XZMDH160S

Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE ATTENTION Features ● 3.45mm X 3.45mm X 2.0mm SMD LED OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES ● Zener diode provided for ESD Protection ● IR-reflow compatible ● White ceramic package with silicone resin ● Standard Package: 1,000pcs / Reel ● MSL (Moisture Sensitivity Level): 1 ● RoHS compliant Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 1/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE Part Number Emitting Color (Material) XZMDH160S Red (AlGaInP) Water Clear Viewing Angle 2 θ 1/2 [1] Φv (lm) [2] CIE127-2007* (IF=350mA) Lens-color Code. Min. Max. B8* 35* 42* B9* 42* 50* B10* 50* 60* typ. 120° 42.7* Notes: 1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous flux is in accordance with CIE127-2007 standards. Absolute Maximum Ratings at TA=25°C Parameter Symbol Value Unit IF 350 mA Peak Forward Current [2] IFM 500 mA Power dissipation PD 1.05 W Reverse Voltage VR 5 V Operating Temperature Top -40 To +100 °C Storage Temperature Tstg -40 To +110 °C TJ 110 °C Thermal resistance [1] (Junction/ambient) Rth j-a 80 °C/W Thermal resistance [1] (Junction/solder point) Rth j-s 15 °C/W DC Forward Current [1] Junction temperature[1] Notes: 1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. 3. A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Electrical / Optical Characteristics at TA=25°C Parameter Symbol Value Unit Wavelength at peak emission CIE127-2007* IF = 350mA [Typ.] λpeak 640* nm Dominant Wavelength CIE127-2007* IF = 350mA [Typ.] λdom [1] 625* nm △λ 20 nm IR 85 mA Spectral bandwidth at 50% Φ REL MAX IF = 350mA [Typ.] Allowable Reverse Current [Max.] Forward Voltage IF = 350mA [Min.] Forward Voltage IF = 350mA [Typ.] 2.0 VF [2] Forward Voltage IF = 350mA [Max.] 2.5 V 3.0 Temperature coefficient of λpeak IF = 350mA, -10°C ≤ T ≤ 100°C [Typ.] TCλpeak 0.14 nm/°C Temperature coefficient of λdom IF = 350mA, -10°C ≤ T ≤ 100°C [Typ.] TCλdom 0.12 nm/°C Temperature coefficient of VF IF = 350mA, -10°C ≤ T ≤ 100°C [Typ.] TCV -3.0 mV/°C Notes: 1. Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. * Wavelength value is traceable to CIE127-2007 standards. Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 2/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE XZMDH160S Red Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 3/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE Heat Generation: 1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. 2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please Also take meas ures to remove heat from the area near the LED to improve the operational characteristics on the LED. 3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts Tj = Ta + Rthj-a *W ……… ① Tj = Ts + Rthj-s *W ……… ② Tj = dice junction temperature: °C Ta = ambient temperature:°C Ts = solder point temperature:°C Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C/ W Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C/ W W = inputting power (IFx VF) : W Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 4/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE ™ Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ±0.1) ™ Reel Dimension ™ Tape Specification (Units : mm) Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 5/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE PACKING & LABEL SPECIFICATIONS XZxxx160x TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 6/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. There should be enough space inside the nozzle to avoid contact with the dome lens during pick up. 4.2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 7/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE Designing the Position of LED on a Board. 1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. Appropriate LED mounting is to place perpendicularly against the stress affected side. 2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed. Refer to the following figure. 3.Do not split board by hand.Split with exclusive special tool. 4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack. For this reason,it is recommended an appropriate verification should be taken before use. JEDEC Moisture Sensitivity: Level Soak Requirements Floor Life Standard 1 Accelerated Equivalent Time Conditions Time (hours) Conditions Unlimited £ 30 °C / 85% RH 168 +5/-0 85 °C / 85% RH Time (hours) Conditions SunLED recommends keeping the LEDs in the sealed moisture-barrier packaging until immediately prior to use. Any unused LEDs should be returned to the moisture-barrier bag and closed immediately after use. ESD Protection During Production Electric static discharge can result when static-sensitive products come in contact with the operator or other conductors. The following procedures may decrease the possibility of ESD damage: 1.Minimize friction between the product and surroundings to avoid static buildup. 2.All production machinery and test instruments must be electrically grounded. 3.Operators must wear anti-static bracelets. 4.Wear anti-static suit when entering work areas with conductive machinery. 5.Set up ESD protection areas using grounded metal plating for component handling. 6.All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less. 7.Maintain a humidity level of 50% or higher in production areas. 8.Use anti-static packaging for transport and storage. 9.All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality. Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 8/9 Part Number: XZMDH160S 3.45X3.45mm SMD LED WITH CERAMIC SUBSTRATE Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% Standards Test Condition Number of Damaged No. Test Item 1 Continuous operating test - Ta =25°C +10/-5°C ,RH=55+/-20%RH IF = maximum rated current* 1,000 h 0 / 22 2 High Temp. operating test - Ta = 100°C(+/-10°C) IF = maximum rated current* 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40°C+3/-5°C IF = maximum rated current* 1,000 h 0 / 22 4 High temp. storage test JEITA ED4701/200 201 Ta = 100°C(+/-10°C) Ta = maximum rated storage temperature 1,000 h 0 / 22 5 Low temp. storage test JEITA ED4701/200 202 Ta = -40°C+3/-5°C 1,000 h 0 / 22 6 High temp. & humidity storage test JEITA ED4701/100 103 Ta = 60°C+5/-3°C, RH = 90+5/-10%RH 1,000 h 0 / 22 7 High temp. & humidity operating test Ta = 60°C+5/-3°C, RH = 90%+5/-10%RH IF = maximum rated current* 1,000h 0 / 22 8 Resistance to Soldering Heat (Reflow Soldering) JEITA ED4701/300 301 Tsld=260°C,10sec 2 times 0 / 22 9 Solderability (Reflow Soldering) JEITA ED4701/303 303A 1 time over 95% 0 / 22 10 Temperature Cycle operating test -40°C(30min) ~25°C(5min)~100°C (30min) ~25°C(5min) IF = derated current at 100°C 10cycles 0 / 22 11 Temperature Cycle -40°C(30min) ~25°C(5min)~100°C (30min) ~25°C(5min) 100cycles 0 / 22 12 Thermal shock test Ta = -40°C(15min) ~100°C(15min) 500 cycles 0 / 22 13 Electric Static Discharge (ESD) JEITA ED4701/300 304 C = 100pF , R= 1.5KΩ V = 8000 V 3 times Negative/Positive 0 / 22 14 Vibration test JEITA ED4701/400 403 100~2000~100HZ Sweep 4min. 200m/s² 3directions,4cycles 48min. 0 / 22 - Test Times / Cycles Tsld=245°C+/-5°C,5+/-1sec JEITA ED4701/100 105 MIL-STD-202G Note : Refer to forward current vs. derating curve diagram. Failure Criteria Item Symbol Criteria for Judgement Test Conditions Min. Max. Forward Voltage VF IF = 350mA - Initial Level x 1.1 Luminous Flux Φv IF = 350mA Initial Level x 0.7 - Note: The test is performed after the board is cooled down to the room temperature. Sep 17,2016 XDSB7945 V2-Z Layout: Maggie L. P. 9/9