VNQ810M-E
QUAD CHANNEL HIGH SIDE DRIVER
Table 1. General Features
Type
VNQ810M-E
Figure 1. Package
RDS(on)
Iout
VCC
150mΩ (*)
0.6A (*)
36V
)
s
(
ct
(*) Per each channel
CMOS COMPATIBLE INPUTS
■ OPEN DRAIN STATUS OUTPUTS
■ ON STATE OPEN LOAD DETECTION
■ OFF STATE OPEN LOAD DETECTION
■ SHORTED LOAD PROTECTION
■ UNDERVOLTAGE AND OVERVOLTAGE
SHUTDOWN
■ PROTECTION AGAINST LOSS OF GROUND
■ VERY LOW STAND-BY CURRENT
■
REVERSE BATTERY PROTECTION (**)
■ IN COMPLIANCE WITH THE 2002/95/EC
EUROPEAN DIRECTIVE
■
)
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DESCRIPTION
The VNQ810M-E is a quad HSD formed by
assembling two VND810M-E chips in the same
SO-28 package. The VNQ810M-E is a monolithic
device made by using STMicroelectronics
VIPower M0-3 Technology, intended for driving
any kind of load with one side connected to
ground. Active VCC pin voltage clamp protects the
device against low energy spikes (see ISO7637
transient compatibility table).
Active current limitation combined with thermal
shutdown and automatic restart protects the
device against overload. The current limitation
threshold is aimed at detecting the 21W/12V
standard bulb as an overload fault. The device
detects open load condition both in on and off
state . Output shorted to VCC is detected in the off
state. Device automatically turns off in case of
ground pin disconnection.
od
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SO-28 (DOUBLE ISLAND)
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Table 2. Order Codes
Package
SO-28
Tube
VNQ810M-E
Tape and Reel
VNQ810MTR-E
Note: (**) See application schematic at page 10
Rev. 1
October 2004
1/21
VNQ810M-E
Figure 2. Block Diagram
VCC1,2
Vcc
OVERVOLTAGE
CLAMP
UNDERVOLTAGE
GND1,2
)
s
(
ct
CLAMP 1
INPUT1
DRIVER 1
e
t
e
l
CURRENT LIMITER 1
DRIVER 2
LOGIC
OVERTEMP. 1
OPENLOAD ON 1
INPUT2
OPENLOAD OFF 1
)
(s
STATUS2
t
c
u
OVERTEMP. 2
GND3,4
od
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e
Vcc
CLAMP
let
o
s
b
OUTPUT2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
VCC3,4
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 3
OUTPUT3
INPUT3
O
b
O
so
OUTPUT1
o
r
P
CLAMP 2
STATUS1
du
DRIVER 3
CLAMP 4
STATUS3
CURRENT LIMITER 3
LOGIC
DRIVER 4
OUTPUT4
OVERTEMP. 3
OPENLOAD ON 3
CURRENT LIMITER 4
INPUT4
OPENLOAD OFF 3
OPENLOAD ON 4
STATUS4
OPENLOAD OFF 4
OVERTEMP. 4
2/21
VNQ810M-E
Table 3. Absolute Maximum Ratings
Symbol
VCC
Parameter
DC Supply Voltage
Value
Unit
41
V
- VCC
Reverse DC Supply Voltage
-0.3
V
- Ignd
DC Reverse Ground Pin Current
-200
mA
IOUT
DC Output Current
Internally Limited
A
-6
A
DC Input Current
+/- 10
mA
DC Status Current
+/- 10
mA
- IOUT
IIN
ISTAT
Reverse DC Output Current
Electrostatic Discharge
R=1.5KΩ; C=100pF)
VESD
(Human
Body
4000
- INPUT
- STATUS
Tstg
(L=310mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC;
IL=0.9A)
Junction Operating Temperature
Storage Temperature
)
(s
b
O
V
174
mJ
6.25
W
Internally Limited
°C
-55 to 150
°C
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l
so
Power dissipation (per island) at Tlead=25°C
V
Pr
5000
Maximum Switching Energy
Tj
u
d
o
5000
- VCC
Ptot
V
4000
- OUTPUT
EMAX
)
s
(
ct
Model:
V
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
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VCC1,2
1
28
GND 1,2
VCC1,2
OUTPUT1
INPUT1
OUTPUT1
STATUS1
OUTPUT1
STATUS2
OUTPUT2
INPUT2
OUTPUT2
VCC1,2
OUTPUT2
VCC3,4
OUTPUT3
GND 3,4
OUTPUT3
INPUT3
OUTPUT3
STATUS3
OUTPUT4
STATUS4
OUTPUT4
OUTPUT4
INPUT4
VCC3,4
14
Connection / Pin Status
Floating
X
To Ground
15
N.C.
X
X
Output
X
VCC3,4
Input
X
Through 10KΩ resistor
3/21
VNQ810M-E
Figure 4. Current and Voltage Conventions
IS3,4
IS1,2
VCC3,4
VCC3,4
VCC1,2
VF1 (*)
VCC1,2
IIN1
INPUT1
ISTAT1
VIN1
IIN2
VSTAT1
VIN4
OUTPUT3
IOUT4
INPUT4
ISTAT4
OUTPUT4
STATUS4
GND3,4
VSTAT4
Symbol
r
P
e
IGND1,2
t
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l
o
ct
Parameter
du
u
d
o
s
b
O
(*) V Fn = VCCn - VOUTn during reverse battery condition
)
(s
VOUT3
VOUT4
GND1,2
IGND3,4
Table 4. Thermal Data (Per island)
)
s
(
ct
VOUT2
IOUT3
STATUS3
IIN4
VSTAT3
OUTPUT2
INPUT3
ISTAT3
VIN3
VOUT1
IOUT2
STATUS2
IIN3
VSTAT2
OUTPUT1
INPUT2
ISTAT2
VIN2
IOUT1
STATUS1
Value
Unit
Rthj-lead
Thermal Resistance Junction-lead per chip
Rthj-amb
Thermal Resistance Junction-ambient (one chip ON)
60 (1)
44 (2)
°C/W
Rthj-amb
Thermal Resistance Junction-ambient (two chips ON)
46 (1)
31 (2)
°C/W
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20
°C/W
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5cm 2 of Cu (at least 35µm thick) connected to all V CC pins. Horizontal
mounting and no artificial air flow
Note: 2. When mounted on a standard single-sided FR-4 board with 6cm 2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow
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4/21
VNQ810M-E
ELECTRICAL CHARACTERISTICS
(8V TTSD) L
Overtemperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Overvoltage
L
H
L
L
Output Voltage > VOL
L
H
H
H
Output Current < IOL
L
H
L
H
)
(s
VOUT > VOL
VINn
IOUT < IOL
t
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r
VSTATn
P
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l
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tDOL(off)
du
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t
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ol
Figure 5.
s
b
O
OPENLOAD STATUS TIMING (with external pull-up)
)
s
(
ct
H
H
o
r
P
L
H
H
L
OVERTEMP STATUS TIMING
Tj > TTSD
VINn
VSTATn
tSDL
tSDL
tDOL(on)
s
b
O
7/21
VNQ810M-E
Figure 6. Switching time Waveforms
vOUTn
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
)
s
(
ct
10%
t
VINn
td(on)
u
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td(off)
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)
(s
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Table 13. Electrical Transient Requirements On VCC Pin
ISO T/R 7637/1
Test Pulse
1
2
3a
3b
4
5
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ISO T/R 7637/1
Test Pulse
1
2
3a
3b
4
5
CLASS
C
E
8/21
ct
du
I
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P
-25 V
+25 V
-25 V
+25 V
-4 V
+26.5 V
I
C
C
C
C
C
C
II
TEST LEVELS
III
IV
-50 V
+50 V
-50 V
+50 V
-5 V
+46.5 V
-75 V
+75 V
-100 V
+75 V
-6 V
+66.5 V
-100 V
+100 V
-150 V
+100 V
-7 V
+86.5 V
TEST LEVELS RESULTS
II
III
C
C
C
C
C
C
C
C
C
C
E
E
Delays and
Impedance
2 ms 10 Ω
0.2 ms 10 Ω
0.1 µs 50 Ω
0.1 µs 50 Ω
100 ms, 0.01 Ω
400 ms, 2 Ω
IV
C
C
C
C
C
E
CONTENTS
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device is not performed as designed after exposure and cannot be
returned to proper operation without replacing the device.
VNQ810M-E
Figure 7. Waveforms
NORMAL OPERATION
INPUTn
OUTPUT VOLTAGEn
STATUSn
)
s
(
ct
UNDERVOLTAGE
VUSDhyst
VCC
VUSD
u
d
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INPUTn
OUTPUT VOLTAGEn
STATUSn
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undefined
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OVERVOLTAGE
VCC>VOL
VCCVOL
VOL
OPEN LOAD without external pull-up
INPUTn
OUTPUT VOLTAGEn
STATUSn
OVERTEMPERATURE
Tj
TTSD
TR
INPUTn
OUTPUT CURRENTn
STATUSn
9/21
VNQ810M-E
Figure 8. Application Schematic
+5V +5V
+5V
VCC1,2
VCC3,4
Rprot
STATUS1
Rprot
INPUT1
)
s
(
ct
Dld
Rprot
STATUS2
Rprot
INPUT2
Rprot
STATUS3
µC
Rprot
OUTPUT1
u
d
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let
OUTPUT2
STATUS4
O
)
s
(
t
c
Rprot
OUTPUT3
OUTPUT4
INPUT4
du
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s
b
INPUT3
Rprot
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P
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P
GND1,2
GND3,4
RGND
VGND
+5V +5V
DGND
s
b
O
Note: Channels 3 & 4 have the same internal circuit as channel 1 & 2.
GND PROTECTION
REVERSE BATTERY
NETWORK
AGAINST
Solution 1: Resistor in the ground line (RGND only). This
can be used with any type of load.
The following is an indication on how to dimension the
RGND resistor.
1) RGND ≤ 600mV / 2(IS(on)max).
2) RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the
device’s datasheet.
Power Dissipation in RGND (when VCC
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