Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October 2019. All of the
contents specified herein and production status of the products listed
in this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the
latest information carefully before practical application or use of our
products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO Y UD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
20
for General Electronic Equipment
for General Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES(BK SERIES P TYPE)
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES（BK SERIES P TYPE）
WAVE＊
WAVE*
REFLOW
REFLOW
＊Except for BKP0603, BKP1005
*Except for BKP0603, BKP1005
■PARTS NUMBER
B
K P
①
①Series name
Code
BKP
* Operating Temp.：-55～+85℃
1
6
0
8
H
②
S
1
8 1
④
③
－ T △
⑤ ⑥ ⑦
④Nominal impedance
Code
（example）
330
101
391
Series name
Multilayer chip bead inductor for power line
②Dimensions（L×W）
Type（inch）
0603
1005
1608
2125
0603（0201）
1005（0402）
1608（0603）
2125（0805）
⑤Characteristics
Code
－
Characteristics
Standard
⑥Packaging
Code
T
Material
Packaging
Taping
⑦Internal code
Code
△
Refer to impedance curves
for material differences
33
100
390
FERRITE BEAD INDUCTORS
③Material
Code
HS
HM
TS
TM
EM
Dimensions
（L×W）［mm］
0.6×0.3
1.0×0.5
1.6×0.8
2.0×1.25
Nominal impedance［Ω］
NOISE SUPPRESSION
COMPONENTS
Code
△＝Blank space
Internal code
Standard
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
Type
L
W
T
e
BKP0603
（0201）
BKP1005
（0402）
BKP1608
（0603）
BKP2125
（0805）
0.6±0.03
（0.024±0.001）
1.0±0.05
（0.039±0.002）
1.6±0.15
（0.063±0.006）
2.0＋0.3/－0.1
（0.079＋0.012/－0.004）
0.3±0.03
（0.012±0.001）
0.5±0.05
（0.020±0.002）
0.8±0.15
（0.031±0.006）
1.25±0.2
（0.049±0.008）
0.3±0.03
（0.012±0.001）
0.5±0.05
（0.020±0.002）
0.8±0.15
（0.031±0.006）
0.85±0.2
（0.033±0.008）
0.15±0.05
（0.006±0.002）
0.25±0.1
（0.010±0.004）
0.3±0.2
（0.012±0.008）
0.5±0.3
（0.020±0.012）
Standard quantity［pcs］
Paper tape
Embossed tape
15000
－
10000
－
4000
－
4000
－
Unit：mm（inch）
i_mlci_BKP_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
115
for General Electronic Equipment
■PARTS NUMBER
●BKP0603
Parts number
EHS
BKP0603HS100-T
BKP0603HS220-T
BKP0603HS330-T
BKP0603HS800-T
BKP0603HS121-T
BKP0603HM100-T
BKP0603HM220-T
BKP0603HM330-T
BKP0603HM800-T
BKP0603HM121-T
BKP0603TS220-T
BKP0603TS330-T
BKP0603TM220-T
BKP0603TM330-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
Nominal impedance
［Ω］
10
22
33
80
120
10
22
33
80
120
22
33
22
33
Impedance tolerance
±5Ω
±25％
±25％
±25％
±25％
±5Ω
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
100
100
100
100
100
100
DC Resistance
［mΩ］（max.）
30
65
70
120
150
30
70
70
120
180
40
55
40
55
Rated current
［A］（max.）
1.3
1.0
1.0
1.0
0.85
1.3
1.0
1.0
1.0
0.80
1.8
1.5
1.8
1.5
Thickness
［mm］
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
DC Resistance
［mΩ］（max.）
30
35
60
85
150
220
30
50
75
140
200
120
180
39±30％
55±30％
70±30％
100
Rated current
［A］（max.）
2.4
2.2
1.7
1.55
1.00
0.80
2.0
1.7
1.5
1.0
0.80
1.1
0.90
1.7
1.5
1.3
1.3
Thickness
［mm］
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
DC Resistance
［mΩ］（max.）
25
40
50
35
75
110
140
180
Rated current
［A］（max.）
3.0
2.5
1.7
2.7
1.5
1.2
1.0
1.0
Thickness
［mm］
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
Measuring frequency
［MHz］
100
100
100
100
100
DC Resistance
［mΩ］（max.）
20
25
40
50
75
Rated current
［A］（max.）
4.0
3.0
2.5
2.0
1.5
Thickness
［mm］
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
●BKP1005
NOISE SUPPRESSION
COMPONENTS
FERRITE BEAD INDUCTORS
Parts number
EHS
BKP1005EM100-T
BKP1005EM300-T
BKP1005EM600-T
BKP1005EM121-T
BKP1005EM221-T
BKP1005EM331-T
BKP1005HS100-T
BKP1005HS330-T
BKP1005HS680-T
BKP1005HS121-T
BKP1005HS221-T
BKP1005HM121-T
BKP1005HM221-T
BKP1005TS330-T
BKP1005TS680-T
BKP1005TS121-T
BKP1005TM121-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
Nominal impedance
［Ω］
10
30
60
120
220
330
10
33
68
120
220
120
220
33
68
120
120
Impedance tolerance
±5Ω
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
●BKP1608
Parts number
EHS
BKP1608HS330-T
BKP1608HS600-T
BKP1608HS101-T
BKP1608HS121-T
BKP1608HS181-T
BKP1608HS271-T
BKP1608HS391-T
BKP1608HS471-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
Nominal impedance
［Ω］
33
60
100
120
180
270
390
470
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
●BKP2125
Parts number
EHS
BKP2125HS330-T
BKP2125HS600-T
BKP2125HS101-T
BKP2125HS221-T
BKP2125HS331-T
RoHS
RoHS
RoHS
RoHS
RoHS
Nominal impedance
［Ω］
33
60
100
220
330
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
i_mlci_BKP_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
116
20
for General Electronic Equipment
■ ELECTRICAL CHARACTERISTICS
■ BKP0603
BKP0603 HS220
BKP0603 HS100
20
15
BKP0603 HS330
100
100
80
80
60
60
40
40
20
20
BKP0603 HS800
150
100
10
50
5
0
0
1
10
100
1000
10000
0
1
10
BKP0603 HS121
100
1000
10000
1
10
BKP0603 HM100
200
100
1000
10000
0
1
10
BKP0603 HM220
30
100
1000
10000
1000
10000
1000
10000
BKP0603 HM330
60
70
25
50
60
20
40
15
30
10
20
5
10
150
50
30
20
50
0
0
1
10
100
1000
10000
10
0
0
1
10
1000
10000
1
10
BKP0603 HM121
200
1000
45
40
25
35
20
30
100
25
15
100
20
10
50
1
10
100
1000
10
0
1
10000
15
5
0
10
100
1000
1
10000
100
50
30
150
0
10
BKP0603 TS330
35
200
50
1
10000
BKP0603 TS220
250
150
100
10
100
1000
10000
5
0
1
10
100
■ BKP1005
BKP0603 TM220
45
BKP0603 TM330
BKP1005 EM300
BKP1005 EM100
70
40
100
20
60
35
25
40
20
30
80
15
50
30
FERRITE BEAD INDUCTORS
BKP0603 HM800
100
NOISE SUPPRESSION
COMPONENTS
40
100
60
10
15
40
20
10
5
20
10
5
0
0
1
10
100
1000
10
BKP1005 EM600
100
1000
10000
BKP1005 EM121
150
0
0
1
10000
1
10
1000
1
10000
10
BKP1005 EM221
400
250
100
100
1000
10000
BKP1005 EM331
250
350
200
100
200
300
250
150
150
200
100
100
150
50
100
50
50
50
0
0
0
1
10
100
1000
10000
1
10
BKP1005 HS100
100
1000
0
1
10000
10
BKP1005 HS330
100
1000
10000
1
100
250
250
80
80
200
200
60
60
150
150
40
40
100
100
20
20
50
50
0
0
0
10
100
1000
10000
1
10
100
1000
10000
100
1000
10000
1000
10000
BKP1005 HS121
BKP1005 HS680
100
1
10
0
1
10
100
1000
10000
1
10
100
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
117
for General Electronic Equipment
■ ELECTRICAL CHARACTERISTICS
BKP1005 HS221
BKP1005 HM121
BKP1005 HM221
BKP1005 TS330
500
250
500
100
400
200
400
80
300
150
300
60
200
100
200
40
100
50
100
20
0
0
0
1
10
100
1000
10000
1
10
100
1000
0
1
10000
10
100
1000
10000
1
10
100
1000
10000
1000
10000
1000
10000
■ BKP1608
BKP1005 TS680
BKP1608 HS330
BKP1005 TM121
BKP1005 TS121
NOISE SUPPRESSION
COMPONENTS
250
250
500
100
200
200
400
80
150
150
300
60
100
100
200
40
50
50
100
20
0
0
0
1
10
100
1000
10000
1
10
FERRITE BEAD INDUCTORS
BKP1608 HS600
100
1000
0
1
10000
10
BKP1608 HS101
100
1000
1
10000
BKP1608 HS121
250
250
500
80
200
200
400
60
150
150
300
40
100
100
200
20
50
50
100
0
0
0
10
100
1000
10000
1
10
100
1000
1
10000
10
100
BKP1608 HS181
100
1
10
100
1000
10000
0
1
10
100
■ BKP2125
BKP1608 HS271
BKP1608 HS391
BKP2125 HS330
BKP1608 HS471
500
500
100
700
600
400
500
300
400
50
250
300
200
200
100
100
0
0
1
10
100
1000
0
0
1
10000
BKP2125 HS600
10
100
1000
10000
1
BKP2125 HS101
10
100
1000
1
10000
BKP2125 HS221
500
500
500
50
250
250
250
0
0
1
10
100
1000
1
10
100
1000
100
1000
BKP2125 HS331
100
0
10
0
1
10
100
1000
1
10
100
1000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
118
20
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
CKP2520（1008）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HK2125（0805）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCFK1608（0603）
MCFE1608（0603）
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
Thickness
mm（inch）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.6 （0.024）
0.65（0.026）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
－
2000
4000
－
－
2000
4000
－
－
3000
－
3000
－
3000
－
3000
－
2000
10000
－
4000
－
4000
－
－
2000
15000
－
10000
－
4000
－
－
4000
－
3000
15000
－
15000
－
15000
－
10000
－
15000
－
10000
－
15000
－
10000
－
4000
－
4000
－
－
2000
4000
－
－
4000
15000
－
10000
－
4000
－
4000
－
15000
－
－
10000
－
5000
－
4000
10000
－
4000
－
4000
－
3000
4000
－
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape
CK
CKP
CK
CKS
LK
LK
LK
HK
HK
HK
HKQ
AQ
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
BK
BK
BK
BK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
MC
MC
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1608
2012
CK
CKS
CKP
CKP
CKP
LK
HK
2125
2125
2012
2016
2520
2125
2125
BK
BK
MCF
MCF
MCF
MC
MC
2125
3216
0806
1210
2010
1608
2012
Chip cavity
Chip Filled
Chip
●Embossed Tape
Top tape
Sprocket hole
Base tape
Chip cavity
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Type
Thickness
mm（inch）
CK1608（0603）
0.8 （0.031）
CK2125（0805）
0.85（0.033）
CKS2125（0805）
0.85（0.033）
CKP1608（0603）
0.8 （0.031）
LK1005（0402）
0.5 （0.020）
LK1608（0603）
0.8 （0.031）
LK2125（0805）
0.85（0.033）
HK0603（0201）
0.3 （0.012）
HK1005（0402）
0.5 （0.020）
HK1608（0603）
0.8 （0.031）
HKQ0603W（0201）
0.3 （0.012）
HKQ0603S（0201）
0.3 （0.012）
HKQ0603U（0201）
0.3 （0.012）
AQ105（0402）
0.5 （0.020）
BK0603（0201）
0.3 （0.012）
BK1005（0402）
0.5 （0.020）
BK1608（0603）
0.8 （0.031）
BK2125（0805）
0.85（0.033）
BK2010（0804）
0.45（0.018）
BKP0603（0201）
0.3 （0.012）
BKP1005（0402）
0.5 （0.020）
BKP1608（0603）
0.8 （0.031）
BKP2125（0805）
0.85（0.033）
BKH0603（0201）
0.3 （0.012）
BKH1005（0402）
0.5 （0.020）
MCF0605（0202）
0.3 （0.012）
MCFK1608（0603）
0.6 （0.024）
MCEE1005（0402）
0.55（0.021）
MCFE1608（0603）
0.65（0.026）
MCHK2012（0805）
0.8 （0.031）
Chip cavity
Ａ
Ｂ
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.75±0.1
1.15±0.1
（0.030±0.004）
（0.045±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.2±0.1
2.17±0.1
（0.047±0.004）
（0.085±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
0.62±0.03
0.77±0.03
（0.024±0.001）
（0.030±0.001）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
0.8±0.05
1.3±0.05
(0.031±0.002)
(0.051±0.002)
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
Ｔ
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
0.45max
（0.018max）
0.45max
（0.018max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.72max
(0.028max)
0.6max
(0.016max)
0.9max
（0.035max）
0.9max
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
●Embossed Tape (8mm wide)
Unit：mm（inch）
A
B
8.0±0.3
(0.315±0.012)
3.5±0.05
(0.138±0.002)
Sprocket hole
F
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
Thickness
mm（inch）
CK2125（0805）
1.25（0.049）
CKS2125（0805）
1.25（0.049）
CKP2012（0805）
0.9 （0.035）
CKP2016（0806）
0.9 （0.035）
Chip cavity
Ａ
Ｂ
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
1.8±0.1
2.2±0.1
（0.071±0.004）
（0.087±0.004）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
1.9±0.1
（0.075±0.004）
0.75±0.05
（0.030±0.002）
1.15±0.05
（0.045±0.002）
1.1±0.1
（0.043±0.004）
1.1±0.1
（0.043±0.004）
1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
3.5±0.1
（0.138±0.004）
0.95±0.05
（0.037±0.002）
1.40±0.05
（0.055±0.002）
2.3±0.1
（0.091±0.004）
1.95±0.1
（±0.004）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
0.7 （0.028）
0.9 （0.035）
CKP2520（1008）
1.1 （0.043）
1.1 （0.043）
LK2125（0805）
1.25（0.049）
0.85（0.033）
HK2125（0805）
1.0 （0.039）
BK2125（0805）
1.25（0.049）
BK3216（1206）
0.8 （0.031）
MCF0806（0302）
0.4 （0.016）
MCF1210（0504）
0.55（0.022）
MCF2010（0804）
0.45（0.018）
MCKK1608（0603）
1.0 （0.039）
MCKK2012（0805）
1.0 （0.039）
Tape Thickness
K
T
2.0
0.3
（0.079）
（0.012）
2.0
0.3
（0.079）
（0.012）
1.3
0.3
（0.051）
（0.012）
1.3
0.25
（0.051）
（0.01）
1.4
（0.055）
1.4
（0.055）
0.3
（0.012）
1.7
（0.067）
1.7
（0.067）
2.0
0.3
（0.079）
（0.012）
1.5
（0.059）
0.3
（0.012）
2.0
（0.079）
2.0
0.3
（0.079）
（0.012）
1.4
0.3
（0.055）
（0.012）
0.55
0.3
（0.022）
（0.012）
0.65
0.3
（0.026）
（0.012）
0.85
0.3
（0.033）
（0.012）
1.4
0.25
（0.055）
（0.01）
1.35
0.25
（0.053）
（0.010）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel Size
t
E
C
R
B
D
A
W
A
φ178±2.0
B
φ50 or more
C
φ13.0±0.2
4mm width tape
8mm width tape
t
1.5max.
2.5max.
W
5±1.0
10±1.5
D
φ21.0±0.8
E
2.0±0.5
R
1.0
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
2. Storage Temperature Range
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
－55～＋125℃
－55～＋85℃
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋125℃（Including self-generated heat）
－55～＋125℃
－55～＋85℃
－40～＋85℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
3. Rated Current
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
Refer to each specification.
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is increased
within 20℃
Idc1: The decreasing-rate of inductance value is within 30 %
Idc2: The temperature of the element is increased within 40℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
4. Impedance
Specified Value
Test Methods and
Remarks
BK series
BKH series
Refer to each specification.
BKP series
MCF series
BK0603Series, BKP0603Series, BKH Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4991A（or its equivalent）
Measuring jig
: 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）
Measuring jig
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
BK1608・2125Series, BKP1608・2125Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig
: 16092A（or its equivalent）, HW:16192A（or its equivalent）
BK2010・3216Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig
: 16192A（or its equivalent）
MCF Series
Measuring frequency
: 100±1MHz
Measuring equipment
: 4291A（or its equivalent）
5. Inductance
Specified Value
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
CK、CKS、LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
CKP、MCOILTM MC Series
Measuring frequency
Measuring equipment
Test Methods and
Remarks
HK0603、HK1005、AQ Series
Measuring frequency
Measuring equipment /jig
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
Measuring frequency
Measuring frequency
Measuring equipment /jig
Refer to each specification.
: Refer to each specification.
: 1608,2125⇒4194A＋16085B＋16092A（or its equivalent）、4195A＋41951＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
: 1MHz
: 4285A（or its equivalent）
: 100MHz
: HK0603・AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4195A＋16092A（or its equivalent）
: HKQ0603S・HKQ0603U⇒ 500MHz
: HKQ0603W⇒ 300/500MHz
: E4991A＋16197A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
6. Q
Specified Value
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
Test Methods and
Remarks
HK0603、HK1005、AQ Series
Measuring frequency
Measuring equipment /jig
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
Measuring frequency
Measuring frequency
Measuring equipment /jig
－
Refer to each specification.
－
: Refer to each specification.
: 1608,2125⇒4194A＋16085B＋16092A（or its equivalent）、4195A＋41951＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
: 100MHz
: HK0603・AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4195A＋16092A（or its equivalent）
: HKQ0603S・HKQ0603U⇒ 500MHz
: HKQ0603W⇒ 300/500MHz
: E4991A＋16197A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Test Methods and
Remarks
Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki）, HIOKI3227 (or its equivalent)
8. Self Resonance Frequency（SRF）
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
LK、CK Series :
Measuring equipment
Test Methods and
Measuring jig
Remarks
HK、HKQ、AQ Series :
Measuring equipment
Refer to each specification.
－
Refer to each specification.
－
Refer to each specification.
－
: 4195A（or its equivalent）
: 41951＋16092A（or its equivalent）
: 8719C（or its equivalent）・8753D（or its equivalent）/HK2125
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
9. Temperature Characteristic
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
Specified Value
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
HK、HKQ、AQ Series：
Temperature range
Test Methods and
Reference temperature
Remarks
MCOILTM MC series：
Temperature range
Reference temperature
10. Resistance to Flexure of Substrate
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Warp
:
:
Testing board
:
Thickness
:
－
Inductance change：Within ±10％
Inductance change：Within ±15％
: －30～＋85℃
: ＋20℃
: －40～＋85℃
: ＋20℃
No mechanical damage.
2mm（BK Series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ Series、MCF1210、MC Series）
1mm（BKH0603、HKQ0603W、MCF Series without 1210 size,）
glass epoxy-resin substrate
0.8mm
20
R-230
Test Methods and
Remarks
Board
Warp
Deviation±1
45
45
（Unit：mm）
11. Solderability
Specified Value
Test Methods and
Remarks
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Solder temperature
Solder temperature
Duration
At least 90％ of terminal electrode is covered by new solder.
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
12. Resistance to Soldering
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
Appearance：No significant abnormality
Impedance change：Within ±30％
Appearance：No significant abnormality
Impedance change：Within ±20％
Appearance：No significant abnormality
Inductance change： R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％
Appearance：No significant abnormality
Inductance change：Within ±20％
Appearance：No significant abnormality
Inductance change：Within ±30％
Appearance：No significant abnormality
Inductance change：1005⇒Within ±15％
1608,2125⇒ 47N～4R7: Within ±10％ 5R6～330: Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±5％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
Solder temperature
：260±5℃
Duration
：10±0.5 sec.
Test Methods and
Preheating temperature
：150 to 180℃
Remarks
Preheating time
：3 min.
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
13. Thermal Shock
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
LK series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change：Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
Minimum operating temperature ＋0/－3
30±3
Test Methods and
2
Room temperature
2～3
Remarks
3
Maximum operating temperature ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
14. Damp Heat（ Steady state）
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005,1608⇒Within ±10％
Q change： Within ±30％
2125⇒Within ±20％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series
Appearance：No significant abnormality
Inductance change： Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP、MCF Series：
Temperature
：40±2℃
Humidity
：90 to 95％RH
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
HK、HKQ、AQ、MCOILTM MC series：
Temperature
：60±2℃
Humidity
：90 to 95％RH
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
15. Loading under Damp Heat
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
－
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
1608⇒0.047～12.0μH： Within ±10％
2125⇒Within ±20％
Q change： Within ±30％
15.0～33.0μH： Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series※
Appearance：No significant abnormality
Inductance change： Within ±10％
BK、BKP、BKH、LK、CK、CKS、CKP Series：
Temperature
：40±2℃
Humidity
：90 to 95％RH
Applied current
：Rated current
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
HK、HKQ、AQ、MCOILTM MC Series：
Temperature
：60±2℃
Humidity
：90 to 95％RH
Applied current
：Rated current ※MC series ; Idc2max
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
16. Loading at High Temperature
BK series
BKH series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
1608⇒0.047～12.0μH： Within ±10％
2125⇒Within ±20％
Q change： Within ±30％
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
Test Methods and
Remarks
15.0～33.0μH： Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
MCOILTM MC series※
Appearance：No significant abnormality
Inductance change： Within ±10％
Temperature
Applied current
Duration
Recovery
: Maximum operating temperature
：Rated current ※MC series ; Idc2max
：500 +24/-0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless
otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E07R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current including inrush current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
Solder-resist
Chip inductor
Chip inductor
W
C
B
Technical
considerations
A
B
L
Recommended land dimensions for wave-soldering
Type
1608
2012
2125
L
1.6
2.0
2.0
Size
W
0.8
1.25
1.25
A
0.8～1.0
1.0～1.4
1.0～1.4
B
0.5～0.8
0.8～1.5
0.8～1.5
C
0.6～0.8
0.9～1.2
0.9～1.2
（Unit：mm）
2016
2520
2.0
2.5
1.6
2.0
1.0～1.4
1.0～1.4
0.8～1.5
0.6～1.0
1.3～1.6
1.6～2.0
3216
3.2
1.6
1.8～2.5
0.8～1.7
1.2～1.6
Recommended land dimensions for reflow-soldering
Type
0603
1005
105
L
0.6
1.0
1.0
Size
W
0.3
0.5
0.6
A
0.20～0.30 0.45～0.55 0.50～0.55
B
0.20～0.30 0.40～0.50 0.30～0.40
C
0.25～0.40 0.45～0.55 0.60～0.70
（Unit：mm）
1608
2012
1.6
2.0
0.8
1.25
0.8～1.0
0.8～1.2
0.6～0.8
0.8～1.2
0.6～0.8
0.9～1.6
2125
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
2016
2.0
1.6
0.8～1.2
0.8～1.2
1.2～2.0
2520
2.5
2.0
1.0～1.4
0.6～1.0
1.8～2.2
3216
3.2
1.6
1.8～2.5
0.6～1.5
1.2～2.0
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E07R01
b
b
a
a
a
a
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
Recommended land dimension for Reflow-soldering
d
c
c
Type
3216
2010
1210
0806
0605
L
3.2
2.0
1.25
0.85
0.65
Size
W
1.6
1.0
1.0
0.65
0.50
a
0.7～0.9 0.5～0.6 0.45～0.55 0.25～0.35 0.27～0.33
b
0.8～1.0
c
0.4～0.5
d
0.8
（Unit：mm）
d
（（2） Examples of good and bad solder application
Item
0.5～0.6
0.2～0.3
0.5
0.7～0.8 0.25～0.35 0.17～0.23
0.25～0.35 0.25～0.35 0.20～0.26
0.55
0.5
0.4
Not recommended
Recommended
Lead wire of component
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E07R01
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
Single-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
Amount of adhesives
After inductors are bonded
［Recommended conditions］
a
a
Figure
0805 case sizes as examples
a
0.3mm min
b
b
100～120μm
c
Area with no adhesive
c
c
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E07R01
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230℃
Within 10sec.
60sec. 60sec
Min.
200 Min.
Temperature（℃）
Temperature（℃）
Preheating
Slow cooling
100
0
200
Slow
cooling
100
0
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
※ MC series; Peak 230 ℃ (eutectic soldering) 、 260 ℃ (Pb-free soldering)max
within 5sec.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
1/2T～1/3T
Inductor
Technical
considerations
Solder
T
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】
【Recommended condition for Pb-free soldering】
300
Preheating
120sec. Min.
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
200
Slow cooling
100
Temperature（℃）
Temperature（℃）
300
0
200
120sec. Min.
Preheating
150℃
100
Slow
cooling
0
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering
【Recommended condition for Pb-free soldering】
400
400
Peak
350℃ Max.
Within 3sec.
230～280℃
Within 3sec.
300
200
Slow cooling
100
0
Preheating
60sec. Min.
Temperature（℃）
Temperature（℃）
300
⊿T
Slow cooling
200
100
0
Preheating
150℃ Min.
60sec. Min.
（※⊿Ｔ≦190℃（ 3216Type max）, ⊿Ｔ≦130℃（ 3225 Type min）
※It is recommended to use 20W soldering iron and the tip is 1φor less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E07R01
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
Technical
considerations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20W/ℓ
Ultrasonic frequency
Below 40kHz
Ultrasonic washing period
5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature: Below 30℃
Humidity: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E07R01
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