Part Number: XZFBBM2ACRDG92W-3
3.5 x 3.5 mm Surface Mount SMD Chip LED
Features
Package Schematics
● Ideal for indication light on hand held products
● Long life and robust package
● Standard Package: 2,000pcs/ Reel
● MSL (Moisture Sensitivity Level): 3
● Halogen-free
● RoHS compliant
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(TA=25°C)
Blue
(InG
aN)
Red
(AlGaI
nP)
Green
(InGa Unit
N)
2.2
3.2
V
mA
Forward Voltage (Max.)
(IF=20mA)
VF
4
2.8
4
V
100
mA
Reverse Current (Max.)
(VR=5V)
IR
50
10
50
µA
84
120
mW
λP
465*
640*
520*
nm
3000
450
V
Wavelength of Peak
Emission CIE127-2007*(Typ.)
(IF=20mA)
Wavelength of Dominant
Emission CIE127-2007*(Typ.)
(IF=20mA)
λD
470*
625*
525*
nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=20mA)
△λ
22
25
35
nm
C
100
27
100
pF
5
5
V
Forward Current
IF
30
30
30
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
iFS
100
150
Power Dissipation
PD
120
250
TA
-40 ~ +85
°C
Tstg
A Relative Humidity between 40% and 60% is recommended in
ESD-protected work areas to reduce static build up during assembly
process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033)
Capacitance (Typ.)
(VF=0V, f=1MHz)
Part
Number
XZFBBM2ACRDG92W-3
Green
Unit
(InGaN)
3.3
5
Storage Temperature
Red
(AlGaIn
P)
VF
VR
Operating Temperature
Blue
(InGaN)
Forward Voltage (Typ.)
(IF=20mA)
Reverse Voltage
Electrostatic Discharge Threshold
(HBM)
Operating Characteristics
(TA=25°C)
Emitting
Color
Emitting
Material
Blue
InGaN
Red
AlGaInP
Green
InGaN
Lens-color
Water Clear
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
Feb 04,2021
Luminous Intensity
CIE127-2007*
(IF=20mA) mcd
Wavelength
CIE127-2007*
nm λP
min.
typ.
300*
497*
465*
1000*
1590*
640*
1300*
1890*
520*
XDSB6145
V5-Z
Viewing
Angle
2θ 1/2
50°
Layout: Maggie L.
P. 1/4
Part Number: XZFBBM2ACRDG92W-3
3.5 x 3.5 mm Surface Mount SMD Chip LED
Blue
Green
Red
Relative Radiant Intensity
100%
Ta = 25 °C
0°
15°
Ta = 25 °C
1.0
30°
80%
45°
60%
60°
0.5
40%
75°
20%
0%
90°
350
400
450
500
550
600
Wavelength (nm)
650
700
750
0°
800
15°
30°
45°
60°
75°
0.0
90°
Spatial Distribution
Relative Intensity Vs. CIE Wavelength
Forward current (mA)
Ta = 25 °C
40
30
20
10
0
2.0
2.4
2.8
3.2
3.6
Forward voltage (V)
Forward Current vs.
Forward Voltage
2.5
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
4.0
0
10
20
30
40
Forward current (mA)
Luminous Intensity vs.
Forward Current
50
Luminous intensity normalised
at T a = 25 °C
Luminous intensity normalised
at 20 mA
50
Permissible forward current (mA)
Blue
40
30
20
10
0
50
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous Intensity vs.
Ambient Temperature
Forward Current
Derating Curve
Forward current (mA)
Ta = 25 °C
40
30
20
10
0
1.5
2.5
50
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
1.7
1.9
2.1
2.3
Forward voltage (V)
Forward Current vs.
Forward Voltage
2.5
Luminous intensity normalised
at T a = 25 °C
50
Permissible forward current
(mA)
Luminous intensity normalised
at 20 mA
Red
40
30
20
10
0
0
10
20
30
40
Forward current (mA)
Luminous Intensity vs.
Forward Current
50
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Forward Current
Derating Curve
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous Intensity vs.
Ambient Temperature
Forward current (mA)
Ta = 25 °C
40
30
20
10
0
2.0
2.5
3.0
3.5
4.0
Forward voltage (V)
Forward Current vs.
Forward Voltage
Feb 04,2021
4.5
2.5
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
0
10
20
30
40
Forward current (mA)
Luminous Intensity vs.
Forward Current
50
50
Luminous intensity normalised
at T a = 25 °C
Luminous intensity normalised
at 20 mA
50
Permissible forward current (mA)
Green
40
30
20
10
0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Forward Current
Derating Curve
XDSB6145
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous Intensity vs.
Ambient Temperature
V5-Z
Layout: Maggie L.
P. 2/4
Part Number: XZFBBM2ACRDG92W-3
3.5 x 3.5 mm Surface Mount SMD Chip LED
LED is recommended for reflow soldering and
soldering profile is shown below.
The device has a single mounting surface.
The device must be mounted according to the
specifications.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specification (Units : mm)
Reel Dimension (Units : mm)
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Feb 04,2021
XDSB6145
V5-Z
Layout: Maggie L.
P. 3/4
Part Number: XZFBBM2ACRDG92W-3
3.5 x 3.5 mm Surface Mount SMD Chip LED
PACKING & LABEL SPECIFICATIONS
TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at https://www.SunLEDusa.com/TechnicalNotes.asp
Feb 04,2021
XDSB6145
V5-Z
Layout: Maggie L.
P. 4/4
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