V8N122-J-10

HIGH VOLTAGE CHIP CAPACITORS 1. PART NO. EXPRESSION : V8N SERIES V8N101J-J-10 (a) (b) (c) (d) (e) (f) (a) Chip Size (b) Temp. Coefficient : N ( 30ppm/°C ) ( Temp. range : -55°C to +125°C ) (c) Capacitance code : 101 = 100pF (d) Tolerance code (e) Voltage code : J = 1000Vdc (f) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A D L G B C PCB Pattern Unit:m/m A B C D G H L 5.70±0.40 5.00±0.40 3.00 Max. 0.30 Min. 4.00 - 4.60 3.50 - 4.80 2.00 - 2.20 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ceramic (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Storage temp. : +5°C to +40°C b) Operating temp. : -55°C to +125°C c) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. H 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH VOLTAGE CHIP CAPACITORS 6. ELECTRICAL CHARACTERISTICS : ( Rated Voltage : 1KVdc ) Part Number V8N101 -J-10 V8N121 -J-10 V8N151 -J-10 V8N181 -J-10 V8N221 -J-10 V8N271 -J-10 V8N331 -J-10 V8N391 -J-10 V8N471 -J-10 V8N561 -J-10 V8N681 -J-10 V8N821 -J-10 V8N102 -J-10 V8N122 -J-10 V8N152 -J-10 V8N182 -J-10 V8N222 -J-10 V8N272 -J-10 V8N332 -J-10 Tolerance code : : C : ±0.25pF D : ±0.50pF J : ±5% K : ±10% M : ±20% Capacitance ( pF ) 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 Part Number V8N392 -J-10 V8N472 -J-10 V8N562 -J-10 V8N682 -J-10 V8N822 -J-10 V8N103 -J-10 V8N123 -J-10 V8N153 -J-10 V8N183 -J-10 V8N SERIES Capacitance ( pF ) 3900 4700 5600 6800 8200 10000 12000 15000 18000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH VOLTAGE CHIP CAPACITORS 6. ELECTRICAL CHARACTERISTICS : ( Rated Voltage : 5KVdc ) Part Number Capacitance ( pF ) 2.0 3.3 3.9 5.0 8.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Part Number V8N SERIES Capacitance ( pF ) 120 150 V8N2R0 -R-10 V8N3R3 -R-10 V8N3R9 -R-10 V8N5R0 -R-10 V8N8R0 -R-10 V8N8R2 -R-10 V8N100 -R-10 V8N120 -R-10 V8N150 -R-10 V8N180 -R-10 V8N220 -R-10 V8N270 -R-10 V8N330 -R-10 V8N390 -R-10 V8N470 -R-10 V8N560 -R-10 V8N680 -R-10 V8N820 -R-10 V8N101 -R-10 Tolerance code : : C : ±0.25pF D : ±0.50pF J : ±5% K : ±10% M : ±20% V8N121 -R-10 V8N151 -R-10 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH VOLTAGE CHIP CAPACITORS 7. RELIABILITY & TEST CONDITION : V8N SERIES ITEM Electrical Characteristics Test Visual Insulation Resistance PERFORMANCE TEST CONDITION No abnormal exterior appearance 10,000M or 500/C product whichever is smaller Visual inspection V < 500V, Rated Voltage V > 500V, Applied 500Vdc Charge Time: 60sec is applied less than 50mA current Capacitance Within the specified tolerance [Class I (N) & Class II] Class I : C < 100pF : Freq. = 1MHz±10%, Voltage = 1.0±0.2Vrms C > 100pF : Freq. = 1KHz±10% Class II : X : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms Z/E : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms Perform a heat temp. at 150±5°C for 30min. then place room temp. for 24±2hr Q Class I (N) : More than 30pF : Q > 1000 30pF & below : Q > 400+20C (C: Capacitance, pF) Tan Withstanding Voltage Class II (X) : 2.5% maximum Class II (Z/E) : 4.0% maximum No dielectric breakdown or mechanical breakdown 200V < V < 500V : 200% rated voltage 500V < V < 1000V : 150% rated voltage 1000 < V : 120% rated voltage for 1-5sec. Current is limited to less than 50mA. * Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arching on the chip surface, at voltage over 1000Vdc. Temperature Capacitance Coefficient Class I : Char. N Class II : Char. X E Z Temp. Range -55°C ~ +125°C -30°C ~ +85°C +10°C ~ +85°C Cap. Change (%) ±15% +22% ~ -56% +22% ~ -56% Temp. Range -55°C ~ +125°C Cap. Change (%) ±30ppm/°C Class I : [C2-C1/C1(T2-T1)] x 100% Class II : (C2-C1)/C1 x 100% T1 : Standard temperature (25°C) T2 : Test temperature C1 : Capacitance at standard temperature (25°C) C2 : Capacitance at test temperature (T2) Adhesive Strength of Termination No indication of peeling shall occur on the terminal electrode A 5N f pull force shall be applied for 10±1second 5N f Resistance to Flexure of Substrate Appearance : No mechanical damage shall be occur C-Meter : Capacitance Change Bending shall be applied to the 1.0mm with 1.0mm/sec R230 C Meter 45±1mm 45±1mm NOTE : Specifications subject to change without notice. Please check our website for latest information. Bending Limit N : < ±5.0% X : < ±12.5% E/Z : < ±30.0% 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH VOLTAGE CHIP CAPACITORS 7. RELIABILITY & TEST CONDITION : V8N SERIES ITEM Solderability PERFORMANCE More than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve TEST CONDITION Solder Temp. : 245±5°C Dip Time : 5±0.5sec Immersing Speed : 25±10% mm/s Solder : H63A Flux : Rosin Preheat : At 80~120°C for 10~30sec Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Preheat : At 150±10°C for 60~120sec Dip : Solder Temp. of 260±5°C Dip Time : 10±1sec Immersing speed : 25±10% mm/s Solder : H63A Flux : Rosin Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Resistance to Soldering Heat Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Class II : Char. X Z/E Capacitance change Within ±10% Within ±20% Q(Class I), Tan (Class II), Insulation Resistance & Withstand Voltage : To satisfy the specified initial value Temperature Cycle Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Step 1 2 3 4 Capacitance change Within ±7.5% Within ±20% Temp. (°C) Min. rated temp. +0/-3 25 Min. rated temp. +3/-0 25 Time (min) 30 3 30 3 Class II : Char. X/B Y/Z/E Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Solder the capacitor on P.C. board before testing Q(Class I), Tan (Class II) & Insulation Resistance : To satisfy the specified initial value Humidity Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±5.0% or ±0.5pF whichever is larger of initial value Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature : 40±2°C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Solder the capacitor on P.C. board before testing Class II : Char. X Z/E Capacitance change Within ±15% Within ±30% NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH VOLTAGE CHIP CAPACITORS 7. RELIABILITY & TEST CONDITION : V8N SERIES ITEM Humidity PERFORMANCE Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Tan X Z/E (Class II) : Maximum 5.0% 5.0% TEST CONDITION Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature : 40±2°C Relative Humidity : 90~95% RH Test Time : 500 +12/-0 hr Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Solder the capacitor on P.C. board before testing Class II capacitors applied DC voltage (following table) is applied for 1 hr at max. operation temp. ±3°C then shall be set for 48±4 hrs at room temp. and the initial measurement shall be conducted. Applied Voltage : Rated Voltage V < 250Vdc Less than 1KVdc More than 1KVdc (include 1KV) Applied Voltage 150% rated voltage 120% rated voltage 100% rated voltage Char. Insulation Resistance : 1,000M or 50/C whichever is smaller. High Temperature Load Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±3.0% or ±0.3pF whichever is larger of initial value Class II : Char. X Z/E Capacitance change Within ±15% Within ±30% Q(Class I) : More than 30pF : Q > 350 30pF & below : Q > 275 +2.5xC Tan X Z/E (Class II) : Maximum 5.0% 5.0% Temp. : Max. operation temperature Test Time : 1000 +12/-0 hr Current Applied : 50mA max. Measure at room temp. after cooling for Class I : 24±2 hrs Class II : 48±4 hrs Char. Insulation Resistance : 1,000M or 50/C whichever is smaller. (C in Farad) Vibration Appearance : No mechanical damage shall be occur Class I : Char. N Capacitance change Within ±2.5% or ±0.25pF whichever is larger of initial value Solder the capacitor on P.C. board before testing Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55 Hz and back to 10Hz in about 1min. Repeat this for 2 hrs each in 3 perpendicular directions Class II : Char. X Z/E Capacitance change Within ±7.5% Within ±20% Q(Class I), Tan (Class II) & Insulation Resistance : To satisfy the specified initial value NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH VOLTAGE CHIP CAPACITORS 8. SOLDERIND AND MOUNTING : 8-1 Re-flow Soldering : V8N SERIES Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack on the components. The recommended heating rate depends on the size of the component, however it should not exceed 3°C/sec. 8-2 Wave Soldering : Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits. 8-3 Hand Soldering : Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommend unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron. How to solder repair by solder iron : 1) Selection of soldering iron tip The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size 2) recommended solder iron condition a) Preheat substrate to (60°C~120°C). b) 350°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm f) Limit soldering time to 5 secs. Cooling condition : Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temp. difference between the solvent and the chips must be less than 100°C. TEMPERATURE °C TEMPERATURE °C Preheating 260 217 Soldering Natural cooling Preheating 300 250 230 200 Soldering Natural cooling Over 1min. Over 1min. Gradual Cooling 70-90secs Over 2mins. Over 1min 2-3secs. Figure 1. Re-flow Soldering Figure 2. Wave Soldering TEMPERATURE °C Preheating 350 250 200 Soldering Natural cooling Within 5secs. Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 HIGH VOLTAGE CHIP CAPACITORS 9. PACKAGING INFORMATION : 9-1. Reel Dimension TYPE W A V8N SERIES A(mm) 382 Max. 382 Max. 382 Max. 382 Max. 178±0.2 178±0.2 178±0.2 B(mm) 50 Min. 50 Min. 50 Min. 50 Min. 60±0.2 60±0.2 60±0.2 C(mm) 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5 D(mm) 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 E(mm) 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 W(mm) 10±0.15 10±0.15 10±0.15 10±0.15 13±0.3 13±0.3 13±0.3 V2 V3 E C V4 V5 V6 D B V7 V8 9-2. Tape Dimension Ø1.5 +0.1 -0 1.75±0.1 A 4.0±0.1 2.0±0.05 TYPE 8.0±0.3 Ao(mm) 1.1±0.2 1.5±0.2 1.9±0.2 2.9±0.2 Bo(mm) 1.9±0.2 2.3±0.2 3.5±0.2 3.6±0.2 Ko(mm) 1.1 MAX. 1.1 MAX. 1.1 MAX. 1.1 MAX. P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 3.5±0.05 V2 Bo V3 V4 A P Ao Ko Section A-A V5 Ø1.5 +0.1 -0 1.75±0.1 A 4.0±0.1 2.0±0.05 t TYPE 12.0±0.3 5.5±0.05 Ao(mm) 2.5±0.2 3.6±0.2 5.4±0.2 Bo(mm) 4.9±0.2 4.9±0.2 6.1±0.2 Ko(mm) 4.0 MAX. 4.0 MAX. 4.0 MAX. P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.3 MAX. 0.3 MAX. 0.3 MAX. V6 Bo V7 Ko A 1.5±0.1 P Ao V8 Section A-A NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 HIGH VOLTAGE CHIP CAPACITORS V8N SERIES 9-3. Packaging Quantity V2 / V3 Tape Mat'l Paper Plastic T0.90mm 3000pcs/reel T