XZFBB53W-8ST

Part Number: XZFBB53W-8ST 1.6 x 0.8 mm SMD Chip LED Lamp Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 4,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Blue (InGaN) Unit Reverse Voltage VR 5 V Forward Current IF 30 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD 100 Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature mA 120 mW 250 V TA -40 ~ +85 Tstg -40 ~ +85 °C A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Operating Characteristics (TA=25°C) XZFBB53W-8ST Emitting Color Blue Emitting Material InGaN Unit Forward Voltage (Typ.) (IF=20mA) VF 3.3 V Forward Voltage (Max.) (IF=20mA) VF 4 V Reverse Current (Max.) (VR=5V) IR 50 uA Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λP 465* nm Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 470* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 22 nm C 100 pF Capacitance (Typ.) (VF=0V, f=1MHz) Part Number Blue (InGaN) Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd min. typ. 80* 258* Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 465* 100° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Jun 01,2017 XDSB8572 V1-Z Layout: Maggie L. P. 1/4 Part Number: XZFBB53W-8ST 1.6 x 0.8 mm SMD Chip LED Lamp Blue Relative Radiant Intensity 100% Ta = 25 °C 80% 60% 40% 20% 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 Relative Intensity Vs. CIE Wavelength ™ Blue LED is recommended for reflow soldering and soldering profile is shown below. Jun 01,2017 XDSB8572 V1-Z Layout: Maggie L. P. 2/4 Part Number: XZFBB53W-8ST 1.6 x 0.8 mm SMD Chip LED Lamp ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ Reel Dimension ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Jun 01,2017 XDSB8572 V1-Z Layout: Maggie L. P. 3/4 Part Number: XZFBB53W-8ST 1.6 x 0.8 mm SMD Chip LED Lamp PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Jun 01,2017 XDSB8572 V1-Z Layout: Maggie L. P. 4/4