L812HW-R33MF

HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 1. PART NO. EXPRESSION : L812HW-1R0MF (a) (b) (c) (d)(e) (a) Series code (b) Type code (c) Inductance code : 1R0 = 1.0uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A' A C' C D L G SWORLD R33 B B' E PCB Pattern Unit:m/m A' 7.8 Max. A 6.86±0.5 B' 7.0 Max. B 6.47±0.5 C' 3.2 Max. C 3.0 Max. D 1.6±0.5 E 2.1±0.5 G 3.7 Ref. H 3.5 Ref. L 8.7 Ref. 3. SCHEMATIC : 4. MATERIALS : a b (a) Core (b) Wire (c) Terminal c 5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. H 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 6. GENERAL SPECIFICATION : a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C e) Humidity Range : 50 ~ 60% RH f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately T=40°C without core loss. g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Part No. L812HW-R33MF L812HW-R47MF L812HW-R68MF L812HW-1R0MF L812HW-1R5MF L812HW-2R2MF L812HW-3R3MF L812HW-4R7MF L812HW-6R8MF L812HW-100MF Inductance L 0 ( µH ) ±20% @ 0 Adc 0.33 0.47 0.68 1.00 1.50 2.20 3.30 4.70 6.80 10.0 Irms (A) Typ. 20 17.5 15.5 11 9.0 8.0 6.0 5.5 4.5 3.0 Isat (A) Typ. 30 26 23 16 14 12 10 6.5 6.0 4.5 DCR (m ) Max. 3.9 4.2 5.5 10 15 20 30 40 60 105 Q Min. 12 12 12 15 15 15 15 15 18 18 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 8. CHARACTERISTICS CURVES : INDUCTANCE VS. FREQUENCY Q VS. FREQUENCY INDUCTANCE VS. DC CURRENT TEMP. RISE VS. DC CURRENT NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 8. CHARACTERISTICS CURVES : L812HW-R33MF S MPI0603HW-R33 0.5 100 90 0.4 80 L812HW-R47MF S MPI0603HW-R47 1 100 90 0.8 80 INDUCT ANCE (uH) INDUCTANCE (uH) 0.3 60 50 0.6 60 50 0.2 40 30 0.4 40 30 0.1 20 10 0.2 20 10 0 0 0 0 0 7.2 14.4 21.6 28.8 36 0 7.2 14.4 21.6 28.8 36 DC CURRENT(A) DC CURRENT(A) L812HW-R68MF SMPI0603HW-R68 1.5 100 90 1.2 80 L812HW-1R0MF SMPI0603HW-1R0 2 1 00 90 80 1.5 60 1 50 40 30 0.5 20 10 0 0 INDUCTANCE (uH) INDUCTANCE (uH) 0.9 60 50 0.6 40 30 0.3 20 10 0 0 0 5 10 15 20 25 0 3.6 7.2 10.8 14.4 18 DC CURRENT(A) DC CURRENT(A) S L812HW-1R5MF MPI0603HW-1R5 3 100 90 2.4 80 L812HW-2R2MF SMPI0603HW-2R2 4 100 90 3.2 80 INDUCTANCE (uH) TEM P. RISE(oC) 1.8 60 50 2.4 60 50 1.2 40 30 1.6 40 30 0.6 20 10 0.8 20 10 0 0 0 0 0 2.8 5.6 8.4 11.2 14 0 2.8 5.6 8.4 11.2 14 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 TEM P. RISE(oC) 70 INDUCTANCE (uH) 70 TEM P. RISE(oC) TEM P. RISE(oC) 70 70 T EM P. RISE(oC) TEM P. RISE(oC) 70 70 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 8. CHARACTERISTICS CURVES : S L812HW-3R3MF MPI0603HW-3R3 8 100 90 80 8 10 L812HW-4R7MF SMPI0603HW-4R7 100 90 80 INDUCTANCE (uH) INDUCTANCE (uH) 6 TEM P. RISE(oC) 60 4 50 40 30 2 20 10 0 0 6 60 50 4 40 30 2 20 10 0 0 0 2 4 6 8 10 12 0 1 2 3 4 5 6 7 DC CURRENT(A) DC CURRENT(A) L812HW-6R8MF SMPI0603HW-6R8 15 100 90 12 80 L812HW-100MF S MPI0603HW-100 20 100 90 80 15 60 10 50 40 30 5 20 10 0 0 INDUCTANCE (uH) INDUCTANCE (uH) 9 60 50 6 40 30 3 20 10 0 0 TEM P. RISE(oC) 0 1 2 3 4 5 6 0 1 2 3 4 5 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 TEM P. RISE(oC) 70 70 TEM P. RISE(oC) 70 70 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 9. CORE LOSS : 100KHz and 500KHz 40000 material 30000 gauss loss 100 200 100KHz 500KHz 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 266 1,234 2,932 5,195 8,336 12,025 15,715 20,444 25,429 31,002 K W / m3 K /m W3 20000 300 400 500KHZ 500 600 700 100KHZ 10000 800 800 1000 0 0 200 400 600 900 1000 gauss gauss 100KHz 4000 material 3000 gauss loss 300 400 500 600 100KHz K W/ /3 3 Km Wm 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 2000 1000 700 800 900 400 600 800 1000 0 200 gau ss gauss 1000 500KHz 40000 30000 K/ / K W 3m W m 3 20000 10000 0 0 200 400 600 800 1000 g au ss gauss NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 10. RELIABILITY AND TEST CONDITION : ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 4±1sec. Preheating Dipping 245°C 150°C Natural cooling 60 seconds 4±1 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux for lead free : rosin Preheating Dip Time : 10±0.5sec. 260°C 150°C Dipping Natural cooling 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Thermal Shock Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -55±3 Room Temperature +125±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Random Vibration Test Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 11. SOLDERIND AND MOUNTING : 11-1. Recommended PC Board Pattern 2.5 3.7 2.5 11-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 11-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 11-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering 3.5 TEMPERATURE °C 10s max. Natural cooling Preheating 350 300 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 12. PACKAGING INFORMATION : 12-1. Reel Dimension COVER TAPE 2.0±0.5 D B ØC A EMBOSSED CARRIER Type 13" x 16mm A(mm) 16.0±0.5 B(mm) 100±2.0 C(mm) 13.5±0.5 D(mm) 330 12-2 Tape Dimension 1.75±0.1 4.0±0.1 2.0±0.1 Ø1.5+0.1 t F W 0.15 MIN P Ao Bo Ko Series L812HW Ao(mm) 7.0±0.1 Bo(mm) 7.8±0.1 Ko(mm) 3.3±0.1 P(mm) 12.0±0.1 W(mm) 16.0±0.3 F(mm) 7.5±0.1 t(mm) 0.35±0.05 12-3. Packaging Quantity Size Chip / Reel Inner Box Carton L812HW 1000 2000 8000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 HIGH CURRENT MOLDED POWER INDUCTORS L812HW SERIES 12-4. Tearing Off Force F 165° to 180° The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Top cover tape Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 10