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TX0351A

TX0351A

  • 厂商:

    TAI-SAW(台湾嘉硕)

  • 封装:

  • 描述:

    TX0351A - VCTCXO SMD 3.2x2.5 13.57285156MHz - TAI-SAW TECHNOLOGY CO., LTD.

  • 详情介绍
  • 数据手册
  • 价格&库存
TX0351A 数据手册
TAI-SAW TECHNOLOGY CO., LTD. VCTCXO SMD 3.2x2.5 13.57285156MHz MODEL NO.: TX0351A REV. NO.: 1 Revise: Rev. 1 Rev. Page N/A Rev. Account Initial release Date Ref. No. Revised by Kelly Huang 8/17/09’ N/A TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com VCTCXO SMD 3.2x2.5 13.57285156MHz MODEL NO.: TX0351A REV. NO.: 1 RoHS Compliant Lead free Lead-free soldering Features: Ultra Miniature SMD Package Good Frequency Stability Good Phase Noise Response Description and Applications: Surface mount 3.2mmx2.5mm VCTCXO for for use in wireless communications devices Electrical Specifications: TX0351A Nominal Frequency, Fo Storage Temperature Range Operating Temperature Range Power Supply Voltage, Vdd Output Voltage with Load 10pF//10KΩ, Vout Power Supply Current, Idd Control Voltage, Vcon Frequency Tolerance (Vcon=1.5V) Vcon Frequency Control Range (1.5+/-1.0 V) Frequency Stability a. Vs. Temperature (-30~75°C) b. Vs. Load varied 10pF//10KΩ+/-10% c. Vs. Supply Voltage varied 2.0V+/-5% Start Up Time (90% of final RF level in Vp-p) Harmonics SSB Phase Noise (@1KHz Carrier Offset) Marking Specifications 13.57285156MHz -40°C to +85°C -30°C to +75°C 2.0 V 0.8 Vp-p min 2.0 mA max 1.0 +/- 1.0 V +/- 1.0 ppm max @ 25°C +/- 3°C +/-10 ppm/V min +/- 2.5 ppm +/- 0.2 ppm +/- 0.2 ppm 3.0 msec max. -5.0 dBc max -130 dBc/Hz max Laser marking TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 Mechanical Dimensions (mm): Marking: Line 1: Customer Frequency (13.57) Line 2: TST Logo + Crystal Product Code + Date Code Product Code Table 2009 2010 2014 2018 2011 2015 2019 2012 2016 2020 Year product code Date Code Table W K01 A WK14 N WK27 a WK40 n WK02 B WK15 O WK28 b WK41 o WK03 C WK16 P WK29 c WK42 p 2013 2017 X WK04 D WK17 Q WK30 d WK43 q WK05 E WK18 R WK31 e WK44 r x WK06 F WK19 S WK32 f WK45 s WK07 G WK20 T WK33 g WK46 t WK08 H WK21 U WK34 h WK47 u X WK09 I WK22 V WK35 i WK48 v WK10 J WK23 W WK36 j WK49 w x WK11 K WK24 X WK37 k WK50 x WK12 L WK25 Y WK38 l WK51 y WK13 M WK26 Z WK39 m WK52 z TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 Recommended Circuit Packing (mm): 1. Reel Dimension A Dimensions Tolerance 180 B C D E 9.1 F 2.9 H 3.9 G T2 T1 T3 9.0 1.2 60 13.0 2.0 4.9 11.4 ±1.0 +1.0 ±0.2 ±0.5 ±0.5 ±0.5 ±0.5 ±0.5 ±1.0 ±0.3 ±0.1 2. Tape Dimension Unit: mm Dimension Tolerance A0 B0 W 8.00 F 3.5 ±0.05 E P0 P1 P2 2 ±0.05 D1 1.50 D 1.0 K0 1.75 t 0.25 ±0.02 2.80 3.71 1.75 4.00 4.00 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 +0.3/-0.1 +0.1/-0.00 +0.25/-0.00 ±0.1 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Packing Quantity/Packing: Reflow Profile: 300 Reflow Area 250 Temperature (deg C) 200 150 100 50 0 0 Rising Area Preheat Area Forced Cooling Area Max peak temperature: 260 deg C 60 120 180 Time (seconds) 240 300 360 TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 Notes of the Usage: 1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec. 2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering terminals, also make some cracks on the soldering termination. Some cracks will cause open or short circuit and cause of thermal increasing or smoking. Don’t make any excess mechanical stress to soldering points. 3. In case of giving a heavy shock to the products, it may make an open or short circuit and cause of thermal increasing and smoking. To avoid heavy shock impact applying to products is strictly required. Notes of the Storage: 1. To keep products under the condition at the room temperature (-5~35 deg C) with normal humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of characteristics and a short circuit. 2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas will make a cause of the open or short circuit. Keep it in the clean place where is not in dusty and no corrosive gas. 3. Use the unti-static material to the storage package. 4. Don’t put any excess weight to the VCTCXO in the storage process. 5. Don’t move the product from the cold place to the hot place in the short time, otherwise it may make some dew-drop, then a short circuit may happen in case. 6. Storage periods should be maximum 6 months under condition of above item 1 after delivery from TST factory. 7. Once open the bag, there is possibility of electrical characteristics deterioration due to absorption of moisture. So, please use parts within 7 days after opening the bag. 8. If you have to keep parts without using after opening the bag, please put the drying agent in the bag, fold the bag and keep it in the place where temperature and humidity are controlled (nitrogen atmosphere box etc.) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7
TX0351A
1. 物料型号: - 型号编号:TX0351A

2. 器件简介: - 该器件为表面贴装的3.2mm x 2.5mm VCTCXO(压控温补晶振),用于无线通信设备。

3. 引脚分配: - 1号引脚:Vc(控制电压) - 2号引脚:Ground(地) - 3号引脚:Output(输出) - 4号引脚:Vcc(电源电压)

4. 参数特性: - 标称频率:13.57285156MHz - 工作温度范围:-30°C至+75°C - 供电电压:2.0V - 输出电压(负载10pF//10KΩ):最小0.8Vp-p - 电源电流:最大2.0mA - 控制电压:1.0V±1.0V - 频率容差(Vcon=1.5V):±1.0ppm最大@25°C±3°C - Vcon频率控制范围(1.5V±1.0V):±10ppm/V最小 - 频率稳定性:温度变化±2.5ppm,负载变化±0.2ppm,供电电压变化±0.2ppm - 启动时间(达到最终RF电平的90%):最大3.0毫秒 - 谐波:最大-5.0dBc - 单边带相位噪声(1kHz载波偏移):最大-130dBc/Hz

5. 功能详解: - 该器件具有超小型SMD封装,良好的频率稳定性和相位噪声响应,符合RoHS标准,无铅焊接。

6. 应用信息: - 用于无线通信设备。

7. 封装信息: - 机械尺寸(mm):具体尺寸图请参考文档中的图示。 - 封装类型:3.2x2.5mm的SMD封装。
TX0351A 价格&库存

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