SDM129N

MOLDING TYPE DIP INDUCTORS 1. PART NO. EXPRESSION : SDM129N SERIES SDM129N-R25MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : R25 = 0.25uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A L M B E 12.5 E ØN R30 ØW F F 12.5 C PCB Pattern Unit:m/m Part No. R25/R47/R50/R68 R30/R60 A 12.5 Max. D B C D 3.4±0.5 3.4±0.5 E 6.68±0.5 6.0±0.5 F 6.68±0.5 7.3±0.5 W 1.6±0.1 1.6±0.1 L 9.45±0.5 9.45±0.5 M 9.45 Ref. 9.45 Ref. ØN 1.9 Ref. 1.9 Ref. 12.5 Max. 10.5 Max. 12.5 Max. 12.5 Max. 10.5 Max. 3. SCHEMATIC : 4. MATERIALS : (a) Core : M-Iron Core (b) Wire : Enamelled Copper Wire (c) Adhesive : Epoxy 5. FEATURES : a) Shielded construction b) Frequency up to 1MHz NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 MOLDING TYPE DIP INDUCTORS 6. GENERAL SPECIFICATION : a) Test Frequency : 100KHz/1.0Vdc b) Operating temp. : -25°C to +125°C c) Ambient temp. : 25°C d) Irms (A) : Will cause an approximately temp. rise < 40°C typ. e) Isat (A) : Will cause L0 to drop approximately 20% typ. SDM129N SERIES f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. 7. ELECTRICAL CHARACTERISTICS : Part No. SDM129N-R25MF SDM129N-R30MF SDM129N-R47MF SDM129N-R50MF SDM129N-R60MF SDM129N-R68MF Inductance L0 ( uH ) ±20% @ 0Adc 0.25 0.30 0.47 0.50 0.60 0.68 Q Min. 25 20 20 25 20 25 Irms (A) Typ. 40 30 35 38 30 35 Isat (A) Max. 45 40 40 42 40 40 DCR (m ) Max. 0.60 0.60 0.80 0.80 0.55 1.00 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise SDM129N-R25MF DMPI129N-R25 0.5 100 90 0.4 80 0.3 80 0.4 SDM129N-R30MF DMPI129N-R30 100 INDUCTANCE (uH) TEMP. RISE( oC) 0.3 60 50 60 0.2 40 0.2 40 30 0.1 20 10 0.1 20 0 0 0 10 20 30 40 50 60 0 0 0 15 30 45 60 DC CURRENT(A) DC CURRENT(A ) NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 TE MP. RISE (oC) 70 INDUC TA NCE (uH) 18.04.2008 MOLDING TYPE DIP INDUCTORS 8. CHARACTERISTICS CURVES : DC Current vs. Inductance & Temperature Rise S DM129N-R47MF DMPI129N-R47 0.6 80 70 0.45 60 SDM129N SERIES DMPI129N-R50 SDM129N-R50MF 1 100 90 80 INDUCTANCE (uH) INDUCTANCE(uH) 0.75 TEMP. RISE(oC) 50 0.3 40 30 20 10 0 0 60 0.5 50 40 30 0.25 20 10 0 0 0.15 0 10 20 30 40 0 10 20 30 40 50 DC CURRENT(A) SDM129N-R60MF DMPI129N-R60 DC CURRENT(A) SDM129N-R68MF DMPI129N-R68 100 1 1 100 90 0.8 80 80 INDUCTANCE (uH) 0.75 INDUCTANCE (uH) 0.6 60 60 0.5 50 40 30 0.25 20 10 0.4 40 0.2 20 0 0 0 0 0 10 20 30 40 50 0 10 20 30 40 50 DC CURRENT(A) DC CURRENT(A) Inductance vs. Frequency D MPI129N S DM129N SERIES INDUCTANCE(uH) FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 TEMP. RISE( oC) TEMP. RISE( oC) 70 TEMP. RISE(oC) 70 MOLDING TYPE DIP INDUCTORS 9. RELIABILITY AND TEST CONDITION : SDM129N SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP-4192A, HP4284A, CH1320 Agilent 33420A Irms(A) will cause an temp rise < 40°C typ. Isat(A) will cause Lo to drop approximately 25% More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C Natural cooling 150°C 60 seconds 4±1 seconds After fluxing, component shall be dipped in a melted solder bath at 245±5°C for 5 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±3% Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C Flux : rosin 260°C Dip Time : 10±0.5sec. 150°C Preheating Dipping Natural cooling 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 85±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber 1. Appearance : No damage 2. Inductance : Within ±3% of initial value. Thermal Shock No disconnection or short circuit. Temperature : -40±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -25±3 Room Temperature 85±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Low Temperature Life Test Total : 5 cycles Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±5% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 MOLDING TYPE DIP INDUCTORS 10. SOLDERIND AND MOUNTING : 10-1. Recommended PC Board Pattern SDM129N SERIES Unit:m/m Part No. E 6.68±0.5 6.0±0.5 F 6.68±0.5 7.3±0.5 M 9.45 Ref. 9.45 Ref. ØN 1.9 Ref. 1.9 Ref. M 12.5 E R25/R47/R50/R68 ØN R30/R60 F 12.5 10-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 10-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 10-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering TEMPERATURE °C 10s max. Natural cooling Preheating 350 300 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 MOLDING TYPE DIP INDUCTORS 11. PACKING AND QUANTITY : Size Styrofoam Inner Box Carton SDM129N 135 270 1350 SDM129N SERIES Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.04.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6