SDL1310

HIGH CURRENT POWER INDUCTORS 1. PART NO. EXPRESSION : SDL1310 SERIES SDL1310-R60MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : R60 = 0.60uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : B C H D PCB Pattern E mm A 13.0 Max. mm B 14.0 Max. mm C 9.0 Max. mm D 3.5±0.5 mm E 6.0±0.5 mm F 7.3±0.5 mm G 7.3±0.5 G A ØI F mm H 6.0±0.5 mm I 2.0±0.5 3. SCHEMATIC : 4. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -55°C to +125°C c) Irms (A) : Will cause coil temp. to rise approximately T=60°C without core loss. d) Isat (A) : Will cause L0 to drop approximately 20% e) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS 5. ELECTRICAL CHARACTERISTICS : Part No. SDL1310-R60MF Inductance L 0 ( µH ) 0.60±20% Test Frequency ( Hz ) 0.25V / 100K DCR (m ) Max. 1.0 SDL1310 SERIES Irms (A) Max. 30 Isat (A) Max. 40 6. CHARACTERISTICS CURVES : SDL1310-R60MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS 7. RELIABILITY AND TEST CONDITION : SDL1310 SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 230°C Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 230±5°C Flux for lead free : rosin Dip Time : 4±1sec. 150°C 60 seconds 4±1 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheating 260°C Dipping Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 150°C 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Thermal Shock Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -55±3 Room Temperature +125±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS 8. SOLDERIND AND MOUNTING : 8-1. Recommended PC Board Pattern ( Unit : mm ) SDL1310 SERIES 6.0±0.5 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s 7.3±0.5 TEMPERATURE °C 9. PACKING AND QUANTITY : Size Styrofoam Inner box Carton SDL1310 180 360 1800 NOTE : Specifications subject to change without notice. Please check our website for latest information. 5 0. 0± 2. Ø Soldering 10s max. Natural cooling Preheating 280 260 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4