XZM2CYKM2DG55W-8

Part Number: XZM2CYKM2DG55W-8 3.2x1.6mm SMD CHIP LED LAMP Features Package Schematics ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant YELLOW GREEN ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Yellow (AlGaInP) Green (InGaN) Unit Reverse Voltage VR 5 5 V Forward Current IF 30 30 mA Operating Characteristics (TA=25°C) Yellow (AlGaInP) Green (InGaN) Unit Forward Voltage (Typ.) (IF=20mA) VF 2 3.2 V Forward Voltage (Max.) (IF=20mA) VF 2.5 4 V Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS 140 100 mA Reverse Current (Max.) (VR=5V) IR 10 50 uA Power Dissipation PD 75 120 mW λP 590* 520* nm 3000 450 V Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) °C Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 590* 525* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 20 35 nm C 45 100 pF Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature TA -40 ~ +85 Tstg -40 ~ +85 A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Capacitance (Typ.) (VF=0V, f=1MHz) Part Number XZM2CYKM2DG55W-8 Emitting Color Emitting Material Yellow AlGaInP Green InGaN Lens-color Water Clear *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Jul 25,2016 Luminous Intensity CIE127-2007* (IF=20mA) mcd Wavelength CIE127-2007* nm λP min. typ. 700* 1195* 590* 700* 1295* 520* SDSB0050 V1-Z Viewing Angle 2θ 1/2 30° Layout: Maggie L. P. 1/4 Part Number: XZM2CYKM2DG55W-8 3.2x1.6mm SMD CHIP LED LAMP Green Yellow ™ Yellow ™ Green Jul 25,2016 SDSB0050 V1-Z Layout: Maggie L. P. 2/4 Part Number: XZM2CYKM2DG55W-8 3.2x1.6mm SMD CHIP LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ Tape Specification (Units : mm) ™ Reel Dimension Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Jul 25,2016 SDSB0050 V1-Z Layout: Maggie L. P. 3/4 Part Number: XZM2CYKM2DG55W-8 3.2x1.6mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS XZxx55x-8 TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Jul 25,2016   SDSB0050 V1-Z Layout: Maggie L. P. 4/4