L825HW-1R0MF

HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 1. PART NO. EXPRESSION : L825HW-1R0MF (a) (b) (c) (d)(e) (a) Series code (b) Type code (c) Inductance code : 1R0 = 1.0uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A' A C' C D L G SWORLD 1R5 B B' E PCB Pattern Unit:m/m A' 7.8 Max. A 6.86±0.5 B' 7.0 Max. B 6.47±0.5 C' 5.2 Max. C 5.0 Max. D 1.6±0.5 E 2.1±0.5 G 3.7 Ref. H 3.5 Ref. L 8.7 Ref. 3. SCHEMATIC : 4. MATERIALS : a b (a) Core (b) Wire (c) Terminal c 5. FEATURES : a) Shielded Construction b) Frequency up to 5MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. H 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 6. GENERAL SPECIFICATION : a) Test Freq. : 100KHz/0.25VDC b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C e) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately T=40°C without core loss. f) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ. g) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Inductance L 0 ( µH ) ±20% @ 0 Adc 0.56 0.68 0.82 1.0 1.5 2.2 3.3 4.7 5.6 6.8 8.2 10 Irms (A) Typ. 20 18 16.5 13 12 10 8 6.5 6 5.8 5.5 4.5 Isat (A) Typ. 21 19 18 15 14 10 9 8 7 6.5 6 5 DCR (m ) Max. 3.6 4.5 4.9 6.5 9.0 13.6 20.9 30.3 34.4 44.6 45.6 71.3 Part No. L825HW-R56MF L825HW-R68MF L825HW-R82MF L825HW-1R0MF L825HW-1R5MF L825HW-2R2MF L825HW-3R3MF L825HW-4R7MF L825HW-5R6MF L825HW-6R8MF L825HW-8R2MF L825HW-100MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 8. CORE LOSS : 100KHz and 500KHz 40000 material 30000 gauss loss 100 200 100KHz 500KHz 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 266 1,234 2,932 5,195 8,336 12,025 15,715 20,444 25,429 31,002 KW 3 3 K /mm W/ 20000 300 400 500KHZ 500 600 700 100KHZ 10000 800 800 1000 0 0 200 400 600 900 1000 gauss gauss 100KHz 4000 material 3000 gauss loss 300 400 500 600 100KHz K W/ /3 3 Km Wm 351.7 665.9 1,039 1,471 1,923 2,537 3,148 3,902 2000 1000 700 800 900 400 600 800 1000 0 200 gau ss gauss 1000 500KHz 40000 30000 K/ / KW 3m W m 3 20000 10000 0 0 200 400 g au ss gauss 600 800 1000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 9. RELIABILITY AND TEST CONDITION : ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss Isat(A) will cause Lo to drop approximately 20%. More than 90% of the terminal electrode should be covered with solder. 230°C Preheating Dipping Natural cooling 150°C 60 seconds 4±1 seconds After fluxing components shall be dipped in a melted solder bath at 230±5°C for 4 seconds. Solder Heat Resistance 1. Components should have no evidence of electrical & mechanical damage. 2. Inductance : Within ±20% of initial value. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating 260°C Dipping Natural cooling 150°C 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -40±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -55±3 Room Temperature 125±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Low Temperature Life Test Thermal Shock Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 10. SOLDERIND AND MOUNTING : 10-1. Recommended PC Board Pattern 2.5 3.7 2.5 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 10-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 10-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 10-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering 3.5 TEMPERATURE °C 10s max. Natural cooling Preheating 280 260 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 11. PACKAGING INFORMATION : 11-1. Reel Dimension COVER TAPE 2.0±0.5 D B ØC A EMBOSSED CARRIER Type 13" x 16mm A(mm) 16.0±0.5 B(mm) 100±2.0 C(mm) 13.5±0.5 D(mm) 330 11-2 Tape Dimension 1.75±0.1 4.0±0.1 2.0±0.1 Ø1.5+0.1 t F W 0.15 MIN P Ao Bo Ko Series L825HW Ao(mm) 7.00±0.1 Bo(mm) 7.80±0.1 Ko(mm) 5.30±0.1 P(mm) 12.0±0.1 W(mm) 16.0±0.3 F(mm) t(mm) 7.50±0.1 0.35±0.05 11-3. Packaging Quantity Size Chip / Reel Inner Box Carton L825HW 800 1600 6400 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT MOLDED POWER INDUCTORS L825HW SERIES 11-4. Tearing Off Force F 165° to 180° The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Top cover tape Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7