SSL1208-R21MF

HIGH CURRENT POWER INDUCTORS 1. PART NO. EXPRESSION : SSL1208 SERIES SSL1005-R21MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : R21 = 0.21uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A D R21 B E L G C PCB Pattern Unit:m/m A B C D 2.54±0.5 E 5.0±0.5 G 7.1 Max. H 7.6 Max. L 13.8 Max. 13.46 Max. 12.95 Max. 8.0 Max. 3. SCHEMATIC : 4. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -55°C to +125°C c) Irms (A) : Will cause coil temp. to rise approximately T=40°C without core loss. d) Isat (A) : Will cause L0 to drop approximately 20% e) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions. 5. ELECTRICAL CHARACTERISTICS : Part No. SSL1208-R15YF SSL1208-R21MF SSL1208-R26MF SSL1208-R32MF SSL1208-R44MF Inductance L0 ( uH ) 0.15 ±30% 0.21 ±20% 0.26 ±20% 0.32 ±20% 0.44 ±20% Test Freq. ( Hz ) 0.1V/500K 0.1V/500K 0.1V/500K 0.1V/500K 0.1V/500K DCR (m ) Max. 0.60 0.60 0.60 0.60 0.60 Irms (A) Max. 50 45 40 40 28 Isat (A) Max. 55 50 45 41 30 NOTE : Specifications subject to change without notice. Please check our website for latest information. H 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS 6. CHARACTERISTICS CURVES : SSL1208-R15YF SSL1208 SERIES SSL1208-R21MF SSL1208-R26MF SSL1208-R32MF SSL1208-R44MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS 7. RELIABILITY AND TEST CONDITION : SSL1208 SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% Saturation Current (Isat) Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 230°C Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 230±5°C Flux for lead free : rosin Dip Time : 4±1sec. 150°C 60 seconds 4±1 seconds Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% Preheating 260°C Dipping Natural cooling Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 150°C 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Thermal Shock Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -55±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -55±3 Room Temperature +125±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS 8. SOLDERIND AND MOUNTING : 8-1. Recommended PC Board Pattern ( Unit : mm ) 13.8 7.1 SSL1208 SERIES 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering 7.6 TEMPERATURE °C 10s max. Natural cooling Preheating 280 260 150 Soldering Natural cooling 30~60s Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS 9. PACKAGING INFORMATION : 9-1. Reel Dimension SSL1208 SERIES COVER TAPE 2.0±0.5 D B ØC A EMBOSSED CARRIER Type 13" x 24mm A(mm) 24.0±0.5 B(mm) 75±2 C(mm) 13.5±0.5 D(mm) 330 9-2 Tape Dimension 1.75±0.1 4.0±0.1 2.0±0.1 Ø1.5+0.1 t W 0.15 MIN P Ao Bo Ko Series SSL1208 Ao(mm) Bo(mm) Ko(mm) 8.2±0.1 P(mm) 16.0±0.1 W(mm) 24.0±0.3 t(mm) 0.35±0.05 13.05±0.1 13.05±0.1 9-3 Packaging Quantity Size Chip / Reel Inner Box Carton SSL1208 400 1200 2400 NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5