XZMD20X92S-4

Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP Features Applications 3.5mm X 3.5mm X 1.15mm SMD LED Signal and symbol luminaire for orientation. Zener diode provided for ESD Protection Marker lights (e.g. steps, exit ways, etc). IR-reflow compatible Decorative and entertainment lighting. Ideal for accent lighting Commercial and residential lighting. Standard Package: 2,000pcs / Reel Automotive interior lighting. MSL (Moisture Sensitivity Level): 2a RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 1/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 2/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP Selection Guide Part Number Emitting Color XZMD20X92S-4 Emitting Material Deep-Red AlGaInP Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=150mA) cd Luminous Flux CIE127-2007* (IF=150mA) lm min. typ. min. typ. 1.6* 2.09* 5* 6.3* Viewing Angle 2 θ 1/2 [1] 120° Notes: 1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. LEDs are binned according to their luminous flux. * Luminous intensity / luminous flux value is in accordance with CIE127-2007 standards. Absolute Maximum Ratings at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 465 mW Junction Temperature [1] TJ 120 °C Operating Temperature Top -40 To +100 °C Storage Temperature Tstg -40 To +110 °C IF 150 mA DC Forward Current [1] Reverse Voltage VR 5 V Peak Forward Current [2] IFM 270 mA Thermal Resistance [1] (Junction/ambient) Rth j-a 178 °C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 78 °C/W 8000 V Electrostatic Discharge Threshold (HBM) Notes: 1. Rth(j-a) Results from mounting on PC board FR4 (pad size≥16 mm 2 per pad) 2. 1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA=25°C Value Parameter Symbol Wavelength at peak emission CIE127-2007* IF=150mA λpeak 660* nm Dominant Wavelength CIE127-2007* IF=150mA λdom [1] 640* nm △λ 20 nm VF [2] 2.5 Spectral bandwidth at 50% Φ Forward Voltage REL MAX IF = 150mA IF=150mA Typ. Max. Unit 3.1 V 85 mA Allowable Reverse Current IR Temperature coefficient of λpeak IF=150mA, -10°C≤ T≤100°C TCλpeak 0.09 nm/ °C Temperature coefficient of λdom IF=150mA, -10°C≤ T≤100°C TCλdom 0.03 nm/ °C Temperature coefficient of VF IF=150mA, -10°C≤ T≤100°C TCV -2.7 mV/ °C Notes: 1.The dominant Wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward Voltage: +/-0.1V. *Wavelength value is in accordance with CIE127-2007 standards. Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 3/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 4/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 5/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. The device has a single mounting surface. The device must be mounted according to the specifications. Reel Dimension Recommended Soldering Pattern Tape Specification (Units : mm) Dec 16, 2013 XDSB6939 V2-Z Layout: Maggie L. P. 6/7 Part Number: XZMD20X92S-4 3.5x3.5 mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Dec 16, 2013   XDSB6939 V2-Z Layout: Maggie L. P. 7/7