XZFBB45S-9

Part Number: XZFBB45S-9 3.2 x 2.8 mm PLCC2 SMD LED Features Package Schematics ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● Halogen-free ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Blue (InGaN) Unit Reverse Voltage VR 5 V Forward Current IF 30 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD 120 Operating Temperature TA -40 ~ +85 Storage Temperature Tstg 100 250 3.3 V Forward Voltage (Max.) (IF=20mA) VF 4 V Reverse Current (Max.) (VR=5V) IR 50 µA λP 465* nm °C Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) V Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 470* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 22 nm C 100 pF mA mW Capacitance (Typ.) (VF=0V, f=1MHz) XZFBB45S-9 Emitting Color Blue Unit VF A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Part Number Blue (InGaN) Forward Voltage (Typ.) (IF=20mA) -40 ~ +85 Electrostatic Discharge Threshold (HBM) Operating Characteristics (TA=25°C) Emitting Material InGaN Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd min. typ. 300* 447* Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 465* 120° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Nov 30,2020 XDSB4898 V9-Z Layout: Maggie L. P. 1/5 Part Number: XZFBB45S-9 3.2 x 2.8 mm PLCC2 SMD LED Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Nov 30,2020 XDSB4898 V9-Z Layout: Maggie L. P. 2/5 Part Number: XZFBB45S-9 3.2 x 2.8 mm PLCC2 SMD LED Blue Relative Radiant Intensity 100% Ta = 25 °C 15° Ta = 25 °C 0° 1.0 30° 80% 45° 60% 40% 60° 20% 0.5 75° 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 90° 0° 15° 30° 45° 60° 75° 0.0 90° Spatial Distribution Relative Intensity Vs. CIE Wavelength Forward current (mA) Ta = 25 °C 40 30 20 10 0 2.0 2.4 2.8 3.2 3.6 Forward voltage (V) Forward Current vs. Forward Voltage 4.0 2.5 Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 Forward current (mA) Luminous Intensity vs. Forward Current 50 50 Luminous intensity normalised at T a = 25 °C Luminous intensity normalised at 20 mA 50 Permissible forward current (mA)
Blue 40 30 20 10 0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Forward Current Derating Curve -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Luminous Intensity vs. Ambient Temperature LED is recommended for reflow soldering and soldering profile is shown below. Nov 30,2020 XDSB4898 V9-Z Layout: Maggie L. P. 3/5 Part Number: XZFBB45S-9 3.2 x 2.8 mm PLCC2 SMD LED
The device has a single mounting surface. The device must be mounted according to the specifications.
Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1)
Reel Dimension (Units : mm)
Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Nov 30,2020 XDSB4898 V9-Z Layout: Maggie L. P. 4/5 Part Number: XZFBB45S-9 3.2 x 2.8 mm PLCC2 SMD LED PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at https://www.SunLEDusa.com/TechnicalNotes.asp Nov 30,2020 XDSB4898 V9-Z Layout: Maggie L. P. 5/5