XZFBBMDKDG92W-3

Part Number: XZFBBMDKDG92W-3 3.5X3.5mm SURFACE MOUNT SMD CHIP LED Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) FBB MDK (InGa (AlGa N) InP) DG (InG aN) Unit FBB (InGa N) Operating Characteristics (TA=25°C) MDK DG (AlGaIn (InGaN Unit P) ) Reverse Voltage VR 5 5 5 V Forward Voltage (Typ.) (IF=20mA) VF 3.3 1.95 3.3 V Forward Current IF 30 30 25 mA Forward Voltage (Max.) (IF=20mA) VF 4 2.5 4.1 V Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width Reverse Current (Max.) (VR=5V) IR 50 10 50 uA iFS 100 185 150 mA λP 465* 645* 515* nm Power Dissipation PD 120 75 102.5 mW Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) 250 - 450 V Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 470* 630* 525* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 22 28 30 nm C 100 35 45 pF Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature TA Tstg -40 ~ +85 °C Capacitance (Typ.) (VF=0V, f=1MHz) Part Number XZFBBMDKDG92W-3 Emitting Color Emitting Material Blue InGaN Red AlGaInP Green InGaN Lens-color Water Clear *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Mar 06,2014 Luminous Intensity CIE127-2007* (IF=20mA) mcd Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 min. typ. 300 300* 497 497* 465* 45° 700 300* 1295 497* 645* 60° 700 700* 1195 1195* 515* 40° XDSB4927 V3-X Layout: Maggie L. P. 1/5 Part Number: XZFBBMDKDG92W-3 3.5X3.5mm SURFACE MOUNT SMD CHIP LED  FBB Mar 06,2014 XDSB4927 V3-X Layout: Maggie L. P. 2/5 Part Number: XZFBBMDKDG92W-3 3.5X3.5mm SURFACE MOUNT SMD CHIP LED  MDK  DG Mar 06,2014 XDSB4927 V3-X Layout: Maggie L. P. 3/5 Part Number: XZFBBMDKDG92W-3 3.5X3.5mm SURFACE MOUNT SMD CHIP LED LED is recommended for reflow soldering and soldering profile is shown below.  The device has a single mounting surface. The device must be mounted according to the specifications.  Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1)  Tape Specification (Units : mm)  Reel Dimension Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Mar 06,2014 XDSB4927 V3-X Layout: Maggie L. P. 4/5 Part Number: XZFBBMDKDG92W-3 3.5X3.5mm SURFACE MOUNT SMD CHIP LED PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Mar 06,2014   XDSB4927 V3-X Layout: Maggie L. P. 5/5