SHM088HBA-1R2MF

DIP POWER CHOKE COIL 1. PART NO. EXPRESSION : SHM088HBA SERIES SHM088HBA-1R2MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : 1R2 = 1.20uH (d) Tolerance code : M = ±20% (e) F : RoHS Compliant 2. CONFIGURATION & DIMENSIONS : A F 1R2 8.0 B F G C 8.0 ØW D PCB Pattern Unit:m/m Series SHM088HBA-1R2MF SHM088HBA-1R6MF A 8.0 Max. 8.0 Max. B 8.0 Max. 8.0 Max. C 8.0 Max. 8.0 Max. D 3.4±0.5 3.4±0.5 F 5.0±0.5 5.0±0.5 ØW 0.8±0.1 0.7±0.1 G 1.1 Typ. 1.0 Typ. 3. SCHEMATIC : 4. MATERIALS : (a) Core : Metal Core (b) Wire : Enamelled Copper Wire (c) Solder : Sn99.95%-Cu0.05% 5. GENERAL SPECIFICATION : a) Test Frequency : 100KHz/1.0V b) Operating temp. : -40°C to +125°C c) Ambient temp. : 20°C d) Irms (A) : Will cause an approximately temp. rise T < 40°C e) Isat (A) : Will cause L0 to drop approximately 30% f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 DIP POWER CHOKE COIL 6. ELECTRICAL CHARACTERISTICS : Part No. SHM088HBA-1R2MF SHM088HBA-1R6MF Inductance L0 ( uH ) ±20% @ 0Adc 1.20 1.60 Irms (A) Max. 12 12 Isat (A) Max. 20 18 SHM088HBA SERIES DCR (m ) ±8% 2.7 3.4 Q Min. 40 40 7. CHARACTERISTICS CURVES : Inductance vs. DC Current 2 SHM088HBA-1R2MF HMPI088HBA-1R2M 80 70 4 SHM088HBA-1R6MF HMPI088HBA-1R6M 80 70 INDUCTANCE (uH) INDUCTANCE (uH) 1.5 60 3 60 50 50 1 40 30 0.5 20 10 0 0 2 40 30 1 20 10 0 0 0 5 10 15 20 0 3 6 9 12 15 18 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 TEMP. RISE(oC) TEMP. RISE(oC) DIP POWER CHOKE COIL 8. RELIABILITY AND TEST CONDITION : SHM088HBA SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A or CH3302/1320/1320S HIOKI3540 Irms(A) will cause an temp rise < 40°C typ. Isat(A) will cause Lo to drop approximately 30% More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245°C Natural cooling 150°C 60 seconds 4±1 seconds After fluxing, component shall be dipped in a melted solder bath at 245±5°C for 5 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±10% of initial value Preheat : 150°C, 60sec. Solder : lead free Solder Temperature : 260±5°C Flux : rosin 260°C Dip Time : 10±0.5sec. 150°C Preheating Dipping Natural cooling 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 85±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber 1. Appearance : No damage 2. Inductance : Within ±10% of initial value. Thermal Shock No disconnection or short circuit. Temperature : -20±5°C Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -25±3 Room Temperature 85±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Low Temperature Life Test Total : 5 cycles Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±10% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Current Time : 500±12 hours Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 DIP POWER CHOKE COIL 9. SOLDERIND AND MOUNTING : 9-1. Recommended PC Board Pattern F SHM088HBA SERIES Unit:m/m Series SHM088HBA-1R2MF SHM088HBA-1R6MF F 5.0±0.5 5.0±0.5 G 1.1 Typ. 1.0 Typ. 8.0 G 8.0 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering TEMPERATURE °C 10s max. Natural cooling Preheating 350 300 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 DIP POWER CHOKE COIL 10. PACKING AND QUANTITY : Size Styrofoam Inner Box Carton SHM088BHA 162 1134 2268 SHM088HBA SERIES Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 12.05.2010 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5