XZMYKVG55W-8

Part Number: XZMYKVG55W-8 3.2x1.6mm SMD CHIP LED LAMP Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant YELLOW GREEN ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) Yellow (AlGaInP) Green (AlGaInP) Unit Reverse Voltage VR 5 5 V Forward Current IF 30 30 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD Operating Temperature TA -40 ~ +85 Tstg -40 ~ +85 Storage Temperature 175 150 75 75 mA mW °C A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process (Reference JEDEC/JESD625-A and JEDEC/J-STD-033) Operating Characteristics (TA=25°C) XZMYKVG55W-8 Sep 12,2016 Emitting Color Emitting Material Yellow AlGaInP Green AlGaInP Green (AlGaInP) Unit Forward Voltage (Typ.) (IF=20mA) VF 2 2.1 V Forward Voltage (Max.) (IF=20mA) VF 2.5 2.5 V Reverse Current (Max.) (VR=5V) IR 10 10 uA Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λP 590* 574* nm Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) λD 590* 570* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 20 20 nm C 20 15 pF Capacitance (Typ.) (VF=0V, f=1MHz) Part Number Yellow (AlGaInP) Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd Wavelength CIE127-2007* nm λP min. typ. 300* 597* 590* 120* 248* 574* XDSB1841 V3-Z Viewing Angle 2θ 1/2 30° Layout: Maggie L. P. 1/4 Part Number: XZMYKVG55W-8 3.2x1.6mm SMD CHIP LED LAMP Yellow ™ Yellow ™ Green Sep 12,2016 XDSB1841 V3-Z Layout: Maggie L. P. 2/4 Part Number: XZMYKVG55W-8 3.2x1.6mm SMD CHIP LED LAMP LED is recommended for reflow soldering and soldering profile is shown below. ™ The device has a single mounting surface. The device must be mounted according to the specifications. ™ Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) ™ Tape Specification (Units : mm) ™ Reel Dimension Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Sep 12,2016 XDSB1841 V3-Z Layout: Maggie L. P. 3/4 Part Number: XZMYKVG55W-8 3.2x1.6mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS XZxxx55xx TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Sep 12,2016   XDSB1841 V3-Z Layout: Maggie L. P. 4/4