
- 100V
2ms, 10Ω
2
+ 25V
+ 50V
+ 75V
+ 100V
0.2ms, 10Ω
3a
- 25V
- 50V
- 100V
- 150V
0.1µs, 50Ω
3b
+ 25V
+ 50V
+ 75V
+ 100V
0.1µs, 50Ω
4
- 4V
- 5V
- 6V
- 7V
100ms, 0.01Ω
5
+ 26.5V
+ 46.5V
+ 66.5V
+ 86.5V
400ms, 2Ω
ISO T/R
Test level
7637/1
I
II
1
C
C
2
C
C
3a
C
C
3b
C
4
C
5
C
Test pulse
C
t
e
l
o
O
)
C
E
IV
C
C
C
C
C
C
C
C
C
E
E
Contents
All functions of the device are performed as designed after exposure to
disturbance.
One or more functions of the device is not performed as designed after exposure
and cannot be returned to proper operation without replacing the device.
u
d
o
C
r
P
e
E
r
P
e
bs
C
s
(
t
c
Class
III
u
d
o
)
s
(
ct
t
e
l
o
s
b
O
13/28
Electrical specifications
Figure 6.
VNQ810
Waveforms
NORMAL OPERATION
INPUTn
LOAD VOLTAGEn
STATUSn
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
)
s
(
ct
INPUTn
LOAD VOLTAGEn
STATUS
r
P
e
OVERVOLTAGE
VCC VOV
t
e
l
o
VCC
INPUTn
LOAD VOLTAGEn
STATUSn
)
(s
t
c
u
INPUTn
od
LOAD VOLTAGEn
r
P
e
STATUSn
t
e
l
o
bs
O
OPEN LOAD with external pull-up
VOUT > VOL
VOL
OPEN LOAD without external pull-up
LOAD VOLTAGEn
STATUSn
Tj
INPUTn
LOAD CURRENTn
14/28
s
b
O
INPUTn
STATUSn
u
d
o
undefined
TTSD
TR
OVERTEMPERATURE
VNQ810
Electrical specifications
2.4
Electrical characteristics curves
Figure 7.
Off state output current
Figure 8.
IL(off1) (uA)
High level input current
Iih (uA)
1.6
5
1.44
4.5
Off state
Vcc=36V
Vin=Vout=0V
1.28
1.12
Vin=3.25V
4
3.5
0.96
3
0.8
2.5
0.64
2
0.48
1.5
0.32
1
0.16
0.5
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (ºC )
Figure 9.
e
t
e
ol
1000
7.8
900
bs
Iin=1mA
7.4
7.2
7
(s)
6.8
t
c
u
6.4
6
-50
-25
0
od
Pr
25
50
75
100
175
125
150
-O
150
175
150
175
700
600
500
400
300
200
100
0
-50
175
-25
0
25
50
75
100
125
Tc (ºC )
Figure 11. Overvoltage shutdown
Figure 12. Turn-off voltage slope
so
b
O
150
Vcc=13V
Rl=13Ohm
800
Tc (°C )
e
t
e
l
125
o
r
P
dVout/dt(on) (V/ms)
8
6.6
du
100
Figure 10. Turn-on voltage slope
Vicl (V)
6.2
75
Tc (°C )
Input clamp voltage
7.6
50
)
s
(
ct
Vov (V)
dVout/dt(off) (V/ms)
50
600
48
550
Ri=6.5Ohm
46
500
44
450
42
40
400
38
350
36
300
34
250
32
30
200
-50
-25
0
25
50
75
Tc (°C )
100
125
150
175
-50
-25
0
25
50
75
100
125
Tc (°C )
15/28
Electrical specifications
VNQ810
Figure 13. ILIM vs Tcase
Figure 14. On state resistance vs VCC
Ilim (A)
Ron (mOhm)
20
120
Tc=150°C
110
18
Vcc=13V
16
100
90
14
80
12
70
10
60
8
50
Tc=25°C
40
6
Tc=- 40°C
30
4
20
2
10
0
0
-50
-25
0
25
50
75
100
125
150
Iout=5A
5
175
10
15
20
Figure 15. Input high level
Vih (V)
Vhyst (V)
3.6
1.5
35
40
u
d
o
r
P
e
1.4
t
e
l
o
1.3
3.2
1.2
3
1.1
bs
2.8
2.6
2.4
)
s
(
t
2.2
2
-50
-25
0
25
50
c
u
d
75
Tc (°C )
100
125
150
175
o
r
P
Figure 17. On state resistance vs Tcase
Ron (mOhm)
e
t
e
ol
400
0.8
0.7
0.6
0.5
-50
-25
0
25
50
75
100
125
150
175
Tc (°C )
Figure 18. Input low level
Vil (V)
2.4
Iout=0.5A
Vcc=8V; 13V & 36V
300
-O
1
0.9
2.6
350
2.2
250
2
200
1.8
150
1.6
100
1.4
50
1.2
1
0
-50
-25
0
25
50
75
Tc (°C )
16/28
)
s
(
ct
30
Figure 16. Input hysteresis voltage
3.4
s
b
O
25
Vcc (V)
Tc (°C )
100
125
150
175
-50
-25
0
25
50
75
Tc (°C )
100
125
150
175
VNQ810
Electrical specifications
Figure 19. Status leakage current
Figure 20. Status low output voltage
Ilstat (uA)
Vstat (V)
0.05
0.8
0.7
Istat=1.6mA
0.04
0.6
Vstat=5V
0.5
0.03
0.4
0.02
0.3
0.2
0.01
0.1
0
)
s
(
ct
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C )
75
100
125
Tc (°C )
Figure 21. Status clamp voltage
150
175
u
d
o
Figure 22. Openload On state detection
threshold
Vscl (V)
r
P
e
Iol (mA)
8
150
t
e
l
o
7.8
140
Istat=1mA
7.6
50
Vcc=13V
Vin=5V
130
7.4
120
bs
7.2
110
7
6.8
)
s
(
t
6.6
6.4
6.2
uc
6
-50
-25
0
25
50
75
100
d
o
r
Tc (°C )
125
150
175
-O
100
90
80
70
60
50
-50
-25
0
25
50
75
100
125
150
175
Tc (°C )
P
e
Figure 23. Openload Off state voltage
detection threshold
t
e
l
o
Vol (V)
O
bs
5
4.5
4
Vin=0V
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C )
17/28
Application information
3
VNQ810
Application information
Figure 24. Application schematic
+5V +5V
+5V
VCC1,2
VCC3,4
Rprot
STATUS1
Rprot
INPUT1
)
s
(
ct
Dld
Rprot
STATUS2
Rprot
INPUT2
OUTPUT1
u
d
o
r
P
e
ΜCU
Rprot
Rprot
INPUT3
Rprot
STATUS4
)-
Rprot
s
b
O
e
t
e
ol
Note:
s
b
O
3.1
3.1.1
OUTPUT4
s
(
t
c
+5V +5V
GND1,2
GND3,4
RGND
VGND
DGND
Channels 3 & 4 have the same internal circuit as channel 1 & 2.
GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
Solution 1: a resistor in the ground line (RGND only)
This can be used with any type of load.
The following show how to dimension the RGND resistor:
18/28
OUTPUT3
INPUT4
du
o
r
P
t
e
l
o
STATUS3
OUTPUT2
1.
RGND ≤600mV / 2 (IS(on)max)
2.
RGND ≥ ( - VCC) / ( - IGND)
VNQ810
Application information
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC < 0 during reverse battery situations) is:
PD = ( - VCC)2/ RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same RGND .
)
s
(
ct
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2
Solution 2: a diode (DGND) in the ground line
u
d
o
r
P
e
A resistor (RGND = 1kΩ) should be inserted in parallel to DGND if the device will be driving
an inductive load. This small signal diode can be safely shared amongst several different
HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in
the input threshold and the status output values if the microprocessor ground is not common
with the device ground. This shift will not vary if more than one HSD shares the same
diode/resistor network. Series resistor in INPUT and STATUS lines are also required to
prevent that, during battery voltage transient, the current exceeds the Absolute Maximum
Rating. Safest configuration for unused INPUT and STATUS pin is to leave them
unconnected.
t
e
l
o
)
(s
s
b
O
t
c
u
3.2
Load dump protection
d
o
r
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC maximum DC rating. The same applies if the device is subject to transients on the VCC
line that are greater than those shown in the ISO T/R 7637/1 table.
P
e
3.3
s
b
O
t
e
l
o MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to
prevent the µC I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:
- VCCpeak / Ilatchup ≤Rprot ≤(VOHµC - VIH - VGND) / IIHmax
19/28
Application information
VNQ810
Example
For the following conditions:
VCCpeak = - 100V
Ilatchup ≥ 20mA
VOHµC ≥ 4.5V
5kΩ ≤Rprot ≤65kΩ.
Recommended values are:
Rprot = 10kΩ
3.4
)
s
(
ct
Open load detection in off state
Off state open load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the
microprocessor.
u
d
o
r
P
e
The external resistor has to be selected according to the following requirements:
1) no false open load indication when load is connected: in this case we have to avoid VOUT
to be higher than VOlmin; this results in the following condition
VOUT = (VPU / (RL + RPU))RL < VOlmin.
t
e
l
o
s
b
O
2) no misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2).
)
(s
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched OFF when the module is in
standby.
t
c
u
Figure 25. Openload detection in Off state
d
o
r
V batt.
P
e
t
e
l
o
bs
V CC
R PU
INP UT
O
DRIVER
+
LOGIC
IL(off2)
OUT
+
S TATUS
R
V OL
G ROUND
20/28
VPU
RL
VNQ810
3.5
Application information
Maximum demagnetization energy (VCC = 13.5V)
Figure 26. Maximum turn-off current versus load inductance
ILMAX (A)
10
A
B
)
s
(
ct
C
u
d
o
r
P
e
1
0.01
t
e
l
o
bs
0.1
O
)
1
L(mH)
10
100
s
(
t
c
A = single pulse at TJstart = 150ºC
u
d
o
B= repetitive pulse at TJstart = 100ºC
C= repetitive pulse at TJstart = 125ºC
r
P
e
t
e
l
o
bs
VIN, IL
Demagnetization
Demagnetization
Demagnetization
O
t
Note:
Values are generated with RL = 0Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
21/28
Package and PCB thermal data
VNQ810
4
Package and PCB thermal data
4.1
SO-28 thermal data
Figure 27. SO-28 PC board
)
s
(
ct
u
d
o
r
P
e
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB
thickness = 2mm, Cu thickness = 35µm, Copper areas: 0.5 cm2, 3 cm2, 6 cm2).
Table 14.
t
e
l
o
Thermal calculation according to the PCB heatsink area
Tjchip1
s
b
O
Chip 1
Chip 2
ON
OFF
RthA x Pdchip1 + Tamb
OFF
ON
RthC x Pdchip2 + Tamb
ON
ON
RthB x (Pdchip1 + Pdchip2) +
Tamb
RthB x (Pdchip1 + Pdchip2) +
Tamb
Pdchip1 = Pdchip2
ON
ON
(RthA x Pdchip1) + RthC x
Pdchip2 + Tamb
(RthA x Pdchip2) + RthC x
Pdchip1 + Tamb
Pdchip1 ≠ Pdchip2
ct
u
d
o
r
P
e
)
(s
Tjchip2
Note
RthC x Pdchip1 + Tamb
RthA x Pdchip2 + Tamb
RthA = thermal resistance junction to ambient with one chip ON
t
e
l
o
RthB = thermal resistance junction to ambient with both chips ON and Pdchip1 = Pdchip2
s
b
O
22/28
RthC = mutual thermal resistance
VNQ810
Package and PCB thermal data
Figure 28. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb
(°C/W)
70
60
50
RthA
40
)
s
(
ct
RthB
30
RthC
20
10
0
1
r
P
e
u
d
o
2
3
4
5
PCB Cu heats ink area (cm^2)/is land
6
7
t
e
l
o
s
b
O
Figure 29. Thermal impedance junction ambient single pulse
100
)
(s
Zth(°C/W)
0,5 cm ^2/is land
ct
10
e
t
e
ol
bs
du
3 cm ^2/is land
6 cm ^2/is land
o
r
P
1
O
One channel ON
Two channels
ON on same chip
0.1
0.01
0.0001
0.001
0.01
0.1
1
time(s)
10
100
1000
23/28
Package and PCB thermal data
VNQ810
Equation 1: pulse calculation formula
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ)
where
δ = tp ⁄ T
Figure 30. Thermal fitting model of a quad channel HSD in SO-28
Tj_1
P d1
T j _2
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
C 13
R 13
P d2
C 14
R 17
Tj_3
)
s
(
ct
R 14
C7
C8
C9
R7
R8
R9
r
P
e
C 10
C 11
P d3
T j _4
P d4
Table 15.
ol
ete
s
b
O
24/28
C 15
R 15
R 16
O
)
u
d
o
let
R 10
o
s
b
C 16
s
(
t
c
u
d
o
R 18
R 11
C 12
R 12
T_amb
Thermal parameters
Pr
Area / island (cm2)
Footprint
R1 = R7 = R13 = R15 (°C/W)
0.35
R2 = R8 = R14 = R16 (°C/W)
1.8
R3 = R9 (°C/W)
4.5
R4 = R10 (°C/W)
11
R5 = R11 (°C/W)
15
R6 = R12 (°C/W)
30
C1 = C7 = C13 = C15 (W.s/°C)
0.0001
C2 = C8 = C14 = C16 (W.s/°C)
7E-04
C3 = C9 (W.s/°C)
6E-03
C4 = C10 (W.s/°C)
0.2
C5 = C11 (W.s/°C)
1.5
C6 = C12 (W.s/°C)
5
R17 = R18 (°C/W)
150
6
13
8
VNQ810
Package and packing information
5
Package and packing information
5.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 31. SO-28 package dimensions
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
Table 16.
t
c
u
SO-28 mechanical data
od
r
P
e
Symbol
t
e
l
o
O
bs
s
b
O
Millimeters
Min.
Typ.
A
Max.
2.65
a1
0.10
0.30
b
0.35
0.49
b1
0.23
0.32
C
0.50
c1
45° (typ.)
D
17.7
18.1
E
10.00
10.65
e
1.27
e3
16.51
F
7.40
7.60
L
0.40
1.27
S
8° (max.)
25/28
Package and packing information
5.2
VNQ810
SO-28 packing information
Figure 32. SO-28 tube shipment (no suffix)
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
B
28
700
532
3.5
13.8
0.6
All dimensions are in mm.
)
s
(
ct
u
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Figure 33. SO-28 tape and reel shipment (suffix “TR”)
let
so
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Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
t
c
u
1000
1000
330
1.5
13
20.2
16.4
60
22.4
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Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
t
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b
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Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
12
1.5
1.5
7.5
6.5
2
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
26/28
No components
500mm min
VNQ810
6
Revision history
Revision history
Table 17.
Document revision history
Date
Revision
09-Sep-2004
1
Initial release.
2
Minor changes
Current and voltage convention update (page 3).
Configuration diagram (top view) & suggested connections for unused
and n.c. pins insertion (page 3).
6 cm2 Cu condition insertion in thermal data table (page 4).
VCC - output diode section update (page 4).
Protections note insertion (page 5)
Revision history table insertion (page 20).
Disclaimers update (page 21).
03-May-2006
Changes
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01-Dec-2008
3
Document reformatted and restructured.
Added contents, list of tables and figures.
Added ECOPACK® packages information.
25-Sep-2013
4
Updated disclaimer.
)
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VNQ810
)
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