XZMYLA92S-4

Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Features 3.5mm X 3.5mm X 1.15mm SMD LED Zener diode provided for ESD Protection Applications IR-reflow compatible Signal and symbol luminaire for orientation. Ideal for accent lighting Marker lights (e.g. steps, exit ways, etc). Standard Package: 2,000pcs / Reel Decorative and entertainment lighting. MSL (Moisture Sensitivity Level): 2a Commercial and residential lighting. RoHS compliant Automotive interior lighting. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Package Schematics Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 1/6 Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 2/6 Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP Selection Guide Part Number XZMYLA92S-4 Emitting Color Emitting Material Yellow Lens-color AlGaInP Luminous Intensity CIE127-2007* (IF=150mA)[2] cd Luminous Flux CIE127-2007* (IF=150mA)[2] lm min. typ. min. typ. 1.6* 2.69* 10* 13.7* Water Clear Viewing Angle 2 θ 1/2 [1] 120° Notes: 1. θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. LEDs are binned according to their luminous flux. * Luminous intensity / luminous flux value is in accordance with CIE127-2007 standards. Absolute Maximum Ratings at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 495 mW Junction Temperature [1] TJ 110 °C Operating Temperature Top -40 ~ +85 °C Storage Temperature Tstg -40 ~ +85 °C Reverse Voltage VR 5 V DC Forward Current [1] IF 150 mA IFM 270 mA Thermal Resistance [1] (Junction/ambient) Rth j-a 210 °C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 70 °C/W 8000 V Peak Forward Current [2] Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size ≥ 70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA = 25°C Parameter Wavelength at peak emission CIE127-2007* IF=150mA Dominant Wavelength CIE127-2007* IF=150mA [Typ.] [Typ.] Spectral Line Half-width IF=150mA [Typ.] Symbol Value Unit λpeak 590* nm λdom [1] 590* nm Δλ 20 nm Forward Voltage IF=150mA [Min.] Forward Voltage IF=150mA [Typ.] 2.2 VF [2] Forward Voltage IF=150mA [Max.] 2.7 V 3.3 Allowable Reverse Current [Max.] IR 85 mA Temperature coefficient of λpeak IF=150mA, -10°C≤ T≤100°C [Typ.] TCλpeak 0.13 nm/ °C Temperature coefficient of λdom IF=150mA, -10°C≤ T≤100°C [Typ.] TCλdom 0.10 nm/ °C Temperature coefficient of VF IF=150mA, -10°C≤ T≤100°C [Typ.] TCV -1.9 mV/ °C Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. * Wavelength is in accordance with CIE127-2007 standards. Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 3/6 Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP YELLOW MYLA Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 4/6 Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP The device has a single mounting surface. The device must be mounted according to the specifications. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Specification (Units : mm) Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 5/6 Part Number: XZMYLA92S-4 3.5x3.5 mm SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Nov 15,2013 XDSB7606 V1-Z Layout: Maggie L. P. 6/6