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VNS3NV0413TR

VNS3NV0413TR

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    VNS3NV0413TR - OMNIFET II fully autoprotected Power MOSFET - STMicroelectronics

  • 数据手册
  • 价格&库存
VNS3NV0413TR 数据手册
VNN3NV04, VNS3NV04 VND3NV04, VND3NV04-1 OMNIFET II fully autoprotected Power MOSFET Features Type VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1 ■ ■ ■ ■ ■ ■ ■ ■ ■ RDS(on) Ilim Vclamp 2 120 mΩ 3.5 A 40 V SOT-223 1 2 3 SO-8 Linear current limitation Thermal shutdown Short circuit protection Integrated clamp Low current drawn from input pin Diagnostic feedback through input pin ESD protection Direct access to the gate of the Power MOSFET (analog driving) Compatible with standard Power MOSFET in compliance with the 2002/95/EC European Directive 3 1 1 3 2 TO252 (DPAK) TO251 (IPAK) Description The VNN3NV04, VNS3NV04, VND3NV04 VND3NV04-1, are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, intended for replacement of standard Power MOSFETs from DC up to 50 kHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin. Table 1. Package Device summary Order codes Tube Tube (lead-free) VND3NV04-E VND3NV04-1-E Tape and reel VNN3NV0413TR VNS3NV0413TR VND3NV0413TR Tape and reel (lead-free) VND3NV04TR-E - SOT-223 SO-8 TO-252 TO-251 VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1 April 2009 Doc ID 7382 Rev 2 1/26 www.st.com 1 Contents VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Contents 1 2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 2.2 2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Doc ID 7382 Rev 2 3/26 List of figures Device name or AN # List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal impedance for DPAK/IPAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal impedance for SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Static drain-source on resistance vs input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Static drain-source on resistance vs input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Static drain-source on resistance vs Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off drain source voltage slope (part 2/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Switching time resistive load (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Switching time resistive load (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normalized current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 TO-251 (IPAK) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TO-252 (DPAK) package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SOT-223 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DPAK footprint and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DPAK tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4/26 Doc ID XXXXX Rev 3 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Block diagram and pin description 1 Block diagram and pin description Figure 1. Block diagram DRAIN 2 Overvoltage Clamp INPUT 1 Gate Control Over Temperature Linear Current Limiter 3 SOURCE FC01000 Figure 2. Configuration diagram (top view) SO-8 Package(1) SOURCE SOURCE SOURCE INPUT 1 8 DRAIN DRAIN DRAIN 4 5 DRAIN 1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1. Doc ID 7382 Rev 2 5/26 Electrical specifications VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 2 Electrical specifications Figure 3. Current and voltage conventions ID VDS DRAIN IIN RIN INPUT SOURCE VIN 2.1 Absolute maximum ratings Table 2. Symbol VDS VIN IIN RIN MIN ID IR VESD1 VESD2 Ptot Tj Tc Tstg Absolute maximum ratings Value Parameter SOT-223 Drain-source voltage (VIN=0 V) Input voltage Input current Minimum input series impedance Drain current Reverse DC output current Electrostatic discharge (R=1.5 KΩ, C=100 pF) Electrostatic discharge on output pin only (R=330 Ω, C=150 pF) Total dissipation at Tc=25 °C Operating junction temperature Case operating temperature Storage temperature 7 SO-8 DPAK/IPAK V V mA W A A V V 35 W °C °C °C Internally clamped Internally clamped +/-20 220 Internally limited -5.5 4000 16500 8.3 Internally limited Internally limited -55 to 150 Unit 6/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Electrical specifications 2.2 Table 3. Symbol Rthj-case Rthj-lead Rthj-amb Thermal data Thermal data Value Parameter SOT-223 Thermal resistance junction-case max Thermal resistance junction-lead max Thermal resistance junction-ambient max 70 (1) Unit SO-8 DPAK 3.5 15 65 (1) IPAK 3.5 °C/W °C/W 18 54 (1) 100 °C/W 1. When mounted on a standard single-sided FR4 board with 50 mm2 of Cu (at least 35 mm thick) connected to all DRAIN pins. 2.3 Table 4. Symbol Off VCLAMP VCLTH VINTH IISS VINCL IDSS On RDS(on) Electrical characteristics -40 °C < Tj < 150 °C, unless otherwise specified. Electrical characteristics Parameter Test conditions Min Typ Max Unit Drain-source clamp voltage Drain-source clamp threshold voltage Input threshold voltage VIN=0 V; ID=1.5 A VIN=0 V; ID=2 mA VDS=VIN; ID=1 mA 40 36 0.5 45 55 V V 2.5 100 150 8 -0.3 30 75 V µA V µA Supply current from input VDS=0 V; VIN=5 V pin Input-source clamp voltage Zero input voltage drain current (VIN=0 V) IIN=1 mA IIN=-1 mA VDS=13 V; VIN=0 V; Tj=25 °C VDS=25 V; VIN=0 V 6 -1.0 6.8 Static drain-source on resistance VIN=5 V; ID=1.5 A; Tj=25 °C VIN=5 V; ID=1.5 A 120 240 mΩ Dynamic (Tj=25 °C, unless otherwise specified) gfs (1) COSS Forward transconductance Output capacitance VDD=13 V; ID=1.5 A VDS=13 V; f=1 MHz; VIN=0 V 5.0 150 S pF Switching (Tj=25 °C, unless otherwise specified) Doc ID 7382 Rev 2 7/26 Electrical specifications Table 4. Symbol td(on) tr td(off) tf td(on) tr td(off) tf (dI/dt)on Qi VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Electrical characteristics (continued) Parameter Turn-on delay time Rise time Turn-off delay time Fall time Turn-on delay time Rise time Turn-off delay time Fall time Turn-on current slope Total input charge VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=RIN MIN=220 Ω VDD=12 V; ID=1.5 A; VIN=5 V Igen=2.13 mA (see figure Figure 7.) VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=2.2 KΩ (see figure Figure 4.) VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=RIN MIN=220 Ω (see figure Figure 4.) Test conditions Min Typ 90 250 450 250 0.45 2.5 3.3 2.0 4.7 8.5 Max 300 750 1350 750 1.35 7.5 10.0 6.0 Unit ns ns ns ns µs µs µs µs A/µs nC Source drain diode (Tj=25 °C, unless otherwise specified) VSD(1) trr Qrr IRRM Forward on voltage Reverse recovery time ISD=1.5 A; VIN=0 V 0.8 107 37 0.7 V ns µC A ISD=1.5 A; dI/dt=12 A/µs Reverse recovery charge VDD=30 V; L=200 µH Reverse recovery current (see test circuit, figure Figure 5.) Protections (-40 °C < Tj < 150 °C, unless otherwise specified) Ilim tdlim Tjsh Tjrs Igf Eas Drain current limit Step response current limit Over temperature shutdown Over temperature reset Fault sink current Single pulse avalanche energy VIN=5 V; VDS=13 V; Tj=Tjsh starting Tj=25µ°C; VDD=24 V VIN=5 V Rgen=RIN MIN=220 Ω; L=24 mH (see figures Figure 6. & Figure 8.) VIN=5 V; VDS=13 V VIN=5 V; VDS=13 V 150 135 10 100 15 20 3.5 5 10 175 200 7 A µs °C °C mA mJ 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % 8/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features 3 Protection features During normal operation, the input pin is electrically connected to the gate of the internal Power MOSFET through a low impedance path. The device then behaves like a standard Power MOSFET and can be used as a switch from DC up to 50 kHz. The only difference from the user’s standpoint is that a small DC current IISS (typ. 100µA) flows into the input pin in order to supply the internal circuitry. The device integrates: ● Overvoltage clamp protection: internally set at 45 V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads. Linear current limiter circuit: limits the drain current ID to Ilim whatever the input pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the over temperature threshold Tjsh. Over temperature and short circuit protection: these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Over temperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted when the chip temperature falls of about 15 °C below shutdown temperature. Status feedback: in the case of an over temperature fault condition (Tj > Tjsh), the device tries to sink a diagnostic current Igf through the input pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the input pin driver is not able to supply the current Igf, the input pin will fall to 0 V. This will not however affect the device operation: no requirement is put on the current capability of the input pin driver except to be able to supply the normal operation drive current IISS. ● ● ● Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL logic circuit. Doc ID 7382 Rev 2 9/26 Protection features Figure 4. VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Switching time test circuit for resistive load VD ID Rgen Vgen 90% tr td(on) 10% td(off) tf t Vgen t Figure 5. Test circuit for diode recovery times A D I FAST DIODE A L=100uH B D OMNIFET S B 220Ω Rgen I VDD OMNIFET S Vgen 8.5 Ω 10/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features Figure 6. Unclamped inductive load test circuits Figure 7. Input charge test circuit Figure 8. Unclamped inductive waveforms VIN GEN ND8003 Doc ID 7382 Rev 2 11/26 Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 3.1 Figure 9. Electrical characteristics curves Thermal impedance for DPAK/IPAK Figure 10. Thermal impedance for SOT-223 Figure 11. Derating curve Figure 12. Transconductance Gfs (S) 11 10 9 8 7 6 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Vds=13V Tj=-40ºC Tj=25ºC Tj=150ºC Id (A) Figure 13. Static drain-source on resistance vs input voltage (part 1/2) Rds(on) (mohms) 300 275 250 225 200 175 150 125 100 75 50 25 0 3 3.5 4 4.5 5 5.5 6 6.5 Id=3.5A Id=1A Figure 14. Static drain-source on resistance vs input voltage (part 2/2) Rds(on) (mohms) 250 225 200 Id=1.5A Tj=150ºC 175 150 125 Tj=150ºC Tj=25ºC Tj=-40ºC Id=3.5A Id=1A Id=3.5A Id=1A 100 75 50 25 0 3 3.5 4 4.5 5 5.5 6 6.5 Tj=25ºC Tj=-40ºC Vin(V) Vin(V) 12/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features Figure 15. Source-drain diode forward characteristics Vsd (mV) 1100 1050 1000 950 Figure 16. Static drain source on resistance Rds(on) (ohms) 4.5 Tj=-40ºC Vin=0V 4 3.5 3 Vin=2.5V 900 850 800 750 700 650 600 0 1 2 3 4 5 6 7 8 9 10 11 12 2.5 2 1.5 1 0.5 0 0 0.05 0.1 0.15 0.2 0.25 0.3 Tj=25ºC Tj=150ºC Id (A) Id(A) Figure 17. Turn-on current slope (part 1/2) di/dt(A/us) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 Figure 18. Turn-on current slope (part 2/2) di/dt(A/usec) 1.75 1.5 1.25 1 0.75 0.5 0.25 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 Vin=5V Vdd=15V Id=1.5A Vin=3.5V Vdd=15V Id=1.5A Rg(ohm) Rg(ohm) Figure 19. Transfer characteristics Figure 20. Static drain-source on resistance vs Id Rds(on) (mohms) 250 Tj=25ºC Idon(A) 2.25 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0 1.5 1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 225 200 175 150 125 Vds=13.5V Vin=5V Tj=150ºC Tj=150ºC Tj=-40ºC 100 75 50 25 0 0 0.5 1 1.5 2 2.5 Tj=25ºC Tj= - 40ºC Vin(V) 3 3.5 4 Id (A) Doc ID 7382 Rev 2 13/26 Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Figure 21. Input voltage vs input charge Figure 22. Turn-off drain source voltage slope (part 1/2) dv/dt(V/usec) 300 275 Vin (V) 6 5 250 Vds=12V Id=0.5A 4 225 200 175 Vin=5V Vdd=15V Id=1.5A 3 150 125 2 100 75 1 50 25 0 0 500 250 750 1000 1250 1500 1750 2000 2250 2500 0 0 1 2 3 4 5 6 Qg (nC) Rg(ohm) Figure 23. Turn-off drain source voltage slope Figure 24. Capacitance variations (part 2/2) dv/dt(V/usec) 300 275 250 225 200 175 150 125 100 75 50 25 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 50 0 5 10 15 20 25 30 35 100 150 200 C(pF) 350 Vin=3.5V Vdd=15V Id=1.5A 300 f=1MHz Vin=0V 250 Rg(ohm) Vds(V) Figure 25. Output characteristics Figure 26. Normalized on resistance vs temperature v Id (A) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10 Vin=5V Vin=4V Rds(on) (mOhm) 4 3.5 3 Vin=3V Vin=5V Id=1.5A 2.5 2 1.5 1 0.5 -50 -25 0 25 50 75 100 125 150 175 Vds (V) Tc )ºC) 14/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features Figure 27. Switching time resistive load (part 1/2) Figure 28. Switching time resistive load (part 2/2) t(usec) 4 3.5 3 2.5 2 t(nsec) 900 Vdd=15V Id=1.5A Vin=5V td(off) tr 800 tr 700 600 500 Vdd=15V Id=1.5A Rg=220ohm tf 1.5 1 0.5 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 400 td(off) 300 td(on) 200 100 0 3.25 tf td(on) Rg(ohm) 3.5 3.75 4 4.25 4.5 4.75 5 5.25 Vin(V) Figure 29. Normalized input threshold voltage Figure 30. Normalized current limit vs junction vs temperature temperature Ilim (A) Vinth (V) 2 10 9 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 Vds=Vin Id=1mA 8 7 6 5 4 3 2 1 Vin=5V Vds=13V 0 -50 -25 0 25 50 75 100 125 150 175 0 -50 -25 0 25 50 75 100 125 150 175 Tc (ºC) Tc (ºC) Figure 31. Step response current limit Tdlim(usec) 13 12.5 12 11.5 11 10.5 10 9.5 9 8.5 8 7.5 5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5 Vin=5V Rg=220ohm Vdd(V) Doc ID 7382 Rev 2 15/26 Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 4 Package and packing information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 TO-251 (IPAK) mechanical data Table 5. TO-251 (IPAK) mechanical data millimeters Symbol Min. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 2.2 0.9 0.7 0.64 5.2 Typ. Max. 2.4 1.1 1.3 0.9 5.4 0.85 16/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Figure 32. TO-251 (IPAK) package dimensions Package and packing information 4.2 TO-252 (DPAK) mechanical data Table 6. TO-252 (DPAK) mechanical data millimeters Symbol Min. A A1 A2 B B2 C C2 D D1 E E1 e G H 4.40 9.35 6.40 4.7 2.28 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.1 6.60 Typ. Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 Doc ID 7382 Rev 2 17/26 Package and packing information Table 6. VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 TO-252 (DPAK) mechanical data (continued) millimeters Symbol Min. L2 L4 R V2 Package Weight 0° 0.60 0.2 8° Gr. 0.29 Typ. 0.8 1.00 Max. Figure 33. TO-252 (DPAK) package dimensions P032P 4.3 SOT-223 mechanical data Table 7. SOT-223 mechanical data millimeters Symbol Min. A B B1 c D e 0.6 2.9 0.24 6.3 0.7 3 0.26 6.5 2.3 Typ. Max. 1.8 0.85 3.15 0.35 6.7 18/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Table 7. SOT-223 mechanical data (continued) Package and packing information millimeters Symbol Min. e1 E H V A1 0.02 3.3 6.7 Typ. 4.6 3.5 7 10 (max) 0.1 3.7 7.3 Max. Figure 34. SOT-223 package dimensions 0046067 4.4 SO-8 mechanical data Table 8. SO-8 mechanical data millimeters Symbol Min A a1 a2 a3 b A A1 0.10 0.65 0.35 0.1 Typ Max 1.75 0.25 1.65 0.85 0.48 1.75 0.25 Doc ID 7382 Rev 2 19/26 Package and packing information Table 8. VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 SO-8 mechanical data (continued) millimeters Symbol Min A2 b c D (1) Typ Max 1.25 0.28 0.17 4.80 5.80 3.80 4.90 6.00 3.90 1.27 0.25 0.40 1.04 0° 8° 0.10 0.50 1.27 0.48 0.23 5.00 6.20 4.00 E E1(2) e h L L1 k ccc 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm in total (both side). 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. Figure 35. SO-8 package dimensions 0016023 D 20/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information 4.5 SOT-223 packing information Figure 36. SOT-223 tape and reel shipment (suffix “TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 12.4 60 18.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 12 4 8 1.5 1.5 5.5 4.5 2 All dimensions are in mm. End Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components Doc ID 7382 Rev 2 21/26 Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 4.6 SO-8 packing information Figure 37. SO-8 tube shipment (no suffix) B C A Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) 100 2000 532 3.2 6 0.6 Figure 38. SO-8 tape and reel shipment (suffix “TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 12 4 8 1.5 1.5 5.5 4.5 2 End All dimensions are in mm. Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components 22/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information 4.7 DPAK packing information Figure 39. DPAK footprint and tube shipment (no suffix) A 6 .7 1 .8 3 .0 1 .6 C 2 .3 6 .7 2 .3 B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) 75 3000 532 6 21.3 0.6 Figure 40. DPAK tape and reel shipment (suffix “TR”) REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 (± 0.1) P D (± 0.1/-0) D1 (min) F (± 0.05) K (max) P1 (± 0.1) 16 4 8 1.5 1.5 7.5 6.5 2 All dimensions are in mm. End Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components Doc ID 7382 Rev 2 23/26 Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 4.8 IPAK packing information Figure 41. IPAK tube shipment (no suffix) A C B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) 75 3000 532 6 21.3 0.6 All dimensions are in mm. 24/26 Doc ID 7382 Rev 2 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Revision history 5 Revision history Table 9. Date 01-Feb-2003 27-Apr-2009 Document revision history Revision 1 2 Initial Release Added Table 1: Device summary on page 1 Updated Table 4: Package and packing information on page 16 Changes Doc ID 7382 Rev 2 25/26 VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 26/26 Doc ID 7382 Rev 2
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