Notice for TAIYO YUDEN Products
[ For High Quality and/or Reliability Equipment
(Automotive Electronic Equipment / Industrial Equipment) ]
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully
before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or
equipment incorporating our products, which are caused under the conditions other than those specified in this
catalog or individual product specification sheets.
■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification
sheets are available.
■ Please conduct validation and verification of our products in actual condition of mounting and operating
environment before using our products.
■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA
equipment, home electric appliances, office equipment, information and communication equipment), medical
equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc.
Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which
may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment,
medical equipment classified as Class III by IMDRF).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,
aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control
equipment, undersea equipment, military equipment).
*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,
in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN.
Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.
When our products are used even for high safety and/or reliability-required devices or circuits of general electronic
equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to
install a protection circuit as necessary.
Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way
responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog
for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.
■ Information contained in this catalog is intended to convey examples of typical performances and/or applications
of our products and is not intended to make any warranty with respect to the intellectual property rights or any
other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.
■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and
TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.
Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in
accordance with such agreement.
■ The contents of this catalog are applicable to our products which are purchased from our sales offices or
authorized distributors (hereinafter“TAIYO YUDEN’
s official sales channel”). Please note that the contents of this
catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’
s official sales
channel.
■ Caution for Export
Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export
Administration Regulations”
,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable
regulations. Should you have any questions on this matter, please contact our sales staff.
19
Automotive Application Guide
We classify automotive electronic equipment into the following four application categories and set usable
application categories for each of our products. When using our products for automotive electronic
equipment, please be sure to check such application categories and use our products accordingly. Should
you have any questions on this matter, please contact us.
Category
SAFETY
・ABS (Anti-Lock Brake System)
・ESC (Electronic Stability Control)
・Airbag
・ADAS (Equipment that directly controls running, turning and stopping), etc.
BODY & CHASSIS
・Wiper
・Automatic Door
・Power Window
・Keyless Entry System
・Electric Door Mirror
・Interior Lighting
・LED Headlight
・TPMS (Tire Pressure Monitoring System)
・Anti-Theft Device (Immobilizer), etc.
INFOTAINMENT
・Car Infotainment System
・ITS/Telematics System
・Instrument Cluster
・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc.
Automotive Application Guide
POWERTRAIN
Automotive Electronic Equipment (Typical Example)
・Engine ECU (Electronically Controlled Fuel Injector)
・Cruise Control Unit
・4WS (4 Wheel Steering)
・Automatic Transmission
・Power Steering
・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC)
・Automotive Locator (Car location information providing device), etc.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
15
MULTILAYER
INDUCTORS(BK
SERIES)
MULTILAYER CHIPCHIP
BEAD BEAD
INDUCTORS
(BK SERIES)
REFLOW
REFLOW
AEC-Q200
AEC-Q200
■PART NUMBER
B
K △
①
1
*Operating Temp. : -55～125℃
0
0
5
②
①Series name
Code
BK△
H
S
1
③
2 1
④
－ T V
⑤ ⑥ ⑦
④Nominal impedance
Code
（example）
100
330
121
102
Series name
Multilayer chip bead inductor
②Dimensions（L×W）
Code
Type（inch）
1005
1005（0402）
／ FERRITE BEAD INDUCTORS
NOISE SUPPRESSION COMPONENTS
③Material
Code
HW
HS
HR
HM
LM
LL
△＝Blank space
Dimensions
（L×W）［mm］
1.0×0.5
⑤Characteristics
Code
－
Material
⑥Packaging
Code
T
Refer to impedance curves
for material differences
Nominal impedance［Ω］
10
33
120
1000
Characteristics
Standard
Packaging
Taping
⑦Internal code
Code
V
Internal code
MLCI for Industrial and Automotive
■FEATURES
●HW：For broadband noise suppression.
●HS：For broadband noise suppression.
●HR：For upper 10MHz noise suppression.
●HM：For upper 20MHz noise suppression.
●LM：For high frequency noise suppression around 200MHz.
●LL：For high frequency noise suppression from 100MHz.
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
Type
BK 1005
（0402）
L
W
T
e
1.00±0.05
（0.039±0.002）
0.50±0.05
（0.020±0.002）
0.50±0.05
（0.020±0.002）
0.25±0.10
（0.010±0.004）
Standard quantity [pcs]
Paper tape
Embossed tape
10000
－
Unit：mm（inch）
hq_i_mlci_BK_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
78
19
■PART NUMBER
・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant.
Note)
・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels.
・ *1: Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products.
＜ ：AEC-Q200
qualified＞
AEC-Q200
All the Multilayer Chip Bead Inductors of *1 marks are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc.,
and please review and approve TAIYO YUDEN's product specification before ordering.
・ *2: Industrial products and Medical products
●BK 1005
Part number
1005HW680-TV
1005HW121-TV
1005HW241-TV
1005HW431-TV
1005HW601-TV
1005HS100-TV
1005HS330-TV
1005HS680-TV
1005HS800-TV
1005HS121-TV
1005HS241-TV
1005HS431-TV
1005HS601-TV
1005HS102-TV
1005HR601-TV
1005HM750-TV
1005HM121-TV
1005HM241-TV
1005HM471-TV
1005HM601-TV
1005HM102-TV
1005LL100-TV
1005LL220-TV
1005LL330-TV
1005LL470-TV
1005LL680-TV
1005LL121-TV
1005LL181-TV
1005LL241-TV
1005LM182-TV
Nominal impedance
［Ω］
68
120
240
430
600
10
33
68
80
120
240
430
600
1000
600
75
120
240
470
600
1000
10
22
33
47
68
120
180
240
1800
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.17
0.24
0.31
0.50
0.60
0.03
0.06
0.10
0.10
0.20
0.30
0.45
0.55
0.58
0.60
0.18
0.18
0.30
0.45
0.50
0.70
0.11
0.18
0.25
0.33
0.31
0.45
0.50
0.70
0.90
Rated current
［mA］（max.）
500
450
400
350
300
1,000
700
700
700
500
400
350
300
300
300
350
300
300
250
250
150
500
400
400
350
400
350
300
250
120
Thickness
［mm］
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
Note
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
*1
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
,*2
※）The rated current is the value of current at which the temperature of the element is increased within 20℃.
／ FERRITE BEAD INDUCTORS
NOISE SUPPRESSION COMPONENTS
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
hq_i_mlci_BK_e-E07R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
79
■ ELECTRICAL CHARACTERISTICS
■ BK1005
Z
50
100
0
10000
BK1005 HW601
BK1005 HS100
400
R
40
20
1
400
Z
X
10
100
1000
Frequency［MHz］
0
10000
1
200
40
R
Z
150
100
0
1
10
100
0
10000
200
800
150
150
100
100
R
50
Z
0
Impedance
［Ω］
1
R
X
10
100
1000
Frequency［MHz］
BK1005 HR601
BK1005 HS102
10000
BK1005 HM750
1000
200
800
150
600
100
1000
400
Z
50
200
0
BK1005 HM121
BK1005 HS431
400
10000
2000
250
10000
600
0
10
100
1000
Frequency［MHz］
10
100
1000
Frequency［MHz］
200
X
1
1
Frequency［MHz］
200
0
Ｒ
X
1000
1000
Z
Z
50
X
10000
10000
BK1005 HS680
250
250
50
10
100
1000
Frequency［MHz］
BK1005 HS330
60
X
10
100
1000
Frequency［MHz］
R
200
Impedance
［Ω］
Impedance
［Ω］
0
10000
BK1005 HS800
250
1
R
X
10
100
1000
Frequency［MHz］
10000
10
10000
0
0
500
400
200
Impedance
［Ω］
／ FERRITE BEAD INDUCTORS
NOISE SUPPRESSION COMPONENTS
10
100
1000
Frequency［MHz］
1
20
Z
R
X
1
R
80
60
200
Z
100
Impedance
［Ω］
Impedance
［Ω］
Z
0
0
10000
80
600
200
600
X
10
100
1000
Frequency［MHz］
100
800
Impedance
［Ω］
1
300
100
Ｘ
X
10
100
1000
Frequency［MHz］
1000
Ｒ
50
R
1
Ｚ
800
Impedance
［Ω］
100
150
BK1005 HW431
1000
400
Impedance
［Ω］
Impedance
［Ω］
Impedance
［Ω］
150
BK1005 HW241
500
200
200
0
BK1005 HW121
250
Impedance
［Ω］
BK1005 HW680
250
Z
150
300
R
200
100
100
50
0
X
10
100
1000
Frequency［MHz］
1
0
10000
1
BK1005 HM102
100
1000
BK1005 LL220
BK1005 LL100
2000
250
200
150
BK1005 LL330
250
500
200
400
150
300
100
200
50
100
1000
100
50
0
1
10
100
1000
10000
0
0
1
10
100
1000
10000
1
10
100
1000
10000
0
1
10
100
1000
10000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
80
19
■ ELECTRICAL CHARACTERISTICS
BK1005 LL470
500
BK1005 LL680
500
400
400
300
300
200
200
100
100
0
0
1
10
100
1000
1
10000
10
100
1000
10000
BK1005 LM182
2500
2000
1500
Z
1000
R
500
1
10
100
1000
／ FERRITE BEAD INDUCTORS
NOISE SUPPRESSION COMPONENTS
X
0
10000
■ Derating of Rated Current
●BK series
Until 125 ℃ ambient temperature, BK series is available at 100% of the rated current.
Please refer to the chart shown below.
Ratio to rated current (%)
120
BK series
100
80
60
40
20
0
-55 -35 -15 5 25 45 65 85 105 125
Ambient Temperature (℃)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
19
81
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
CKP2520（1008）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HK2125（0805）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCFK1608（0603）
MCFE1608（0603）
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
Thickness
mm（inch）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.6 （0.024）
0.65（0.026）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
－
2000
4000
－
－
2000
4000
－
－
3000
－
3000
－
3000
－
3000
－
2000
10000
－
4000
－
4000
－
－
2000
15000
－
10000
－
4000
－
－
4000
－
3000
15000
－
15000
－
15000
－
10000
－
15000
－
10000
－
15000
－
10000
－
4000
－
4000
－
－
2000
4000
－
－
4000
15000
－
10000
－
4000
－
4000
－
15000
－
－
10000
－
5000
－
4000
10000
－
4000
－
4000
－
3000
4000
－
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape
CK
CKP
CK
CKS
LK
LK
LK
HK
HK
HK
HKQ
AQ
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
BK
BK
BK
BK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
MC
MC
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1608
2012
CK
CKS
CKP
CKP
CKP
LK
HK
2125
2125
2012
2016
2520
2125
2125
BK
BK
MCF
MCF
MCF
MC
MC
2125
3216
0806
1210
2010
1608
2012
Chip cavity
Chip Filled
Chip
●Embossed Tape
Top tape
Sprocket hole
Base tape
Chip cavity
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Type
Thickness
mm（inch）
CK1608（0603）
0.8 （0.031）
CK2125（0805）
0.85（0.033）
CKS2125（0805）
0.85（0.033）
CKP1608（0603）
0.8 （0.031）
LK1005（0402）
0.5 （0.020）
LK1608（0603）
0.8 （0.031）
LK2125（0805）
0.85（0.033）
HK0603（0201）
0.3 （0.012）
HK1005（0402）
0.5 （0.020）
HK1608（0603）
0.8 （0.031）
HKQ0603W（0201）
0.3 （0.012）
HKQ0603S（0201）
0.3 （0.012）
HKQ0603U（0201）
0.3 （0.012）
AQ105（0402）
0.5 （0.020）
BK0603（0201）
0.3 （0.012）
BK1005（0402）
0.5 （0.020）
BK1608（0603）
0.8 （0.031）
BK2125（0805）
0.85（0.033）
BK2010（0804）
0.45（0.018）
BKP0603（0201）
0.3 （0.012）
BKP1005（0402）
0.5 （0.020）
BKP1608（0603）
0.8 （0.031）
BKP2125（0805）
0.85（0.033）
BKH0603（0201）
0.3 （0.012）
BKH1005（0402）
0.5 （0.020）
MCF0605（0202）
0.3 （0.012）
MCFK1608（0603）
0.6 （0.024）
MCEE1005（0402）
0.55（0.021）
MCFE1608（0603）
0.65（0.026）
MCHK2012（0805）
0.8 （0.031）
Chip cavity
Ａ
Ｂ
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.75±0.1
1.15±0.1
（0.030±0.004）
（0.045±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.2±0.1
2.17±0.1
（0.047±0.004）
（0.085±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
0.62±0.03
0.77±0.03
（0.024±0.001）
（0.030±0.001）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
0.8±0.05
1.3±0.05
(0.031±0.002)
(0.051±0.002)
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
Ｔ
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
0.45max
（0.018max）
0.45max
（0.018max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.72max
(0.028max)
0.6max
(0.016max)
0.9max
（0.035max）
0.9max
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
●Embossed Tape (8mm wide)
Unit：mm（inch）
A
B
8.0±0.3
(0.315±0.012)
3.5±0.05
(0.138±0.002)
Sprocket hole
F
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
Thickness
mm（inch）
CK2125（0805）
1.25（0.049）
CKS2125（0805）
1.25（0.049）
CKP2012（0805）
0.9 （0.035）
CKP2016（0806）
0.9 （0.035）
Chip cavity
Ａ
Ｂ
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
1.8±0.1
2.2±0.1
（0.071±0.004）
（0.087±0.004）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
1.9±0.1
（0.075±0.004）
0.75±0.05
（0.030±0.002）
1.15±0.05
（0.045±0.002）
1.1±0.1
（0.043±0.004）
1.1±0.1
（0.043±0.004）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
3.5±0.1
（0.138±0.004）
0.95±0.05
（0.037±0.002）
1.40±0.05
（0.055±0.002）
2.3±0.1
（0.091±0.004）
1.95±0.1
（±0.004）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
0.7 （0.028）
0.9 （0.035）
CKP2520（1008）
1.1 （0.043）
1.1 （0.043）
LK2125（0805）
1.25（0.049）
0.85（0.033）
HK2125（0805）
1.0 （0.039）
BK2125（0805）
1.25（0.049）
BK3216（1206）
0.8 （0.031）
MCF0806（0302）
0.4 （0.016）
MCF1210（0504）
0.55（0.022）
MCF2010（0804）
0.45（0.018）
MCKK1608（0603）
1.0 （0.039）
MCKK2012（0805）
1.0 （0.039）
Tape Thickness
K
T
2.0
0.3
（0.079）
（0.012）
2.0
0.3
（0.079）
（0.012）
1.3
0.3
（0.051）
（0.012）
1.3
0.25
（0.051）
（0.01）
1.4
（0.055）
1.4
（0.055）
0.3
（0.012）
1.7
（0.067）
1.7
（0.067）
2.0
0.3
（0.079）
（0.012）
1.5
（0.059）
0.3
（0.012）
2.0
（0.079）
2.0
0.3
（0.079）
（0.012）
1.4
0.3
（0.055）
（0.012）
0.55
0.3
（0.022）
（0.012）
0.65
0.3
（0.026）
（0.012）
0.85
0.3
（0.033）
（0.012）
1.4
0.25
（0.055）
（0.01）
1.35
0.25
（0.053）
（0.010）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel Size
t
E
C
R
B
D
A
W
A
φ178±2.0
B
φ50 or more
C
φ13.0±0.2
4mm width tape
8mm width tape
t
1.5max.
2.5max.
W
5±1.0
10±1.5
D
φ21.0±0.8
E
2.0±0.5
R
1.0
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKP series
Specified Value
LK series
HK series
－55～＋125℃
－55～＋125℃ （Including self-generated heat）
－40～＋85℃
－55～＋125℃
2. Storage Temperature Range
BK series
BKP series
Specified Value
LK series
HK series
－55～＋125℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
3. Rated Current
Specified Value
BK series
BKP series
LK series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is
increased within 20℃
HK series
4. Impedance
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
Measuring frequency
Measuring equipment
Measuring jig
Refer to each specification.
－
: 100±1MHz
: 4291A（or its equivalent）
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
5. Inductance
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
LK Series
Measuring
Measuring
Measuring
HK Series
Measuring
Measuring
－
Refer to each specification.
frequency
equipment /jig
current
: 10～25MHz
: 4291A＋16193A（or its equivalent）
: 1mA rms
frequency
equipment /jig
: 100MHz
: 4291A＋16193A（or its equivalent）
6. Q
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
LK Series
Measuring
Measuring
Measuring
HK Series
Measuring
Measuring
－
Refer to each specification.
frequency
equipment /jig
current
: Refer to each specification.
: 4291A＋16193A（or its equivalent）
: 1mA rms
frequency
: 100MHz
equipment /jig : 4291A＋16193A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKP series
LK series
HK series
Test Methods and
Remarks
Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki）
Refer to each specification.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
8. Self Resonance Frequency（SRF）
BK series
BKP series
Specified Value
LK series
HK series
LK Series
Measuring equipment
Test Methods and
Measuring jig
Remarks
HK Series :
Measuring equipment
9. Temperature Characteristic
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Temperature range
Remarks
Reference temperature
－
Refer to each specification.
: 4195A（or its equivalent）
: 41951＋16092A（or its equivalent）
: 8719C（or its equivalent）
－
Inductance change：Within ±10％
: －30～＋85℃
: ＋20℃
10. Resistance to Flexure of Substrate
BK series
BKP series
Specified Value
No mechanical damage.
LK series
HK series
Warp
: 2mm
Testing board
: glass epoxy-resin substrate
Thickness
: 0.8mm
20
Test Methods and
Remarks
R-230
Board
Warp
Deviation±1
45
45
（Unit：mm）
11. Solderability
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
Solder temperature
Solder temperature
Duration
12. Resistance to Soldering
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Remarks
Solder temperature
Duration
Preheating temperature
Preheating time
Flux
Recovery
At least 90％ of terminal electrode is covered by new solder.
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
Appearance：No significant abnormality
Impedance change：Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±15％
Appearance：No significant abnormality
Inductance change： Within ±5％
：260±5℃
：10±0.5 sec.
：150 to 180℃
：3 min.
：Immersion into methanol solution with colophony for 3 to 5 sec.
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
13. Thermal Shock
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
BK、BKP、HK Series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-40℃ ＋0/－3
30±3
2
Room temperature
2～3
3
+125℃ ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
LK Series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-40℃ ＋0/－3
30±3
2
Room temperature
2～3
3
+85℃ ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
14. Damp Heat（ Steady state）
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Remarks
Temperature
Humidity
Duration
Recovery
15. Loading under Damp Heat
BK series
BKP series
Specified Value
LK series
HK series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
：85±2℃
：80 to 85％RH
：1000＋24/－0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
Temperature
：85±2℃
Humidity
：80 to 85％RH
Test Methods and
Applied current
：Rated current
Remarks
Duration
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
16. Loading at High Temperature
BK series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Specified Value
LK series
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
HK series
Inductance change： Within ±10％ Q change： Within ±20％
Temperature : Maximum operating Temperature
Test Methods and
Applied current ：Rated current
Remarks
Duration
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
Solder-resist
Chip inductor
Chip inductor
W
C
B
Technical
considerations
A
B
L
Recommended land dimensions for wave-soldering （Unit：mm）
Type
1608
2125
L
1.6
2.0
Size
W
0.8
1.25
A
0.8～1.0
1.0～1.4
B
0.5～0.8
0.8～1.5
C
0.6～0.8
0.9～1.2
Recommended land dimensions for reflow-soldering （Unit：mm）
Type
1005
1608
2125
L
1.0
2.0
1.6
Size
W
0.5
1.25
0.8
A
0.45～0.55
0.8～1.0
0.8～1.2
B
0.40～0.50
0.6～0.8
0.8～1.2
C
0.45～0.55
0.6～0.8
0.9～1.6
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing
land-patterns.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
（2） Examples of good and bad solder application
Item
Not recommended
Recommended
Lead wire of component
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Single-sided mounting
Improper method
Proper method
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
Amount of adhesives
After inductors are bonded
［Recommended conditions］
a
a
Figure
0805 case sizes as examples
a
0.3mm min
b
b
100～120μm
c
Area with no adhesive
c
c
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230℃
Within 10sec.
60sec. 60sec
Min.
200 Min.
Temperature（℃）
Temperature（℃）
Preheating
Slow cooling
100
0
200
Slow
cooling
100
0
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
1/2T～1/3T
Inductor
Solder
Technical
considerations
T
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
Preheating
120sec. Min.
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
200
Slow cooling
100
Temperature（℃）
Temperature（℃）
300
0
200
120sec. Min.
Preheating
150℃
100
Slow
cooling
0
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
400
400
Peak
350℃ Max.
Within 3sec.
230～280℃
Within 3sec.
300
200
Slow cooling
100
0
Preheating
60sec. Min.
Temperature（℃）
Temperature（℃）
300
⊿T
Slow cooling
200
100
0
Preheating
150℃ Min.
60sec. Min.
（※⊿ＴT190℃）
※It is recommended to use 20W soldering iron and the tip is 1φor less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
Technical
considerations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20W/ℓ
Ultrasonic frequency
Below 40kHz
Ultrasonic washing period
5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended. When inductors are coated/molded with resin, please check
effects on the inductors by analyzing them in actual applications prior to use.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature: Below 30℃
Humidity: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
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