XZM2MRTNI55W-8

Part Number: XZM2MRTNI55W-8 3.2x1.6mm SMD CHIP LED LAMP Features Package Schematics ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant RED ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Red (AlGaInP) TNI (GaAs) Unit Reverse Voltage VR 5 5 V Forward Current IF 30 50 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD Operating Temperature TA -40 ~ +85 Tstg -40 ~ +85 Storage Temperature 150 1200 75 80 Operating Characteristics (TA=25°C) mA mW °C A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Emitting Color Emitting Material Red AlGaInP - GaAs XZM2MRTNI55W-8 Lens-color Water Clear TNI (GaAs) Unit Forward Voltage (Typ.) (IF=20mA) VF 2.1 1.2 V Forward Voltage (Max.) (IF=20mA) VF 2.5 1.6 V Reverse Current (Max.) (VR=5V) IR 10 10 uA Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λP 660* 940* nm Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 640* - nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 20 50 nm C 45 90 pF Capacitance (Typ.) (VF=0V, f=1MHz) Part Number Red (AlGaInP) Radiant Intensity CIE127-2007* (Po =mW/sr) @20mA Luminous Intensity CIE127-2007* (IF=20mA) mcd Wavelength CIE127-2007* nm λ P min. typ. min. typ. - - 500 120* 1295 397* 660* 1.2 0.8* 2.3 1.3* - - 940* *Luminous/radiant intensity value and wavelength are in accordance with CIE127-2007 standards. Feb 22,2017 XDSB8904 Viewing Angle 2 θ 1/2 30° V1-X Layout: Maggie L. P. 1/4 Part Number: XZM2MRTNI55W-8 3.2x1.6mm SMD CHIP LED LAMP ™ Red ™ TNI LED is recommended for reflow soldering and soldering profile is shown below. Feb 22,2017 XDSB8904 V1-X Layout: Maggie L. P. 2/4 Part Number: XZM2MRTNI55W-8 3.2x1.6mm SMD CHIP LED LAMP ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ Reel Dimension ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage , Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Feb 22,2017 XDSB8904 V1-X Layout: Maggie L. P. 3/4 Part Number: XZM2MRTNI55W-8 3.2x1.6mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS XZxxx55xx TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Feb 22,2017   XDSB8904 V1-X Layout: Maggie L. P. 4/4