Part Number: XZFBB45S
3.5 x 2.8 mm PLCC2 SMD LED
Features
Package Schematics
● Ideal for indication light on hand held products
● Long life and robust package
● Standard Package: 2000pcs/ Reel
● MSL (Moisture Sensitivity Level): 3
● Halogen-free
● RoHS compliant
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(TA=25°C)
Blue
(InGaN)
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
30
mA
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
iFS
Power Dissipation
PD
120
Operating Temperature
TA
-40 ~ +85
Storage Temperature
Tstg
100
250
3.3
V
Forward Voltage (Max.)
(IF=20mA)
VF
4
V
Reverse Current (Max.)
(VR=5V)
IR
50
µA
λP
465*
nm
°C
Wavelength of Peak
Emission CIE127-2007* (Typ.)
(IF=20mA)
V
Wavelength of Dominant
Emission CIE127-2007* (Typ.)
(IF=20mA)
λD
470*
nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=20mA)
△λ
22
nm
C
100
pF
mA
mW
Capacitance (Typ.)
(VF=0V, f=1MHz)
XZFBB45S
Emitting
Color
Blue
Unit
VF
A Relative Humidity between 40% and 60% is recommended in
ESD-protected work areas to reduce static build up during assembly
process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033)
Part
Number
Blue
(InGaN)
Forward Voltage (Typ.)
(IF=20mA)
-40 ~ +85
Electrostatic Discharge Threshold
(HBM)
Operating Characteristics
(TA=25°C)
Emitting
Material
InGaN
Lens-color
Water Clear
Luminous Intensity
CIE127-2007*
(IF=20mA)
mcd
min.
typ.
300*
447*
Wavelength
CIE127-2007*
nm
λP
Viewing
Angle
2θ 1/2
465*
120°
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
Nov 30,2020
XDSB4878
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Part Number: XZFBB45S
3.5 x 2.8 mm PLCC2 SMD LED
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise
pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Nov 30,2020
XDSB4878
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Part Number: XZFBB45S
3.5 x 2.8 mm PLCC2 SMD LED
Blue
Relative Radiant Intensity
100%
15°
Ta = 25 °C
Ta = 25 °C
0°
1.0
30°
80%
45°
60%
60°
40%
20%
0.5
75°
0%
350
400
450
500
550
600
Wavelength (nm)
650
700
750
90°
800
0°
Relative Intensity Vs. CIE Wavelength
15°
30°
45°
60°
75°
0.0
90°
Spatial Distribution
Forward current (mA)
Ta = 25 °C
40
30
20
10
0
2.0
2.4
2.8
3.2
3.6
Forward voltage (V)
Forward Current vs.
Forward Voltage
4.0
2.5
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
0
10
20
30
40
Forward current (mA)
Luminous Intensity vs.
Forward Current
50
50
Luminous intensity normalised
at T a = 25 °C
Luminous intensity normalised
at 20 mA
50
Permissible forward current (mA)
Blue
40
30
20
10
0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Forward Current
Derating Curve
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous Intensity vs.
Ambient Temperature
LED is recommended for reflow soldering and
soldering profile is shown below.
Nov 30,2020
XDSB4878
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Part Number: XZFBB45S
3.5 x 2.8 mm PLCC2 SMD LED
The device has a single mounting surface.
The device must be mounted according to
the specifications.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Reel Dimension (Units : mm)
Tape Specification (Units : mm)
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Nov 30,2020
XDSB4878
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Part Number: XZFBB45S
3.5 x 2.8 mm PLCC2 SMD LED
PACKING & LABEL SPECIFICATIONS
TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at https://www.SunLEDusa.com/TechnicalNotes.asp
Nov 30,2020
XDSB4878
V7-Z
Layout: Maggie L.
P. 5/5
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