SDM109N

MOLDING TYPE DIP INDUCTORS 1. PART NO. EXPRESSION : SDM109N SERIES SDM109N-R25MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : R25 = 0.25uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A L ØN M B E 11.5 R50 ØW F P O 11.5 C PCB Pattern Unit:m/m A 10.5 Max. W 1.3±0.1 D B C D 3.4±0.5 ØN 1.6 Typ. E 5.3±1.0 O 5.3±0.15 F 5.3±1.0 P 5.3±0.15 10.5 Max. 10.0 Max. L 7.5±0.5 M 7.5 Typ. 3. SCHEMATIC : 4. MATERIALS : (a) Core : M-Iron Core (b) Wire : Enamelled Copper Wire (c) Adhesive : Epoxy 5. FEATURES : a) Shielded construction b) Frequency up to 1MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 MOLDING TYPE DIP INDUCTORS 6. GENERAL SPECIFICATION : a) Test Frequency : 100KHz/1.0Vdc b) Operating temp. : -25°C to +125°C c) Ambient temp. : 25°C d) Irms (A) : Will cause an approximately temp. rise < 40°C typ. e) Isat (A) : Will cause L0 to drop approximately 20% typ. SDM109N SERIES f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Part No. SDM109N-R25MF SDM109N-R50MF SDM109N-R56MF SDM109N-R68MF SDM109N-R80MF Inductance L0 ( uH ) ±20% @ 0Adc 0.25 0.50 0.56 0.68 0.80 Q Min. 20 20 20 15 15 Irms (A) Typ. 35 32 30 30 10 Isat (A) Max. 40 38 35 35 20 DCR (m ) Max. 0.8 1.0 1.0 1.3 1.3 8. CHARACTERISTICS CURVES : Inductance vs. Frequency SDM109N SERIES D MP I109 N I N DU CT AN CE (u H FR EQ UE NC Y( M Hz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 MOLDING TYPE DIP INDUCTORS 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise SDM109N-R25MF DMPI109N-R25 0.5 100 90 0.4 80 SDM109N SERIES SDM109N-R50MF DMPI109N-R50 1 100 90 80 INDUCTANCE (uH) INDUCTANCE (uH) 0.3 60 50 60 0.5 50 40 0.25 30 20 10 0 0.2 40 30 0.1 20 10 0 0 10 20 30 40 50 60 0 DC CURRENT(A) 0 9 18 27 36 45 0 DC CURRENT(A) 1 SDM109N-R56MF DMPI109N-R56 SDM109N-R68MF DMPI109N-R68 100 1 100 90 INDUCTANCE (uH) INDUCTANCE (uH) 0.75 80 0.75 80 60 0.5 40 0.25 20 60 0.5 50 40 30 0.25 20 10 0 0 10 DC CURRENT(A) 20 30 40 0 0 0 9 18 27 DC CURRENT(A) 36 45 0 1 S DM109N-R80MF DMPI109N-R80 50 45 0.8 40 INDUCTANCE(uH) 0.6 30 25 0.4 20 15 0.2 10 5 0 0 5 DC CURRENT(A) 10 15 20 25 0 NOTE : Specifications subject to change without notice. Please check our website for latest information. TEMP. RIS E(oC) 35 TEMP. RISE(o C) TEMP. RISE(oC) 70 TEMP. RISE(oC) TEMP. RISE(oC) 70 0.75 70 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 MOLDING TYPE DIP INDUCTORS 9. RELIABILITY AND TEST CONDITION : SDM109N SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP-4192A, HP4284A, CH1320 Agilent 33420A Irms(A) will cause an temp rise < 40°C typ. Isat(A) will cause Lo to drop approximately 25% More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C Natural cooling 150°C 60 seconds 4±1 seconds After fluxing, component shall be dipped in a melted solder bath at 245±5°C for 5 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±3% Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux : rosin 260°C Dip Time : 10±0.5sec. 150°C Preheating Dipping Natural cooling 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 85±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber 1. Appearance : No damage 2. Inductance : Within ±3% of initial value. Thermal Shock No disconnection or short circuit. Temperature : -40±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -25±3 Room Temperature 85±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Low Temperature Life Test Total : 5 cycles Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±5% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 MOLDING TYPE DIP INDUCTORS 10. SOLDERIND AND MOUNTING : 10-1. Recommended PC Board Pattern Ø1 .6 Ty p. SDM109N SERIES 5 7. p. Ty 5.3±0.15 11.5 5.3±0.15 11.5 10-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 10-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 10-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 Soldering 10s max. TEMPERATURE °C Natural cooling Preheating 350 300 150 Soldering Natural cooling 60~120s 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 MOLDING TYPE DIP INDUCTORS 11. PACKING AND QUANTITY : Size Styrofoam Inner Box Carton SDM109N 100 1000 2000 SDM109N SERIES Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6