TX0572DA1135

TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com Product Specifications Approval Sheet Product Name: TCXO SMD 3.2x2.5 20.0000MHz TST Part No.: TX0572DA1135 Customer Part No.: Company: Division: Approved by: Date: Checked by: Shaoyen Feng Approved by: Kelly Huang Date: 06/05/2023 1. Customer signed back is required before TST can proceed with sample build and receive orders. 2. Orders received without customer signed back will be regarded as agreement on the specifications. 3. Any specifications changes must be approved upon by both parties and a new revision of specifications shall be released to reflect the changes. TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document FR-71S03-02 TAI-SAW TECHNOLOGY CO., LTD. TCXO SMD 3.2x2.5 20.0000MHz MODEL NO.: TX0572DA1135 REV. NO.: 1 Revise: Rev. Rev. Page Rev. Account Date 1 N/A Initial release 06/05/23’ N/A TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Revised by Shaoyen Feng 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: tstsales@mail.taisaw.com Web: www.taisaw.com TCXO SMD 3.2x2.5 20.0000MHz MODEL NO.: TX0572DA1135 REV. NO.: 1 Features:     Ultra Miniature SMD Package Good Frequency Stability Good Phase Noise Response Moisture Sensitivity Level (MSL) : Level-1 RoHS Compliant Lead free Lead-free soldering Description and Applications: Surface mount 3.2mmx2.5mm TCXO for use in wireless communications devices Electrical Specifications: TX0572DA1135 Specifications Nominal Frequency, Fo 20.000000 MHz Storage Temperature Range -40C to +85C Operating Temperature Range -30C to +85C Power Supply Voltage, Vcc 3.3 V +/- 5% Output Voltage with Load 10pF//10KΩ, Vout 0.8 Vp-p min Output Waveform Clipped Sinewave Power Supply Current, Icc 2.0 mA max Frequency Tolerance as Received Ref. to Nominal Frequency Frequency Deviation after 2 x Reflow Ref. to pre-reflow Freq. Frequency Stability a. Vs. Temperature (-30~85C) b. Vs. Load varied 10pF//10KΩ+/-10% c. Vs. Supply Voltage varied Vcc+/-5% +/- 2.0 ppm max @ 25C +/- 3C +/- 1.0 ppm max @ 25C +/- 3C +/- 2.0 ppm reference to 25C +/- 0.2 ppm +/- 0.3 ppm Start Up Time (90% of final RF level in Vp-p) 3.0 msec max. Aging +/-1.0 ppm/year @25C Harmonics -5.0 dBc max SSB Phase Noise (@1KHz Carrier Offset) -130 dBc/Hz max TAI-SAW TECHNOLOGY CO., LTD. 3 Mechanical Dimensions (mm): Recommended Land Pattern: (unit: mm) TAI-SAW TECHNOLOGY CO., LTD. 4 Marking: Line 1: Customer Frequency (20.0) Line 2: TST Logo + Date Code + Product Code ( □ is TST internal tracking code, could be a~z and A~Z) PIN#4 PIN#3 PIN#1 PIN#2 Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 A B C D E F G H I J K L M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v w x y z Product Code Table: (Under line With Even Year and Odd Year for Nothing) Recommended Circuit TAI-SAW TECHNOLOGY CO., LTD. 5 Packing (mm): 1. Reel Dimension 2. Tape Dimension Unit: mm A0 B0 W F Dimension 2.80 3.71 8.00 3.5 Tolerance ±0.1 ±0.1 +0.3/-0.1 ±0.05 E P0 P1 P2 D1 D K0 t 1.75 4.00 4.00 2 1.50 1.0 1.75 0.25 ±0.1 ±0.1 ±0.1 ±0.05 +0.1/-0.00 +0.25/-0.00 ±0.1 ±0.02 TAI-SAW TECHNOLOGY CO., LTD. 6 Packing Quantity/Packing: Reflow Profile: 300 Reflow Area Rising Area Temperature (deg C) 250 Preheat Area Forced Cooling Area 200 150 100 Max peak temperature: 260 deg C 50 0 0 60 120 180 240 300 360 Time (seconds) TAI-SAW TECHNOLOGY CO., LTD. 7 Notes of the Usage: 1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec. 2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering terminals, also make some cracks on the soldering termination. Some cracks will cause open or short circuit and cause of thermal increasing or smoking. Don’t make any excess mechanical stress to soldering points. 3. In case of giving a heavy shock to the products, it may make an open or short circuit and cause of thermal increasing and smoking. To avoid heavy shock impact applying to products is strictly required. 4. Ultrasonic cleaning should be avoided to prevent damage to the TCXO. 5. Do Not Use Ultrasonic-Wave Soldering or Wave Solder with Package Immersed in Solder. Notes of the Storage: 1. To keep products under the condition at the room temperature (-5~35 deg C) with normal humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of characteristics and a short circuit. 2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas will make a cause of the open or short circuit. Keep it in the clean place where is not in dusty and no corrosive gas. 3. Use the unti-static material to the storage package. 4. Don’t put any excess weight to the TCXO in the storage process. 5. Don’t move the product from the cold place to the hot place in the short time, otherwise it may make some dew-drop, then a short circuit may happen in case. 6. Storage periods should be maximum 6 months under condition of above item 1 after delivery from TST factory. 7. Once open the bag, there is possibility of electrical characteristics deterioration due to absorption of moisture. So, please use parts within 7 days after opening the bag. 8. If you have to keep parts without using after opening the bag, please put the drying agent in the bag, fold the bag and keep it in the place where temperature and humidity are controlled (nitrogen atmosphere box etc.) TAI-SAW TECHNOLOGY CO., LTD. 8 TAI-SAW TECHNOLOGY CO., LTD. 9