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W4F601-RC-10

W4F601-RC-10

  • 厂商:

    SUPERWORLD(西普尔)

  • 封装:

  • 描述:

    W4F601-RC-10 - WIREWOUND TYPE COMMON MODE FILTER - Superworld Electronics

  • 数据手册
  • 价格&库存
W4F601-RC-10 数据手册
WIREWOUND TYPE COMMON MODE FILTER 1. PART NO. EXPRESSION : W4F300-RD-10 (a)(b) (d) (c) (e)(f) (g) W4 SERIES (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 300 = 30 (e) R : Tape & Reel (f) Rated Current : D = 400mA (g) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A C B E 1 2 G2 H 1 2 D2 4 D2 G1 L 3 4 D1 3 D1 PCB Pattern C D1 D2 E G1 1.90 Ref. G2 0.40 Ref. H 1.60 Ref. Unit:m/m L 3.70 Ref. A B 3.20±0.20 1.60±0.20 2.00±0.20 0.50±0.10 0.50±0.10 0.15±0.10 3. SCHEMATIC : 1 2 4 3 4. MATERIALS : d (a) Core : Ferrite U Core (b) Wire : Enamelled Copper Wire a c b (c) Terminal : Ag / Ni / Sn (d) Capsulate : Ferrite Cap NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 WIREWOUND TYPE COMMON MODE FILTER 5. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -40°C Max. 70% RH W4 SERIES 6. ELECTRICAL CHARACTERISTICS : Part No. W4F300-RD-10 W4F670-RD-10 W4F800-RD-10 W4F900-RD-10 W4F121-RD-10 W4F161-RC-10 W4F181-RC-10 W4F221-RC-10 W4F261-RC-10 W4F281-RC-10 W4F301-RC-10 W4F361-RC-10 W4F431-RC-10 W4F471-RC-10 W4F551-RC-10 W4F601-RC-10 W4F222-RB-10 Common mode Impedance () 30±25% 67±25% 80±25% 90±25% 120±25% 160±25% 180±25% 220±25% 260±25% 280±25% 300±25% 360±25% 430±25% 470±25% 550±25% 600±25% 2200±25% Test Frequency ( MHz ) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 DCR () Max. 0.20 0.30 0.30 0.30 0.30 0.35 0.35 0.45 0.45 0.45 0.50 0.60 0.60 0.70 0.75 0.80 1.20 Rated Current ( mA ) 400 400 400 400 400 350 350 300 300 300 300 300 300 300 300 300 200 Rated Voltage ( Vdc ) 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 Withstand Voltage ( Vdc ) 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 125 IR () Min. 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M 10M NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 WIREWOUND TYPE COMMON MODE FILTER 7. CHARACTERISTICS CURVES : W4 SERIES W4F300-RD-10 1000 1000 W4F670-RD-10 1000 Common Mode W4F800-RD-10 IMPEDANCE ( ) IMPEDANCE ( ) 100 10 1 0.1 1 Common Mode IMPEDANCE ( ) 100 10 1 100 10 1 0.1 Common Mode Normal Mode Normal Mode Normal Mode 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) W4F900-RD-10 1000 1000 Common Mode W4F121-RD-10 1000 Common Mode W4F161-RC-10 IMPEDANCE ( ) IMPEDANCE ( ) IMPEDANCE ( ) 100 10 1 0.1 1 100 10 1 0.1 100 10 1 0.1 Common Mode Normal Mode Normal Mode Normal Mode 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) W4F181-RC-10 1000 1000 W4F221-RC-10 1000 Common Mode W4F261-RC-10 IMPEDANCE ( ) IMPEDANCE ( ) 100 10 1 0.1 1 Common Mode IMPEDANCE ( ) 100 10 1 0.1 100 10 1 0.1 Common Mode Normal Mode Normal Mode Normal Mode 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 WIREWOUND TYPE COMMON MODE FILTER 7. CHARACTERISTICS CURVES : W4 SERIES W4F281-RC-10 1000 100 10 1 0.1 1 10 100 1000 10000 Normal Mode Common Mode W4F301-RC-10 10000 1000 Common Mode W4F361-RC-10 10000 1000 Common Mode IMPEDANCE ( ) IMPEDANCE ( ) 100 10 1 0.1 1 10 100 1000 10000 Normal Mode IMPEDANCE ( ) 100 10 1 0.1 1 10 100 1000 10000 Normal Mode FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) W4F431-RC-10 10000 1000 Common Mode W4F471-RC-10 10000 1000 Common Mode W4F551-RC-10 10000 1000 Common Mode IMPEDANCE ( ) IMPEDANCE ( ) 100 10 1 0.1 1 10 100 1000 10000 Normal Mode 100 10 1 0.1 1 10 100 1000 10000 Normal Mode IMPEDANCE ( ) 100 10 1 0.1 1 10 100 1000 10000 Normal Mode FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) W4F601-RC-10 10000 1000 100 10 0.1 1 10 100 1000 10000 Normal Mode Common Mode W4F222-RB-10 10000 1000 100 10 0.1 1 10 100 1000 10000 Normal Mode Common Mode IMPEDANCE ( ) FREQUENCY (MHz) IMPEDANCE ( ) FREQUENCY (MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 WIREWOUND TYPE COMMON MODE FILTER 8. RELIABILITY & TEST CONDITION : W4 SERIES ITEM Electrical Characteristics Test Z (common mode) DCR I.R. Rated Current PERFORMANCE TEST CONDITION HP-4291A + HP-16092A Refer to standard electrical characteristics list HP-4338B Zentech 702A (Ultra High Resistance Meter) Applied the current to coils the impedance change should be less than ±25% to initial value and temperature rise should not be more than 30°C. Operating Temperature Storage Temperature Temperature Rise Test -40°C ~ +85°C -40°C ~ +85°C 30°C max. ( t) 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Mechanical Performance Test Solderability Test More than 90% of termincal electrode should be covered with solder. Preheating Dipping Natural cooling 245°C 150°C 60 seconds 5±0.5 seconds After fluxing component shall be dipped in a melted solder bath at 245±5°C for 5 seconds. Solder Heat Resistance 1. Components should have not evidence of electrical and mechanical damage. 2. Impedance : within ±25% of initial value. 150°C 60 seconds 10±0.5 seconds 260°C Preheating Dipping Natural cooling Preheat : 150°C 60secs Solder : Sn-Ag3-Cu0.5 Solder temperature : 260±5°C Flux : rosin Dip time : 10±5 secs. Component Adhesion (Push Test) Size W4 (S) W3 (S) W4 (N) W3 (N) F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.) The device should be reflow solder (230±5°C for 10 secs.) to a tinned copper substrate. A dynometer force gauge should be applied the side of the component. The device must withstand F(Kg) without failure of the termination attached to component. Core Glass Epoxy Substrate with Copper Clad F Component Adhesion (Pull Test) Size W4 (S) W3 (S) W4 (N) W3 (N) F (Kg) 0.8 (min.) 0.5 (min.) 0.8 (min.) 0.5 (min.) 1. Insert 10cm wire into the remaining open eye bend, the ends of even wire lengths upward and wind together. 2. Terminal shall not be remarkably damaged. NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 WIREWOUND TYPE COMMON MODE FILTER 8. RELIABILITY & TEST CONDITION : W4 SERIES ITEM Reliabilty Test High Temperature Life Test PERFORMANCE TEST CONDITION Temperature : 85±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Low Temperature Life Test 1. Appearance : No damage. 2. Impedance : within ±25% of initial value. No disconnection or short circuit. Temperature : -40±5°C Time : 500±12hr. Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle Step 1 2 3 4 Temperature (°C) -40±3 Room Temperature 85±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Thermal Shock Conditions of 1 cycle Total : 10 cycle Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Temperature : 40±5°C Humidity : 90 to 95% Applied current : Rated current Time : 500±12hr Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Appearance : Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within ±30% Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Random Vibration Test NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 WIREWOUND TYPE COMMON MODE FILTER 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 1 2 W4 SERIES 4 1.90 3.70 3 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.40 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 240°C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip Soldering Natural cooling 1.60 d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating Soldering Natural cooling Preheating TEMPERATURE °C 230 (446) 150 (302) TEMPERATURE °C 250 230 150 Over 1min. Over 1min. Gradual Cooling Within 10secs. Over 2mins. Gradual Cooling Within 3secs. Preheating Soldering TEMPERATURE °C Figure 1. Re-flow Soldering 280 230 150 Natural cooling Figure 2. Wave Soldering Over 1min. Gradual Cooling Within 3secs. Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 WIREWOUND TYPE COMMON MODE FILTER 10. PACKAGING INFORMATION : 10-1. Reel Dimension A W4 SERIES Type 7" x 8mm D B C A(mm) 9.0±0.5 B(mm) 60.0±2.0 C(mm) D(mm) 13.5±0.5 178.0±2.0 2±0.5 13.5±0.5 R10.5 7" x 8mm 7" x 12mm R1.9 R0.5 120° 10-2 Tape Dimension / 8mm Po:4±0.1 D:1.5+0.1 A W:8.0±0.1 t P2:2±0.05 E:1.75±0.1 Series W3 (S) W4 (S) Bo Size 201212 321620 201209 321615 Bo(mm) 2.35±0.10 3.50±0.10 2.50±0.10 3.50±0.10 Ao(mm) 1.50±0.10 1.88±0.10 1.60±0.10 1.88±0.10 Ko(mm) 1.45±0.10 2.10±0.10 1.25±0.10 1.80±0.10 P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 F:3.5±0.05 W3 (N) W4 (N) P A D1:1±0.1 Ao Ko Section A-A 10-3. Packing Quantity Chip Size Chip / Reel Inner Box Middle Box Carton W3 2000 / 3000 10000 / 15000 50000 / 75000 100000 / 150000 W4 2000 10000 50000 100000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 WIREWOUND TYPE COMMON MODE FILTER W4 SERIES 10-4. Tearing Off Force F 165° to 180° Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 17.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9
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