C3-68N-10

CERAMIC CHIP INDUCTORS 1. PART NO. EXPRESSION : C3 SERIES C3-1N5S-10 (a) (b) (c) (d) (a) Series code (b) Inductance code : 1N5 = 1.5nH (d) 10 : Lead Free (c) Tolerance code : S = ±0.3nH, J = ±5%, K = ±10%, M = ±20% 2. CONFIGURATION & DIMENSIONS : A D L G B C PCB Pattern Unit:m/m A B C D G 1.00 Ref. H 1.00 Ref. H L 3.00 Ref. 2.00±0.20 1.25±0.20 0.85±0.20 1.25±0.20 0.50±0.30 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -40°C to +85°C e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS 6. ELECTRICAL CHARACTERISTICS : Part Number C3-1N5S-10 C3-1N8S-10 C3-2N2S-10 C3-2N7S-10 C3-3N3 -10 C3-3N9 -10 C3-4N7 -10 C3-5N6 -10 C3-6N8 -10 C3-8N2 -10 C3-10N -10 C3-12N -10 C3-15N -10 C3-18N -10 C3-22N -10 C3-27N -10 C3-33N -10 C3-39N -10 C3-47N -10 C3-56N -10 C3-68N -10 C3-82N -10 C3-R10 -10 C3-R12 -10 C3-R15 -10 C3-R18 -10 C3-R22 -10 C3-R27 -10 C3-R33 -10 C3-R39 -10 C3-R47 -10 Tolerance code : : S : ±0.3nH J : ±5% K : ±10% M : ±20% EIA Size 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 Dim. C ( mm ) ±0.2 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 1.25 Inductance ( nH ) 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10.0 12.0 15.0 18.0 22.0 27.0 33.0 39.0 47.0 56.0 68.0 82.0 100.0 120.0 150.0 180.0 220.0 270.0 330.0 390.0 470.0 Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 50 50 50 50 Q Min. 10 10 10 12 12 12 12 15 15 15 15 15 15 15 18 18 18 18 18 18 18 18 18 13 13 13 12 12 12 10 10 Q @ 100MHz Nom. 21 18 18 19 16 18 18 20 20 21 20 21 22 24 23 23 24 23 23 23 25 24 23 22 22 23 20 20 22 17 17 DCR () Max. 0.10 0.10 0.10 0.10 0.13 0.15 0.20 0.23 0.25 0.28 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.90 0.90 0.95 1.00 1.10 1.20 1.30 1.40 1.30 1.50 C3 SERIES Rated Current ( mA ) Max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 SRF ( MHz ) Min. 4000 4000 4000 4000 4000 4000 3500 3200 2800 2400 2100 1900 1600 1500 1400 1300 1200 1000 900 800 700 600 600 500 500 400 350 300 250 250 200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS 7. IMPEDANCE VS. FREQUENCY CURVES : C3 SERIES 10000 ImpedanceZ vsFrequency HCI2012 vs. Freq. IMPEDANCE(Ohm ) 1000 100 22n 82n 47n 10 10n 6n8 1 10 100 1000 10000 FREQUENCY(MHz) 1000 Inductance vs Freq. HCI2012 L vs. Frequency INDUTANCE(nH) 100 82n 33n 47n 22n 10n 6n8 10 1 10 100 1000 10000 FREQUENCY(MHz) 1000 HCI2012 Q vs Freq. Q vs. Frequency 100 Q 10 6n8 10n 82n 22n 1 10 100 47n 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS 8. RELIABILITY & TEST CONDITION : C3 SERIES ITEM Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance PERFORMANCE TEST CONDITION HP4291A, HP4287A+16092A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Refer to standard electrical characteristics list 30°C max. ( t) No mechanical damage Remaining terminal electrode : 70% min. Preheating Dipping 260°C 150°C Natural cooling 60 seconds 10±0.5 seconds Solderability More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C 150°C Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. 60 seconds 4±1.0 seconds Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For C Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec) W W 7 8 Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS 8. RELIABILITY & TEST CONDITION : C3 SERIES ITEM Bending Strength PERFORMANCE The ferrite should not be damaged by forces applied on the right condition. R0.5(0.02) 1.0(0.039) TEST CONDITION Series name 2 3 4 5 6 7 8 mm (inches) 0.80 (0.033) 1.40 (0.055) 2.00 (0.079) 2.70 (0.106) P-Kgf 0.3 1.0 2.5 2.5 Chip A Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). No mechanical damage Temperature : 85±5°C Applied Current : rated current Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 60±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Drop Loading at High Temperature Drop 10 times on a concrete floor from a height of 75cm. Appearance : No damage. Inductance : Within ±10% of initial value. Q : Within ±20% of initial value. Humidity Thermal Shock Appearance : No damage. Inductance : Within ±10% of initial value. Q : Within ±20% of initial value. Phase 1 2 Temperature (°C) -40±2°C +85±5°C Times (min.) 30±3 30±3 For C Series : Condition for 1 cycle Step1 : -40±2°C 30±3 min. Step2 : +85±5°C 30±3 min. Number of cycles : 100 Measured at room temperature after placing for 2 to 3hrs. Temperature : -55±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. No mechanical damage Low temperature storage test Measured : 100 times Drop Drop 10 times on a concrete floor from a height of 75cm. Derating Curve Derated Current(A) Derating 6 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 85 125 Operating Tem perature(°C) Operating Temperature(¢X ) C NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 3.00 1.00 C3 SERIES 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Preheating Soldering 20~40s TP(260°C/10s max.) 217 200 150 60~180s 480s max. 25 60~150s 1.00 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. TEMPERATURE °C TEMPERATURE °C Natural cooling Preheating 260 245 150 Soldering Natural cooling Time(sec.) Figure 1. Re-flow Soldering Over 2min. Gradual Cooling Within 3s Preheating Soldering 3s (max.) 10s (max.) TEMPERATURE °C Natural cooling Figure 2. Wave Soldering 350 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C3 SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit Recommendable t Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS 10. PACKAGING INFORMATION : 10-1. Reel Dimension A C3 SERIES Type 7" x 8mm D B C A(mm) 9.0±0.5 B(mm) 60.0±2.0 60.0±2.0 C(mm) D(mm) 13.5±0.5 178.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 2±0.5 13.5±0.5 R10.5 7" x 8mm 7" x 12mm R1.9 R0.5 120° 10-2 Tape Dimension / 8mm Material : Paper P2:2±0.1 E:1.75±0.1 Po:4±0.1 D:1.56 +0.1 -0.05 t Series Size 1 Bo(mm) 1.12±0.03 1.85±0.05 2.30±0.05 Ao(mm) 0.62±0.03 1.05±0.05 1.50±0.05 Ko(mm) 0.60±0.03 0.95±0.05 0.95±0.05 P(mm) 2.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.60±0.03 0.95±0.05 0.95±0.05 D1(mm) none none none F:3.5±0.1 W:8.0±0.1 Bo Z/L/C 2 3(09) P Ao Ko Material : Plastic P2:2±0.05 E:1.75±0.1 Po:4±0.1 D:1.5+0.1 A W:8.0±0.1 t Series Size 2 3(09) Bo(mm) 1.95±0.10 2.25±0.10 2.35±0.10 3.50±0.10 3.42±0.10 Ao(mm) 1.05±0.10 1.42±0.10 1.50±0.10 1.88±0.10 2.77±0.10 Ko(mm) 1.05±0.10 1.04±0.10 1.45±0.10 1.27±0.10 1.55±0.10 P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.23±0.05 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 D1(mm) none 1.0±0.1 1.0±0.1 1.0±0.1 1.0±0.1 F:3.5±0.05 Bo Z/L/C 3(12) 4 5 P A D1:1±0.1 Ao Ko Section A-A 10-2.1 Tape Dimension / 12mm D:1.5+0.1 E:1.75±0.1 A W:12.0±0.1 Po:4±0.1 P2:2±0.05 t Series Size 6 Bo(mm) 4.95±0.1 4.95±0.1 6.10±0.1 Ao(mm) 1.93±0.1 3.66±0.1 5.40±0.1 Ko(mm) 1.93±0.1 1.85±0.1 2.00±0.1 P(mm) 4.0±0.1 8.0±0.1 8.0±0.1 t(mm) 0.24±0.05 0.24±0.05 0.30±0.05 D1(mm) 1.5±0.1 1.5±0.1 1.5±0.1 F:5.5±0.05 Bo Z/L 7 8 A D1:1.5±0.1 P Ao Ko Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 CERAMIC CHIP INDUCTORS C3 SERIES 10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000 10-4. Tearing Off Force F 165° to 180° Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 07.08.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9