XZCBD80S-2HTA

Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP Features Applications ● Ideal for indication light on hand held products z Backlighting for tell-tale indicators ● Long life and robust package z Dashboard lighting ● Variety of lens types and color choices available z Interior lighting (footwell, dome light, accent lighting, etc.) ● Standard Package: 2,000pcs/ Reel z Exterior lighting (turn signals, side markers, CHMSL, etc.) ● MSL (Moisture Sensitivity Level): 3 z Signs and signals ● RoHS compliant z Various applications requiring high temperature rating ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ± 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 1/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 2/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP Part Number Dice XZCBD80S-2HTA Blue (InGaN) Luminous Intensity CIE127-2007* (IF=20mA) mcd Lens-color Water Clear Viewing Angle 2θ 1/2[1] Code. min. max. M* 80* 120* N* 120* 200* P* 200* 300* 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. * luminous intensity value is in accordance with CIE127-2007 standards. Absolute Maximum Ratings at Ta=25°C Parameter Symbol Value Unit Power dissipation PD 80 mW Reverse Voltage VR 5 V Junction temperature[1] TJ 115 °C Operating Temperature Top -40 To +100 °C Storage Temperature Tstg -40 To +110 °C IF 20 mA IFM 150 mA 250 V 570 °C/W DC Forward Current[1] Peak Forward Current [2] Electrostatic Discharge Threshold (HBM) Thermal Resistance (Junction/ambient) [1] Rth j-a Notes: 1. Rth(j-a) Results from mounting on PC board FR4 (pad size≥16 mm 2 per pad), 2. 1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at Ta=25°C Parameter Symbol Wavelength at peak emission CIE127-2007* Dominant Wavelength CIE127-2007* Spectral bandwidth at 50%Φ REL MAX Forward Voltage IF=20mA IF=20mA IF=20mA [Typ.] IF=20mA Value Code. Min. λpeak λdom [1] Typ. Max. 460* nm 1B* 463* 466* 2A* 466* 469* 2B* 469* 471* 3A* 471* 473* 3B* 473* 475* Δλ 25 VF [2] 3.3 Unit nm nm 4.0 V 50 uA Reverse Current (VR = 5V) IR Temperature coefficient of λpeak IF=20mA, -10°C≤ T≤100°C [Typ.] TCλpeak 0.05 nm/ °C Temperature coefficient of λdom IF=20mA, -10°C≤ T≤100°C [Typ.] TCλdom 0.03 nm/ °C Temperature coefficient of VF IF=20mA, -10°C≤ T≤100°C TCV -2.5 mV/ °C *Wavelength value is in accordance with CIE127-2007 standards. Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 3/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 4/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. Reel Dimension Recommended Soldering Pattern (Units : mm; Tolerance: ±0.1) ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 5/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Nov 20,2013 XDSB6460 V2-Z Layout: Maggie P. 6/7 Part Number: XZCBD80S-2HTA 2.2x1.4mm SURFACE MOUNT LED LAMP Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% No. Test Item Standards 1 Continuous operating test 2 High Temp. operating test 3 Low Temp. operating test 4 High temp. storage test 5 Low temp. storage test 6 High temp. & humidity storage test 7 High temp. & humidity operating test 8 Soldering reliability test 9 Thermal shock operating test 10 Thermal shock test 11 Electric Static Discharge (ESD) 12 Vibration test Test Times / Number of Cycles Damaged Test Condition - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22 Ta = 100°C IF = derated current at 100°C 1,000 h 0 / 22 Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22 EIAJ ED-4701/100 (201) Ta = maximum rated storage temperature 1,000 h 0 / 22 EIAJ ED-4701/100 (202) Ta = -40°C 1,000 h 0 / 22 - Ta = 60°C, RH = 90% 500 h 0 / 22 - Ta = 60°C, RH = 90% IF = derated current at 60°C 500 h 0 / 22 Moisture soak : 30°C,70% RH, 72h Preheat : 150~180°C(120s max.) Soldering temp : 260°C(10s) 2 times 0 / 18 - Ta = -40°C(15min) ~ 100°C(15min) IF = derated current at 100°C 1,000 cycles 0 / 22 - Ta = -40°C(15min) ~ 100°C(15min) 1,000 cycles 0 / 22 C = 100pF , R2 = 1.5KΩ V = 250V Once each Polarity 0 / 22 a = 196m/s² , f = 100~2KHz , t = 48min for all xyz axes 4 times 0 / 22 EIAJ ED-4701/100 (101) - EIAJ ED-4701/100 (301) EIAJ ED-4701/100 (304) - * : Refer to forward current vs. derating curve diagram Failure Criteria Items Symbols Conditions Failure Criteria luminous Intensity lv IF = 20mA Testing Min. Value