XZM2MR55W

Part Number: XZM2MR55W 3.2x1.6mm SMD CHIP LED LAMP Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Red (AlGaInP) Unit Reverse Voltage VR 5 V Forward Current IF 30 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS 150 mA Power Dissipation PD 75 mW Operating Temperature TA -40 ~ +85 Tstg -40 ~ +85 Storage Temperature °C A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Operating Characteristics (TA=25°C) XZM2MR55W Emitting Color Red Emitting Material AlGaInP Unit Forward Voltage (Typ.) (IF=20mA) VF 2.1 V Forward Voltage (Max.) (IF=20mA) VF 2.5 V Reverse Current (Max.) (VR=5V) IR 10 uA Wavelength of Peak Emission CIE127-2007*(Typ.) (IF=20mA) λP 660* nm Wavelength of Dominant Emission CIE127-2007*(Typ.) (IF=20mA) λD 640* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 20 nm C 45 pF Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 660* 160° Capacitance (Typ.) (VF=0V, f=1MHz) Part Number Red (AlGaInP) Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd min. typ. 400 120* 597 198* *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Feb 09,2017 XDSB8900 V1-X Layout: Maggie L. P. 1/4 Part Number: XZM2MR55W 3.2x1.6mm SMD CHIP LED LAMP Red Relative Radiant Intensity 100% Ta = 25 °C 80% 60% 40% 20% 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 Relative Intensity Vs. CIE Wavelength ™ Red LED is recommended for reflow soldering and soldering profile is shown below. Feb 09,2017 XDSB8900 V1-X Layout: Maggie L. P. 2/4 Part Number: XZM2MR55W 3.2x1.6mm SMD CHIP LED LAMP ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ Reel Dimension ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Feb 09,2017 XDSB8900 V1-X Layout: Maggie L. P. 3/4 Part Number: XZM2MR55W 3.2x1.6mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS XZxxx55x TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Feb 09,2017 XDSB8900 V1-X Layout: Maggie L. P. 4/4