C1-2N2S-10

CERAMIC CHIP INDUCTORS 1. PART NO. EXPRESSION : C1 SERIES C1-1N0S-10 (a) (b) (c) (d) (a) Series code (b) Inductance code : 1N0 = 1.0nH (c) Tolerance code : S = ±0.3nH, J = ±5% (d) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A D B C Unit:m/m A 1.0±0.05 B 0.5±0.05 C 0.5±0.05 D 0.1 ~ 0.3 3. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -10°C to +40°C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265°C.6secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS 6. ELECTRICAL CHARACTERISTICS : Part Number C1-1N0S-10 C1-1N2S-10 C1-1N5S-10 C1-1N8S-10 C1-2N0S-10 C1-2N2S-10 C1-2N4S-10 C1-2N7S-10 C1-3N0S-10 C1-3N3S-10 C1-3N9S-10 C1-4N7S-10 C1-5N6S-10 C1-6N8J-10 C1-8N2J-10 C1-10NJ-10 C1-12NJ-10 C1-15NJ-10 C1-18NJ-10 C1-22NJ-10 C1-27NJ-10 C1-33NJ-10 C1-39NJ-10 C1-47NJ-10 C1-56NJ-10 C1-68NJ-10 C1-82NJ-10 C1-R10J-10 C1-R12J-10 Tolerance code : S : ±0.3nH J : ±5% EIA Size 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 Inductance ( nH ) 1.0 1.2 1.5 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 Q Min. 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 SRF ( GHz ) Min. 10 10 6 6 6 6 6 6 6 6 4 4 4 3.9 3.6 3.2 2.7 2.3 2.1 1.9 1.6 1.3 1.2 1.0 0.75 0.75 0.60 0.60 0.60 DCR () Max. 0.08 0.09 0.10 0.12 0.12 0.13 0.13 0.13 0.16 0.16 0.21 0.21 0.23 0.25 0.28 0.31 0.40 0.46 0.55 0.60 0.70 0.80 0.90 1.00 1.00 1.20 1.30 1.50 1.60 C1 SERIES Rated Current ( mA ) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 200 200 200 200 180 150 150 150 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS 7. CHARACTERISTICS CURVES : C1 SERIES Inductance vs. Frequency Q vs. Frequency NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS 8. RELIABILITY & TEST CONDITION : C1 SERIES ITEM Solder Heat Resistance PERFORMANCE Appearance : Cracks should not be allowed. More than 75% of the terminal electrode should be covered with new solder. TEST CONDITION Preheat : 100~150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 265±3°C Flux : Rosin Dip Time : 6±1sec. 265°C 150°C Preheating Dipping Natural cooling 60 seconds 6±1 seconds Solderability More than 90% of the terminal electrode should be covered with new solder. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 240±5°C Flux : Rosin Dip Time : 3±1sec. 240°C 150°C Preheating Dipping Natural cooling 60 seconds 3±1.0 seconds Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For C Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec) W W 7 8 Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) Solder a chip on a test substrate, bend the substrate by 3mm (0.118in) for 10secs and return. 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS 8. RELIABILITY & TEST CONDITION : C1 SERIES ITEM Bending Strength PERFORMANCE The ferrite should not be damaged by forces applied on the right condition. R0.5(0.02) 1.0(0.039) TEST CONDITION Chip A High Temperature Resistance Appearance : No damage. Inductance : Within ±20% of initial value. Temperature : 85±5°C Applied Current : rated current Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Humidity : 90~95% RH. Temperature : 60±2°C Applied Current : rated current (max.) Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Humidity Resistance Thermal Shock Appearance : Cracking, chipping or any other defects that are harmful to the characteristics shall not be allowed. Inductance : Within ±20% of initial value. Phase 1 Temperature (°C) -40±2°C +85±5°C Times (min.) 30 30 For C Series : Condition for 1 cycle Step1 : -40±2°C 30 min. Step2 : +85±5°C 30 min. Number of cycles : 100 Measurement : After placing for at least 24hrs. Temperature : -40±2°C Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Low temperature storage test 2 Measured : 100 times NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS 9. SOLDERING : 9-1. Reflow soldering conditions C1 SERIES Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. main heating A E Slope of temp. rise Heat time 1 to 5 50 to 150 120 to 180 1 to 5 90 ~ 120 255 ~ 260 10 max. 3 °C/sec sec °C °C/sec sec °C sec times TEMPERATURE °C 230°C B 180°C pre-heating normal temperature A B C D Heat temperature Slope of temp. rise Time over 230°C Peak temperature 120°C C D E Peak hold time No. of mounting TIME(sec.) (Melting area of solder) 9-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs. 9-3. Solder Volume : Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side. Upper limit Recommendable NOTE : Specifications subject to change without notice. Please check our website for latest information. t 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS 10. PACKAGING INFORMATION : 10-1. Carrier Tape Packaging P2 P0 D0 C1 SERIES t E F P1 A Unreeling direction B W Ko A(mm) 0.65±0.1 B(mm) 1.15±0.1 W(mm) 8±0.2 F(mm) 3.5±0.05 E(mm) 1.75±0.1 P1(mm) 4±0.1 P2(mm) 2±0.05 P0(mm) 4±0.1 D0(mm) 1.5 +0.1 -0 Ko(mm) 0.8±0.05 t(mm) 0.2±0.05 10-2. Leader And Trailer Tape 500 to 560mm Blank 10 to 20 pitches Components Blank 440mm Min. Leader End 110mm or more Unreeling direction 10-3. Configuration W t 2±0.5 1 3 .0 ±0.8 A(mm) N N(mm) Ø60±2 W(mm) 10±1.5 t(mm) 2±0.5 Qty (pcs) 10000/Reel A 178±2.0 ± 21 8 0. R1.0 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7