HIGH CURRENT POWER INDUCTORS
1. PART NO. EXPRESSION :
SSL1005M SERIES
SSL1005M-R10MF-R55
(a) (b) (c) (d) (e) (f) (g)
(a) Series code (b) Dimension code (c) Material code (d) Inductance code
(e) Tolerance code : M = ± 20% (f) F : RoHS Compliant (g) DCR code
2. CONFIGURATION & DIMENSIONS :
A E
85N 0939.39
D
B
G
H
G
C
PCB Pattern Unit:m/m A 10.2 Max. B 7.0 Max. C D E G H I
4.96 Max. 2.49± 0.25 1.52± 0.25 2.03± 0.25 6.35± 0.25 3.05± 0.25
3. SCHEMATIC :
4. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +125° C b) Irms (A) : Will cause coil temp. to rise approximately T=40°C without core loss. c) Isat (A) : Will cause L 0 to drop approximately 20% d) Part temperature (ambient + temp. rise) : Should not exceed 125° C under worst case operating conditions.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
I
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT POWER INDUCTORS
5. ELECTRICAL CHARACTERISTICS : Part No. SSL1005M-85NMF-R39 SSL1005M-R10MF-R39 SSL1005M-R12MF-R39 SSL1005M-R15MF-R39 SSL1005M-R22MF-R39 SSL1005M-85NMF-R55 SSL1005M-R10MF-R55 SSL1005M-R12MF-R55 SSL1005M-R15MF-R55 SSL1005M-R22MF-R55 Inductance L0 ( uH ) 0.085 ± 20% 0.100 ± 20% 0.120 ± 20% 0.155 ± 20% 0.220 ± 20% 0.085 ± 20% 0.100 ± 20% 0.120 ± 20% 0.155 ± 20% 0.220 ± 20% Test Freq. ( Hz ) 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M DCR (m ) ± 9.4% 0.39 0.39 0.39 0.39 0.39 0.55 0.55 0.55 0.55 0.55
SSL1005M SERIES
Irms (A) Max. 31 31 31 31 25 31 31 31 31 25 Isat (A) Max. 70 70 52 40 33 70 70 52 40 33
6. CHARACTERISTICS CURVES :
SSL1005M-85NMF-R39
0.16
SLPI1005M-85NM-R39
SSL1005M-R10MF-R39
80 70
0.2
SLPI1005M-R10M-R39
80 70
INDUCTANCE (uH)
0.12
60
0.15
60 50
INDUCTANCE (uH)
TEMP. RISE(oC)
50 0.08 40 30 0.04 20 10 0 0
0.1
40 30
0.05
20 10
0
0
0
15
30
45
60
0
12
24
36
48
60
DC CURRENT(A)
DC CURRE NT(A)
0.2
SSL1005M-R12MF-R39 SLPI1005M-R12M-R39
80 70
0.3
SSL1005M-R15MF-R39 SLPI1005M-R15M-R39
80 70
0.24
INDUCTANCE (uH)
INDUCTANCE (uH)
0.15
60
60
TEMP. RISE(oC)
50 0.1 40 30 0.05 20 10 0 0
0.18
50 40
0.12
30 20
0.06 10 0 0
0
13
26
39
52
0
11.5
23
34.5
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
TEMP. RISE(oC)
TEMP. RISE(oC)
HIGH CURRENT POWER INDUCTORS
6. CHARACTERISTICS CURVES :
SSL1005M-R22MF-R39 SLPI1005M-R22M-R39
SSL1005M SERIES
0.4
80 70
0.16
SSL1005M-85NMF-R55 SLPI1005M-85NM-R55
80 70
INDUCTANCE (uH)
INDUCTANCE (uH)
0.3
60
0.12
60 50
50 0.2 40 30 0.1 20 10 0 0
TEMP. RISE(oC)
0.08
40 30
0.04
20 10
0
0
0
8.25
16.5
24.75
33
0
15
30
45
60
DC CURRENT(A)
DC CURRENT(A)
SSL1005M-R10MF-R55
0.2
SLPI1005M-R10M-R55
SSL1005M-R12MF-R55
80 70
0.2
SLPI1005M-R12M-R55
80 70
INDUCTANCE (uH)
INDUCTANCE (uH)
0.15
60
0.15
60 50
50 0.1 40 30 0.05 20 10 0 0
TEMP. RISE(oC)
0.1
40 30
0.05
20 10
0
0
0
15
30
45
60
0
11
22
33
44
55
DC CURRENT(A)
DC CURRENT(A)
SSL1005M-R15MF-R55
0.3
SLPI1005M-R15M-R55
SSL1005M-R22MF-R55
80 70
0.4
SLPI1005M-R22M-R55
80 70
0.24 60
0.3
60 50
INDUCTANCE (uH)
INDUCTANCE (uH)
0.18
50 40
TEMP. RISE(oC)
0.2
40 30
0.12
30 20
0.1
20 10
0.06 10 0 0
0
0
0
10
20
30
40
0
8.25
16.5
24.75
33
DC CURRENT(A)
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
TEMP. RISE(oC)
TEMP. RISE(oC)
TEMP. RISE(oC)
HIGH CURRENT POWER INDUCTORS
7. RELIABILITY AND TEST CONDITION :
SSL1005M SERIES
TEST CONDITION
ITEM
Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test
PERFORMANCE
Refer to standard electrical characteristics list HP4284A HIOKI3540
Irms(A) will cause the coil temperature rise approximately T=40°C without core loss Isat(A) will cause Lo to drop approximately 20% More than 90% of the terminal electrode should be covered with solder.
Preheating Dipping 245° C
Natural cooling
150° C
60 seconds
5± 0.5 seconds
After fluxing, component shall be dipped in a melted solder bath at 245± 5° C for 5 secs Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ± 20% of initial value Preheat : 150° C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260± 5° C Flux : rosin 260° C Dip Time : 10± 0.5sec.
150° C
Preheating
Dipping
Natural cooling
60 seconds
10± 0.5 seconds
Reliability Test High Temperature Life Test Temperature : 125± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -40± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle.
Step 1 2 3 4 Temperature (° C) -25± 3 Room Temperature 85± 3 Room Temperature Times (min.) 30± 3 Within 3 30± 3 Within 3
Low Temperature Life Test
Total : 5 cycles Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Temperature : 40± 5° C Humidity : 90% to 95% Applied Current : Rated Current Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions and times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
Random Vibration Test
Appearance : Cracking, chipping and any other defects harmful to the characteristics should not be allowed.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT POWER INDUCTORS
8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern
G H G
SSL1005M SERIES
Unit:m/m G
I
H
I
2.03± 0.25 6.35± 0.25 3.05± 0.25
8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150° C. b) 280° C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs.
Preheating TEMPERATURE ° C
Soldering
20~40s max. TP(260° C/10s max.) 217 200 150 60~180s 480s max. 25 60~150s
TEMPERATURE ° C
Natural cooling
Preheating
350 300 150
Soldering
Natural cooling
TIME(sec.)
Over 1min.
Gradual Cooling Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT POWER INDUCTORS
9. PACKAGING INFORMATION : 9-1. Reel Dimension
SSL1005M SERIES
COVER TAPE
2.0± 0.5 D B ØC A
EMBOSSED CARRIER
Type 13" x 24mm
A(mm) 24.0± 0.5
B(mm) 75± 2
C(mm) 13.5± 0.5
D(mm) 330
9-2 Tape Dimension
1.75± 0.1
4.0± 0.1
2.0± 0.1
Ø1.5+0.1
t
W
0.15 MIN
P Ao
Bo
Ko
Series SSL1005M
Ao(mm) 7.2± 0.1
Bo(mm) 10.8± 0.1
Ko(mm) 5.2± 0.1
P(mm) 12.0± 0.1
W(mm)
t(mm)
24.0± 0.3 0.40± 0.05
9-3 Packaging Quantity
Size Chip / Reel Inner Box Carton
SSL1005M 900 1800 7200
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT POWER INDUCTORS
SSL1005M SERIES
9-4. Tearing Off Force F
165° to 180°
The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. (referenced ANSI/EIA-481-C-2003 of 4.11 standard)
Room Temp. (° C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Top cover tape
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40° C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
08.04.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
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