BZT52C30

Surface mount zener diode FEATURES Planar die construction. 500mW power dissipation on ceramic PCB. General purpose, medium current. BZT52C2V4-BZT52C51 Pb Lead-free Ideally suited for automated assembly processes. APPLICATIONS Zener diode. Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. BZT52C2V4-BZT52C51 Marking See table 2 Package Code SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Forward Voltage Power Dissipation Thermal resistance,junction to ambient air Junction temperature Storage temperature range @ IF=10mA Symbol VF Pd RθjA Tj Tstg Value 0.9 500 305 150 -65-150 Unit V mW ℃/W ℃ ℃ Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 2. Short duration test pulse used to minimize self-heating effect. 3. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 4. f = 1KHz www.shunyegroup.com Surface mount zener diode BZT52C2V4-BZT52C51 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Zener Voltage Range VZ@IZT Nom(V) BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16 BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39 BZT52C43 BZT52C47 BZT52C51 WX W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WQ WR WS WT WU WV WW 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 Min(V) 2.2 2.5 2.8 3.1 3.4 3.7 4.0 4.4 4.8 5.2 5.8 6.4 7.0 7.7 8.5 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28.0 31.0 34.0 37.0 40.0 44.0 48.0 Max(V) 2.6 2.9 3.2 3.5 3.8 4.1 4.6 5.0 5.4 6.0 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32.0 35.0 38.0 41.0 46.0 50.0 54.0 IZT mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 5 5 5 100 100 95 95 90 90 90 80 60 40 10 15 15 15 15 20 20 25 30 30 40 45 55 55 70 80 80 80 90 130 100 100 100 Maximum Zener Impedance ZZT@IZT Ω 600 600 600 600 600 600 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 700 750 750 ZZK@IZK IZK mA 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 1.0 1.0 1.0 Maximum Reverse Current IR μA 50 20 10 5.0 5.0 3.0 3.0 3.0 2.0 1.0 3.0 2.0 1.0 0.7 0.5 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 @VR V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 32 35 38 Typical Temperature Coefficient@ IZTC mV/℃ Min -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 7.0 9.2 10.4 12.4 14.4 16.4 18.4 21.4 24.4 27.4 30.4 33.4 10.0 10.0 10.0 Max 0 0 0 0 0 0 0 0 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 10.0 11.0 13.0 14.0 16.0 18.0 20.0 22.0 25.3 29.4 33.4 37.4 41.2 12.0 12.0 12.0 Test Current IZTC mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 5 5 5 Type Number Marking Code www.shunyegroup.com Surface mount zener diode BZT52C2V4-BZT52C51 TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified www.shunyegroup.com Surface mount zener diode PACKAGE OUTLINE Plastic surface mounted package BZT52C2V4-BZT52C51 SOD-123 K B SOD-123 Dim C Min 1.4 2.55 Max 1.8 2.85 A B A D H E J C D E H J K 1.15 Typical 0.5 0.3 0.02 0.6 0.4 0.10 0.1 Typical 3.55 3.85 All Dimensions in mm SOLDERING FOOTPRINT Unit : mm PACKAGE Device INFORMATION Package SOD-123 Shipping 3000/Tape&Reel BZT52C2V4-BZT52C51 www.shunyegroup.com