XZBGR155W5MAV

Part Number: XZBGR155W5MAV 0.65x0.35x0.2mm(0201) SMD CHIP LED LAMP Features Package Schematics ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 4,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 2 ● Low current IF=5mA operating. ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Green (InGaN) Unit Reverse Voltage VR 5 V Forward Current IF 10 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS 50 mA Power Dissipation PD 34 mW 1000 V Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature TA -40 ~ +85 Tstg -40 ~ +85 °C A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Part Number XZBGR155W5MAV Emitting Color Green Emitting Material InGaN Operating Characteristics (TA=25°C) Green (InGaN) Unit Forward Voltage (Typ.) (IF=5mA) VF 3 V Forward Voltage (Max.) (IF=5mA) VF 3.2 V Reverse Current (Max.) (VR=5V) IR 50 uA Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=5mA) λP 518* nm Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=5mA) λD 527* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=5mA) △λ 35 nm Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=5mA) mcd min. typ. 30* 79* Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 518* 140° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Jun 23,2016 XDSB8230 V4-Z Layout: Maggie L. P. 1/4 Part Number: XZBGR155W5MAV 0.65x0.35x0.2mm(0201) SMD CHIP LED LAMP ™ Green LED is recommended for reflow soldering and soldering profile is shown below. Jun 23,2016 XDSB8230 V4-Z Layout: Maggie L. P. 2/4 Part Number: XZBGR155W5MAV 0.65x0.35x0.2mm(0201) SMD CHIP LED LAMP ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Mask open area ratio:80% Mask thickness:80~100um ™ Reel Dimension ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Jun 23,2016 XDSB8230 V4-Z Layout: Maggie L. P. 3/4 Part Number: XZBGR155W5MAV 0.65x0.35x0.2mm(0201) SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Jun 23,2016 XDSB8230 V4-Z Layout: Maggie L. P. 4/4