XZMOLA92S-4

Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Application Note Static electricity and surge damage the LEDS. Features z Ideal for indication light on hand held products z Long life and robust package It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. z Variety of lens types and color choices available All devices, equipment and machinery must be electrically z ESD protection grounded. z Package: 2000pcs / reel z Moisture sensitivity level : level 2a z RoHS compliant Applications z Signal and symbol luminaire for orientation. z Marker lights (e.g. steps, exit ways, etc). z Decorative and entertainment lighting. z Commercial and residential lighting. z Automotive interior lighting. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 1/6 Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 2/6 Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Emitting Color Part Number XZMOLA92S-4 Red Emitting Material Luminous Intensity CIE127-2007* (IF=150mA) mcd Lens-color AlGaInP Water Clear Luminous Flux CIE127-2007* (IF=150mA) lm min. typ. min. typ. 2300* 3090* 10* 12.7* Viewing Angle 2 θ 1/2 [1] 120° Notes: 1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. LEDs are binned according to their luminous flux. * Luminous intensity / luminous flux value is in accordance with CIE127-2007 standards. Absolute Maximum Ratings at TA=25°C Symbol Value Unit Power Dissipation Parameter PD 450 mW Junction Temperature [1] TJ 110 °C Operating Temperature Top -40 ~ +85 °C Storage Temperature Tstg -40 ~ +85 °C IF 150 mA Peak Forward Current [3] IFM 270 mA Reverse Voltage VR 5 V Thermal Resistance [1] (Junction/ambient) Rth j-a 180 °C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 50 °C/W 8000 V DC Forward Current[1] Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size≥70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2.1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA=25°C Parameter Symbol Value Unit Wavelength at peak emission CIE127-2007* IF=150mA [Typ.] λpeak 640* nm Dominant Wavelength CIE127-2007* IF=150mA [Typ.] λdom [1] 625* nm Spectral Line Half-width IF=150mA [Typ.] △λ 25 nm Forward Voltage IF=150mA [Min.] Forward Voltage IF=150mA [Typ.] 2.0 VF [2] Forward Voltage IF=150mA [Max.] 2.5 V 3.0 Allowable Reverse Current [Max.] IR 85 mA Temperature coefficient of λpeak IF=150mA, -10°C≤ T≤100°C [Typ.] TCλpeak 0.11 nm/ °C Temperature coefficient of λdom IF=150mA, -10°C≤ T≤100°C [Typ.] TCλdom 0.09 nm/ °C Temperature coefficient of VF IF=150mA, -10°C≤ T≤100°C [Typ.] TCV -2.5 mV/ °C Notes: 1.The dominant Wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward Voltage: +/-0.1V. * Wavelength is in accordance with CIE127-2007 standards. Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 3/6 Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP XZMOLA92S-4 Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 4/6 Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Reel Dimension ™ Recommended Soldering Pattern ™ Tape Specification (Units : mm) Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 5/6 Part Number: XZMOLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Nov 15,2013 XDSB7604 V1-Z Layout: Maggie L. P. 6/6