XZMOLA109FS

Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP Features ● 3.5mm X 2.8mm X 0.8mm SMD LED ● Ideal for indication for hand held products ● IR-reflow compatible ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES ● Ideal 0.5-Watt power for backlighting and accent lighting ● Special colors available ● Standard Package: 2000pcs / Reel ● MSL (Moisture Sensitivity Level): 2a ● RoHS compliant Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 1/6 Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 2/6 Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP Part Number Emitting Color XZMOLA109FS Red Emitting Material AlGaInP Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=150mA) mcd Luminous Flux CIE127-2007* (IF=150mA) mlm min. typ. min. typ. 3100* 4190* 8600* 11700* Wavelength CIE127-2007* nm λP Viewing Angle 2 θ 1/2 640* 120° Notes: LEDs are binned according to their luminous flux. *Luminous intensity/luminous flux value and wavelength are in accordance with CIE127-2007 standards. Absolute Maximum Ratings at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 450 mW Junction Temperature [1] TJ 110 °C Operating Temperature Top -40 ~ +85 °C Storage Temperature Tstg -40 ~ +85 °C IF 150 mA Peak Forward Current [3] IFM 350 mA Reverse Voltage DC Forward Current[1] VR 5 V Thermal Resistance [1] (Junction/ambient) Rth j-a 155 °C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 60 °C/W 8000 V Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size≥70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2.θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 3.1/10 Duty Cycle, 0.1ms Pulse Width. 4.A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Electrical / Optical Characteristics at TA=25°C Parameter Symbol Value Unit Wavelength at peak emission CIE127-2007* IF = 150mA [Typ.] λpeak 631* nm Dominant Wavelength CIE127-2007* IF = 150mA [Typ.] λdom [1] 623* nm Spectral Line Half-width IF = 150mA [Typ.] △λ 20 nm Capacitance [VF = 0V;f = 1MHz] C 27 pF Forward Voltage IF = 150mA [Typ.] Forward Voltage IF = 150mA [Max.] Allowable Reverse Current [Max.] VF [2] IR 2.5 V 3.0 10 mA *wavelength value is in accordance with CIE127-2007 standards. Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 3/6 Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 4/6 Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Reel Dimension ™ Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 5/6 Part Number: XZMOLA109FS 3.5x2.8 mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp   Sep 16, 2016 XDSB8558 V2-Z Layout: Maggie L. P. 6/6