C1-1N5S-10

CERAMIC CHIP INDUCTORS 1. PART NO. EXPRESSION : C1 SERIES C1-1N0S-10 (a) (b) (c) (d) (a) Series code (b) Inductance code : 1N0 = 1.0nH (c) Tolerance code : S = ±0.3nH, J = ±5% (d) 10 : RoHS Compliant 2. CONFIGURATION & DIMENSIONS : A D B C Unit:m/m A 1.0±0.1 B 0.5±0.05 C 0.5±0.05 D 0.1 ~ 0.3 3. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -10°C to +40°C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265°C.6secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS 4. ELECTRICAL CHARACTERISTICS : Part Number C1-1N0S-10 C1-1N2S-10 C1-1N5S-10 C1-1N8S-10 C1-2N0S-10 C1-2N2S-10 C1-2N4S-10 C1-2N7S-10 C1-3N0S-10 C1-3N3S-10 C1-3N9S-10 C1-4N7S-10 C1-5N6S-10 C1-6N8J-10 C1-8N2J-10 C1-10NJ-10 C1-12NJ-10 C1-15NJ-10 C1-18NJ-10 C1-22NJ-10 C1-27NJ-10 C1-33NJ-10 C1-39NJ-10 C1-47NJ-10 C1-56NJ-10 C1-68NJ-10 C1-82NJ-10 C1-R10J-10 C1-R12J-10 Tolerance code : S : ±0.3nH J : ±5% Inductance ( nH ) 1.0 1.2 1.5 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 Q Min. 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 SRF ( GHz ) Min. 10 10 6 6 6 6 6 6 6 6 4 4 4 3.9 3.6 3.2 2.7 2.3 2.1 1.9 1.6 1.3 1.2 1.0 0.75 0.75 0.60 0.60 0.60 DCR () Max. 0.08 0.09 0.10 0.12 0.12 0.13 0.13 0.13 0.16 0.16 0.21 0.21 0.23 0.25 0.28 0.31 0.40 0.46 0.55 0.60 0.70 0.80 0.90 1.00 1.00 1.20 1.30 1.50 1.60 C1 SERIES Rated Current ( mA ) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 200 200 200 200 180 150 150 150 NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS 5. CHARACTERISTICS CURVES : C1 SERIES Inductance vs. Frequency Characteristics Q vs. Frequency Characteristics NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS 6. RELIABILITY & TEST CONDITION : C1 SERIES ITEM DC Resistance Terminal Strength PERFORMANCE Appearance : No significant abnormality Impedance change : Within ±30% DCR : Shall be satisfied TEST CONDITION HP4338 digital milli-ohm meter Solder chip on PCB and applied 10N (1.02Kgf) for 10sec Substrate Bending Strength Appearance : No significant abnormality Inductance change : Within ±20% DCR : Shall be satisfied Solder a chip on a test substrate, bend the substrate by 3mm hold for 10s and then return. Soldering shall be done in accordance with the recommended PC board pattern and reflow soldering 0.8 45 45 bending 100 40 unit : mm Resistance to Solder Heat Appearance : No significant abnormality Electrical and mechanical characteristics shall be satisfied Consult standard MIL-STD-202 METHOD 210 Preheat : 100 ~ 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 265±3°C Dip Time : 6±1sec. Measurement to be made after keeping at room temp for 24±2hrs Solder Temperature : 240±5°C Solder : Sn-Ag3.0-Cu0.5 Dip Time : 3±1sec. Temperature : 85±2°C Applied Current : rated current (max. value) Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Solderability More than 95% coverage of all metabolised area Consult standard J-STD-002 High Temperature Resistance Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Humidity Resistance Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Humidity : 90~95% RH. Temperature : 60±2°C Applied Current : rated current (max. value) Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Condition for 1 cycle Step1 : -40±3°C 30±3 min. Step2 : Room temperature 2 to 5 minutes Step3 : +85±2°C 30±3 min. Step4 : Room temperature 2 to 5 minutes Number of cycles : 100 Measurement : After placing for 24 hours (min.) at room ambient temperature Temperature Cycle Appearance : No mechanical damage. Inductance : Within ±20% of initial value. NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS 6. RELIABILITY & TEST CONDITION : C1 SERIES ITEM Low Temperature Storage test PERFORMANCE Appearance : No mechanical damage. Inductance : Within ±20% of initial value. TEST CONDITION Temperature : -40±2°C Duration : 1008±12hrs Measurement : After placing for 24 hours (min.) at room ambient temperature Temperature : -40°C, +85°C kept stabilized for 30 minutes each Cycle : 100 cycles Measurement : After placing for 24 hours (min.) at room ambient temperature Thermal Shock Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Vibration Test Appearance : No mechanical damage. Inductance : Within ±20% of initial value. Waveform : Sine wave Frequency : 10-55-10Hz for 1 min. Amplitude : 1.5mm(peak-peak) Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS 7. SOLDERING : 7-1. Reflow soldering conditions C1 SERIES Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. main heating A E Slope of temp. rise Heat time 1 to 5 50 to 150 120 to 180 1 to 5 90 ~ 120 255 ~ 260 10 max. 3 °C/sec sec °C °C/sec sec °C sec times TEMPERATURE °C 230°C B 180°C pre-heating normal temperature A B C D Heat temperature Slope of temp. rise Time over 230°C Peak temperature 120°C C D E Peak hold time No. of mounting TIME(sec.) (Melting area of solder) 7-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs. 7-3. Solder Volume : Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side. Upper limit Recommendable NOTE : Specifications subject to change without notice. Please check our website for latest information. t 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS 8. PACKAGING INFORMATION : 8-1. Paper Carrier Tape Packaging P2 P0 D0 T C1 SERIES E F P1 A Unreeling direction A(mm) B(mm) W(mm) F(mm) E(mm) B W P1(mm) P2(mm) P0(mm) D0(mm) t(mm) 0.6±0.05 0.62±0.05 1.12±0.05 8.00±0.10 3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.55±0.05 8-2. Leader And Trailer Tape Trailer Components Empty compartments Leader End Start 110mm or more 20 pitch or more 400 ~ 560mm 8-3. Configuration W1 2±0.5 1 3 .0 ±0.5 A(mm) N N(mm) 50 Min. W1(mm) 10±1.5 W2(mm) 20 Max. QTY (PCS) 10,000/Reel A 178±2.0 ± 21 8 0. R1.0 W2 NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS C1 SERIES 8-4. Tearing Off Force F 165° to 180° Top cover tape Peeling Strength of Cover Tape Cover Tape 10g ~ 120g Base tape Peel Speed : 300mm/min 8-5. Packaging 1. Reel and a bag of desiccant shall be packed in Nylon or plastic bag 2. Maximum of 5 bags shall be packed in an inner box 3. Maximum of 6 inner boxes shall be packed in an outer box Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.06.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8