找到“specification”相关的规格书共2,748个
| 型号 | 厂商 | 描述 | 数据手册 | 替代料 | 参考价格 |
|---|---|---|---|---|---|
| AA60A-036L-050D033H-8 | ASTEC[AstecAmerica,Inc] | AA60A-036L-050D033H-8 - This specification covers the requirement for a wide input voltage range (18V to 60V) half brick - baseplate design, - Astec America, Inc | 获取价格 | ||
| K4H1G0838M-UCA2 | SAMSUNG[Samsungsemiconductor] | K4H1G0838M-UCA2 - 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 | ||
| K4H1G0838M-UC2 | SAMSUNG[Samsungsemiconductor] | K4H1G0838M-UC2 - 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 | ||
| K4H1G0838M-LB0 | SAMSUNG[Samsungsemiconductor] | K4H1G0838M-LB0 - 1Gb M-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) - Samsung semiconductor | 获取价格 | ||
| KVR400D2N3K2 | ETC2[ListofUnclassifedManufacturers] | KVR400D2N3K2 - MEMORY MODULE SPECIFICATION 512MB (256MB 32M x 64-BIT x 2 PCS.) DDR2-400 CL3 240-PIN DIMM KIT - List of Unclassifed Manufacturers | 获取价格 | ||
| KVR266X64SC25 | ETC2[ListofUnclassifedManufacturers] | KVR266X64SC25 - MEMORY MODULE SPECIFICATION 512MB 64M x 64-BIT DDR266 CL2.5 200-PIN SODIMM - List of Unclassifed Manufacturers | 获取价格 | ||
| KVR400D2N3K2512 | ETC2[ListofUnclassifedManufacturers] | KVR400D2N3K2512 - MEMORY MODULE SPECIFICATION 512MB (256MB 32M x 64-BIT x 2 PCS.) DDR2-400 CL3 240-PIN DIMM KIT - List of Unclassifed Manufacturers | 获取价格 | ||
| CAT34TS00VP2GT4A | Murata Manufacturing Co., Ltd. | CAT34TS00 is a low-voltage digital temperature sensor, which implements the JEDEC JC42.4 specification. CAT34TS00 measures temperature every 100 ms over a range of -20°C to +125°C, with a resolution of 12 bits. The host communicates with the device via th | 获取价格 |
