W3F371-RA-10

WIREWOUND TYPE COMMON MODE FILTER 1. PART NO. EXPRESSION : W3F900-RD-10 (a)(b) (d) (c) (e)(f) (g) W3 SERIES (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 900 = 90 (e) R : Tape & Reel (f) Rated Current : D = 400mA (g) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A C F B E 1 2 G2 H 1 2 D2 4 D2 G1 L 3 4 D1 3 D1 PCB Pattern D1 0.45 Typ. D2 0.40 Typ. E 0.17 Typ. F 0.27±0.05 G1 1.10 Ref. G2 0.45 Ref. H 1.25 Ref. Unit:m/m L 2.60 Ref. A 2.0±0.2 B 1.2±0.2 C 1.2±0.2 3. SCHEMATIC : 1 2 4 3 4. MATERIALS : d (a) Core : Ferrite U Core (b) Wire : Enamelled Copper Wire a c b (c) Terminal : Ag / Ni / Sn (d) Capsulate : Ferrite Cap NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 WIREWOUND TYPE COMMON MODE FILTER 5. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -40°C to +85°C W3 SERIES 6. ELECTRICAL CHARACTERISTICS : Part No. W3F900-RD-10 W3F121-RD-10 W3F161-RD-10 W3F221-RC-10 W3F371-RA-10 Common mode Impedance () 90±25% 120±25% 160±25% 220±25% 370±25% Test Frequency ( MHz ) 100 100 100 100 100 DCR () Max. 0.30 0.15 0.35 0.40 0.50 Rated Current ( mA ) 400 400 350 300 100 Rated Voltage ( Vdc ) 50 50 50 50 50 Withstand Voltage ( Vdc ) 125 125 125 125 125 IR () Min. 10M 10M 10M 10M 10M 7. CHARACTERISTICS CURVES : W3F900-RD-10 WCM2012F2SF-900 1000 W3F121-RD-10 WCM2012F2SF-121 1000 IMPEDANCE(Ohm) IMPEDANCE( Ohm) 100 Common Mode 100 Common Mode 10 10 1 Normal Mode 1 Normal Mode 0.1 1 10 100 1000 10000 0.1 1 10 100 1000 10000 FREQUENCY(MHz) FREQUENCY(M Hz) W3F161-RD-10 WCM2012F2SF-161 1000 W 3F221-RC-10 WCM2012F2SF-221 1000 IMPEDANCE(Ohm) 10 IMPEDANCE(Ohm) 100 Common Mode 100 Common Mode 10 1 Normal Mode 1 Normal Mode 0.1 1 10 100 1000 10000 0.1 1 10 100 1000 10000 FREQUENCY(MHz) FREQUENCY( MHz) W3F371-RA-10 10000 WCM2012F2S-361T01 Common Mode 1000 100 Normal Mode 10 1 0.1 1 10 100 1000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 WIREWOUND TYPE COMMON MODE FILTER 8. RELIABILITY & TEST CONDITION : W3 SERIES ITEM Electrical Characteristics Test Z (common mode) DCR I.R. Rated Current PERFORMANCE TEST CONDITION HP-4291A + HP-16092A Refer to standard electrical characteristics list HP-4338B Zentech 702A (Ultra High Resistance Meter) Applied the current to coils the impedance change should be less than ±25% to initial value and temperature rise should not be more than 30°C. Operating Temperature Storage Temperature Temperature Rise Test -40°C ~ +85°C -40°C ~ +85°C 30°C max. ( t) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Mechanical Performance Test Solderability Test More than 90% of termincal electrode should be covered with solder. Preheating Dipping Natural cooling 245°C 150°C 60 seconds 5±0.5 seconds After fluxing component shall be dipped in a melted solder bath at 245±5°C for 5 seconds. Solder Heat Resistance 1. Components should have not evidence of electrical and mechanical damage. 260°C Preheating Dipping Natural cooling 2. Impedance : within ±25% of initial value. 150°C 60 seconds 10±0.5 seconds Preheat : 150°C 60secs Solder : Sn-Ag3-Cu0.5 Solder temperature : 260±5°C Flux : rosin Dip time : 10±5 secs. Component Adhesion (Push Test) Size W4 (S) W3 (S) W4 (N) W3 (N) F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.) Glass Epoxy Substrate with Copper Clad The device should be reflow solder (230±5°C for 10 secs.) to a tinned copper substrate. A dynometer force gauge should be applied the side of the component. The device must withstand F(Kg) without failure of the termination attached to component. Core F Component Adhesion (Pull Test) Size W4 (S) W3 (S) W4 (N) W3 (N) F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.) 1. Insert 10cm wire into the remaining open eye bend, the ends of even wire lengths upward and wind together. 2. Terminal shall not be remarkably damaged. NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 WIREWOUND TYPE COMMON MODE FILTER 8. RELIABILITY & TEST CONDITION : W3 SERIES ITEM Reliabilty Test High Temperature Life Test PERFORMANCE TEST CONDITION Temperature : 85±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Low Temperature Life Test 1. Appearance : No damage. 2. Impedance : within ±25% of initial value. No disconnection or short circuit. Temperature : -40±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle Step 1 2 3 4 Temperature (°C) -40±3 Room Temperature 85±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Thermal Shock Conditions of 1 cycle Total : 10 cycle Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Temperature : 40±5°C Humidity : 90 to 95% Applied current : Rated current Time : 500±12hr Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within ±30% Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Random Vibration Test NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 WIREWOUND TYPE COMMON MODE FILTER 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 1 2 W3 SERIES 4 1.10 2.60 3 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.45 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Preheating Soldering 20~40s TEMPERATURE °C TEMPERATURE °C Natural cooling 1.25 Preheating 260 245 150 Soldering Natural cooling TP(260°C/10s max.) 217 200 150 60~180s 480s max. 60~150s 25 Time(sec.) Figure 1. Re-flow Soldering Over 2min. Gradual Cooling Within 3s Figure 2. Wave Soldering Preheating Soldering 3s (max.) 10s (max.) TEMPERATURE °C Natural cooling 350 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 WIREWOUND TYPE COMMON MODE FILTER 10. PACKAGING INFORMATION : 10-1. Reel Dimension A W3 SERIES Type 7" x 8mm D B C A(mm) 9.0±0.5 B(mm) 60.0±2.0 C(mm) D(mm) 13.5±0.5 178.0±2.0 2±0.5 13.5±0.5 R10.5 7" x 8mm 7" x 12mm R1.9 R0.5 120° 10-2 Tape Dimension / 8mm Po:4±0.1 D:1.5+0.1 A W:8.0±0.1 t P2:2±0.05 E:1.75±0.1 Series W3 (S) W4 (S) Bo Size 201212 321620 201209 321615 Bo(mm) 2.35±0.10 3.50±0.10 2.50±0.10 3.50±0.10 Ao(mm) 1.50±0.10 1.88±0.10 1.60±0.10 1.88±0.10 Ko(mm) 1.45±0.10 2.10±0.10 1.25±0.10 1.80±0.10 P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 F:3.5±0.05 W3 (N) Ko P A D1:1±0.1 Ao W4 (N) Section A-A 10-1. Reel Dimension Chip Size Chip / Reel Inner Box Middle Box Carton W3 2000 / 3000 10000 / 15000 50000 / 75000 100000 / 150000 W4 2000 10000 50000 100000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 14.04.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6