for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for General Electronic Equipment
MULTILAYER CERAMIC CAPACITORS
MULTILAYER CERAMIC CAPACITORS
CERAMIC
CAPACITORS
WAVE
REFLOW
■PARTS NUMBER
J M K
① ② ③
3
1 6
④
MULTILAYER CERAMIC CAPACITORS
①Rated voltage
Code
P
A
J
L
E
T
G
U
H
Q
S
X
②Series name
Code
M
V
W
△
⑤
B
J
1
⑥
0 6
⑦
③End termination
Code
K
S
Rated voltage［VDC］
2.5
4
6.3
10
16
25
35
50
100
250
630
2000
A
End termination
Plated
Cu Internal Electrodes (For High Frequency)
④Dimension（L×W）
Dimensions
（L×W）［mm］
021
0.25× 0.125
042
0.4 × 0.2
063
0.6 × 0.3
1.0 × 0.5
105
0.52× 1.0 ※
1.6 × 0.8
107
0.8 × 1.6 ※
2.0 × 1.25
212
1.25× 2.0 ※
316
3.2 × 1.6
325
3.2 × 2.5
432
4.5 × 3.2
Note : ※LW reverse type（□WK） only
Type
Series name
Multilayer ceramic capacitor
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
⑤Dimension tolerance
Code
Type
△
ALL
063
105
107
△＝Blank space
M L － T △
⑧ ⑨ ⑩ ⑪ ⑫
L［mm］
Standard
W［mm］
Standard
0.6±0.05
1.0±0.10
1.6＋0.15/－0.05
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
316
3.2±0.20
1.6±0.20
325
063
105
3.2±0.30
0.6±0.09
1.0＋0.15/－0.05
2.5±0.30
0.3±0.09
0.5＋0.15/－0.05
107
1.6＋0.20/－0
0.8＋0.20/－0
212
2.0＋0.20/－0
1.25＋0.20/－0
316
105
063
105
E
008004
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
T［mm］
Standard
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
0.45±0.05
0.85±0.10
1.25＋0.15/－0.05
0.85±0.10
1.6±0.20
2.5±0.30
0.3±0.09
0.5＋0.15/－0.05
0.45±0.05
0.8＋0.20/－0
0.45±0.05
0.85±0.10
1.25＋0.20/－0
1.6±0.30
0.5＋0.20/－0
0.3 + 0.25/ - 0
0.5＋0.30/－0
△= Blank space
B
C
EIA（inch）
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
0.6 + 0.25/- 0
0.3 + 0.25/- 0
1.0＋0.30/－0
0.5＋0.30/－0
Note: cf. STANDARD EXTERNAL DIMENSIONS
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor）
Applicable
Temperature
Code
Ref. Temp.［℃］
Capacitance change
standard
range［℃］
JIS
B
－25～＋ 85
20
±10％
EIA
X5R
－55～＋ 85
25
±15％
B7
EIA
X7R
－55～＋125
25
±15％
C6
EIA
X6S
－55～＋105
25
±22％
C7
EIA
X7S
－55～＋125
25
±22％
LD(※)
EIA
X5R
－55～＋ 85
25
±15％
BJ
Note : ※.LD Low distortion high value multilayer ceramic capacitor
Capacitance
tolerance
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
Tolerance
code
K
M
K
M
K
M
K
M
K
M
K
M
△= Blank space
c_mlcc_e-E09R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
4
21
for General Electronic Equipment
■Temperature compensating type
Applicable
Code
standard
UJ
C0G
JIS
UJ
EIA
JIS
EIA
U2J
UK
U2K
Capacitance change
－55～＋125
25
0±30ppm/℃
－55～＋125
－55～＋125
－55～＋125
⑥Series code
・Super low distortion multilayer ceramic capacitor
Code
Series code
SD
Standard
・Medium-High Voltage Multilayer Ceramic Capacitor
Code
Series code
SD
Standard
⑦Nominal capacitance
Code
（example）
0R5
010
100
101
102
103
104
105
106
107
Note : R＝Decimal point
⑧Capacitance tolerance
Code
A
B
C
D
F
G
J
K
M
Z
Nominal capacitance
0.5pF
1pF
10pF
100pF
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
Capacitance tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±1pF
±2％
±5％
±10％
±20％
＋80/－20％
20
25
20
25
－750±120ppm/℃
－750±250ppm/℃
⑨Thickness
Code
K
H
E
C
D
P
T
K
V
W
A
D
F
G
L
N
Y
M
⑩Special code
Code
－
⑪Packaging
Code
F
T
P
R
W
⑫Internal code
Code
△
Capacitance
tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±5％
±0.25pF
±0.5pF
±5％
Tolerance
code
A
B
C
D
J
C
D
J
±0.25pF
C
Thickness［mm］
0.125
0.13
0.18
0.2
0.3
0.45（107type or more）
0.5
MULTILAYER CERAMIC CAPACITORS
UK
EIA
Ref. Temp.［℃］
CERAMIC
CAPACITORS
CG
Temperature
range［℃］
0.8
0.85（212type or more）
1.15
1.25
1.6
1.9
2.0 max
2.5
Special code
Standard
Packaging
φ178mm Taping （2mm pitch）
φ178mm Taping （4mm pitch）
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
φ178mm Taping （2mm pitch）105type only
（Thickness code E,H）
φ178mm Taping（1mm pitch）021/042type only
Internal code
Standard
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
c_mlcc_e-E09R01.doc
21
5
for General Electronic Equipment
■STANDARD EXTERNAL DIMENSIONS
W
Type( EIA )
CERAMIC
CAPACITORS
T
e
Dimension [mm]
T
0.125±0.013
0.125±0.013
□MK021（008004）
□VS021（008004）
L
0.25±0.013
0.25±0.013
W
0.125±0.013
0.125±0.013
□MK042（01005）
0.4±0.02
0.2±0.02
0.2±0.02
□VS042（01005）
0.4±0.02
0.2±0.02
0.2±0.02
□MK063（0201）
0.6±0.03
0.3±0.03
0.3±0.03
L
MULTILAYER CERAMIC CAPACITORS
L
□MK105（0402）
1.0±0.05
0.5±0.05
□VK105（0402）
□WK105（0204）※
1.0±0.05
0.52±0.05
0.5±0.05
1.0±0.05
□MK107（0603）
1.6±0.10
0.8±0.10
□WK107（0306）※
0.8±0.10
1.6±0.10
□MK212（0805）
2.0±0.10
1.25±0.10
□WK212（0508）※
1.25±0.15
2.0±0.15
□MK316（1206）
3.2±0.15
1.6±0.15
□MK325（1210）
3.2±0.30
2.5±0.20
□MK432（1812）
4.5±0.40
3.2±0.30
W
T
e
※ LW reverse type
0.13±0.02
0.18±0.02
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
0.85±0.10
0.85±0.10
1.15±0.10
1.6±0.20
0.85±0.10
1.15±0.10
1.9±0.20
1.9＋0.1/－0.2
2.5±0.20
2.0+0/-0.30
2.5±0.20
*1
K
K
C
D
C
P
T
H
E
C
P
V
W
P
K
A
V
K
D
G
D
D
F
L
D
F
N
Y
M
Y
M
e
0.0675±0.0275
0.0675±0.0275
0.1±0.03
0.1±0.03
0.15±0.05
0.25±0.10
0.25±0.10
0.18±0.08
0.35±0.25
0.25±0.15
0.5±0.25
0.3±0.2
0.5＋0.35/－0.25
0.6±0.3
0.6±0.4
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Type
EIA（inch）
Dimension
021
008004
［mm］
0.125
042
01005
0.2
063
0201
105
0402
0.3
0.13
0.18
0.2
0.3
0.5
0204 ※
107
0603
0306 ※
212
0805
0508 ※
316
1206
325
1210
432
1812
0.30
0.45
0.8
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.6
0.85
1.15
1.9
2.0 max
2.5
2.0 max
2.5
Code
K
C
D
P
T
H
E
C
P
V
W
P
K
A
V
K
D
G
D
D
F
L
D
F
N
Y
M
Y
M
Standard quantity［pcs］
Paper tape
Embossed tape
－
50000
－
40000
15000
－
－
－
20000
15000
20000
15000
－
－
10000
－
4000
－
－
4000
4000
－
－
4000
4000
－
－
3000
－
－
3000
2000
－
2000
－
－
－
1000
1000
500
Note : ※.LW Reverse type（□WK）
c_mlcc_e-E09R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
6
21
for General Electronic Equipment
■PARTS NUMBER
LW Reversal Decoupling Capacitors（LWDCTM）
CERAMIC
CAPACITORS
●105TYPE
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.3mm thickness（P）
Part number 1
Part number 2
MULTILAYER CERAMIC CAPACITORS
TWK105 BJ104MP-F
EWK105 BJ224MP-F
LWK105 BJ474MP-F
JWK105 BJ104MP-F
JWK105 BJ474MP-F
JWK105 BJ105MP-F
JWK105 BJ225MP-F
Rated voltage
[V]
25
16
10
6.3
Temperature
characteristics
X5R
X5R
X5R
X5R*1
X5R*1
X5R
X5R
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
0.1
0.22
0.47
0.1
0.47
1
2.2
±20
±20
±20
±20
±20
±20
±20
5
10
10
5
10
10
10
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
Thickness*3 [mm]
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
Soldering
R:Reflow
W:Wave
R
R
R
R
R
R
R
【Temperature Characteristic C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃）】 0.3mm thickness（P）
Part number 1
Part number 2
EWK105 C6104MP-F
LWK105 C7104MP-F
LWK105 C6224MP-F
JWK105 C7104MP-F
JWK105 C7224MP-F
JWK105 C6474MP-F
AWK105 C6224MP-F
AWK105 C6474MP-F
AWK105 C6105MP-F
AWK105 C6225MP-F
Rated voltage
[V]
16
10
6.3
4
Temperature
characteristics
X6S
X7S
X6S
X7S
X7S
X6S
X6S
X6S
X6S
X6S
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
0.1
0.1
0.22
0.1
0.22
0.47
0.22
0.47
1
2.2
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
5
10
5
10
10
10
10
10
10
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
0.1
0.22
0.47
1
2.2
1
2.2
4.7
10
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
5
5
10
10
10
10
10
10
μ
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
150
150
Thickness*3 [mm]
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
Soldering
R:Reflow
W:Wave
R
R
R
R
R
R
R
R
R
R
●107TYPE
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.5mm thickness（V）
Part number 1
Part number 2
TWK107 BJ104MV-T
EWK107 BJ224MV-T
EWK107 BJ474MV-T
LWK107 BJ105MV-T
LWK107 BJ225MV-T
JWK107 BJ105MV-T
JWK107 BJ225MV-T
JWK107 BJ475MV-T
AWK107 BJ106MV-T
Rated voltage
[V]
25
16
10
6.3
4
Temperature
characteristics
X5R*1
X5R*1
X5R*1
X5R
X5R
X5R*1
X5R
X5R
X5R
μ
μ
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
150
150
Thickness*3 [mm]
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
Soldering
R:Reflow
W:Wave
R
R
R
R
R
R
R
R
R
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃）】 0.5mm thickness（V）
Part number 1
Part number 2
TWK107 B7104MV-T
EWK107 B7224MV-T
EWK107 B7474MV-T
JWK107 C7105MV-T
AWK107 C7225MV-T
AWK107 C6475MV-T
PWK107 C6106MV-T
Rated voltage
[V]
25
16
6.3
4
2.5
Temperature
characteristics
X7R
X7R
X7R
X7S
X7S
X6S
X6S
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
0.1
0.22
0.47
1
2.2
4.7
10
±20
±20
±20
±20
±20
±20
±20
5
5
5
10
10
10
10
Capacitance tolerance
[％]
tanδ
[％]
±10, ±20
±20
±10, ±20
±20
±20
10
10
10
10
10
μ
μ
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
150
150
Thickness*3 [mm]
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
Soldering
R:Reflow
W:Wave
R
R
R
R
R
R
R
●212TYPE
【Temperature Characteristic BJ : X5R（－55～＋85℃）】 0.85mm thickness（D）
Part number 1
Part number 2
Rated voltage
[V]
25
16
TWK212 BJ475[]D-T
EWK212 BJ106MD-T
LWK212 BJ475[]D-T
LWK212 BJ106MD-T
JWK212 BJ226MD-T
10
6.3
Temperature
characteristics
X5R
X5R
X5R
X5R
X5R
Capacitance
[F]
4.7
10
4.7
10
22
μ
μ
μ
μ
μ
HTLT
Rated voltage x ％
150
150
150
150
150
Thickness*3 [mm]
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
Soldering
R:Reflow
W:Wave
R
R
R
R
R
【Temperature Characteristic B7 : X7R（－55～＋125℃）, C6 : X6S（－55～＋105℃）】 0.85mm thickness（D）
Part number 1
TWK212 B7225[]D-T
EWK212 C6475[]D-T
LWK212 C6106MD-T
AWK212 C6226MD-T
Part number 2
Rated voltage
[V]
25
16
10
4
Temperature
characteristics
X7R
X6S
X6S
X6S
Capacitance
[F]
2.2
4.7
10
22
μ
μ
μ
μ
Capacitance tolerance
[％]
tanδ
[％]
±10, ±20
±10, ±20
±20
±20
5
10
10
10
HTLT
Rated voltage x ％
150
150
150
150
Thickness*3 [mm]
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
Soldering
R:Reflow
W:Wave
R
R
R
R
c_mlcc_e-E09R01.xlsx
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
32
21
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□MF105(0402)
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
□MK212(0805)
□WK212(0508) ※
□MF212(0805)
□VS212(0805)
□MJ212(0805)
□MK316(1206)
□MF316(1206)
□MJ316(1206)
□MK325(1210)
□MF325(1210)
□MJ325(1210)
□MK432(1812)
Note : ※ LW Reverse type.
mm
code
0.125
K
0.2
0.2
0.3
0.3
0.13
0.18
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.7
0.8
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
1.15
1.6
0.85
1.15
1.9
2.0max.
2.5
1.9
2.5
2.5
C, D
C
P,T
P
H
E
C
P
V
W
K
V
A
C
A
K
D
G
D
D
G
D
F
L
F
L
D
F
N
Y
M
N
M
M
Standard quantity [pcs]
Paper tape
Embossed tape
－
50000
－
40000
15000
10000
－
－
20000
15000
10000
10000
4000
－
4000
4000
3000
－
－
20000
15000
－
－
－
－
－
4000
－
－
3000
4000
－
－
4000
4000
－
4000
－
－
－
－
3000
－
－
2000
－
3000
2000
3000
2000
－
2000
－
－
－
－
1000
2000
500(T), 1000(P)
500
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Sprocket hole
Bottom tape
Chip cavity
Base tape
Chip cavity
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Unit：mm（inch）
A
B
T
8.0±0.3
(0.315±0.012)
Sprocket hole
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
T1
2.0±0.05
(0.079±0.002)
F
4.0±0.1
(0.157±0.004)
Chip Cavity
Type(EIA)
Ａ
0.37
Insertion Pitch
Ｆ
Ｂ
0.67
□MK063(0201)
□WK105(0204) ※
0.65
1.15
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
2.0±0.05
●Punched carrier tape （2mm pitch）
0.45max.
0.42max.
0.4max.
0.45max.
0.3max.
0.42max.
Unit：mm
T
8.0±0.3
(0.315±0.012)
B
2.0±0.05
(0.079±0.002)
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
A
F
T1
Unit：mm（inch）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
Tape Thickness
Ｔ
4.0±0.1
(0.157±0.004)
Ａ
Chip Cavity
Ｂ
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
0.65
1.15
2.0±0.05
0.8max.
Type(EIA)
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
Unit：mm
●Punched carrier tape （4mm pitch）
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Type(EIA)
Ａ
Insertion Pitch
Ｆ
Ｂ
□MK107(0603)
□WK107(0306) ※
1.0
1.8
□MF107(0603)
4.0±0.1
□MK212(0805)
1.65
2.4
□WK212(0508) ※
□MK316(1206)
2.0
3.6
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
●Embossed tape（4mm wide）
Unit：mm
4.0±0.05
(0.157±0.002)
B
1.0±0.02
(0.039±0.001)
1.1max.
0.9±0.05
(0.035±0.002)
1.8±0.02
(0.071±0.001)
A
F
1.1max.
Unit：mm（inch）
φ0.8±0.04
(φ0.031±0.002)
Sprocket hole
Tape Thickness
Ｔ
2.0±0.04
(0.079±0.002)
Chip Cavity
Type(EIA)
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
Ａ
Ｂ
0.135
0.27
0.23
0.43
Insertion Pitch
Ｆ
K
Tape Thickness
T
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Unit：mm（inch）
3.5±0.05
(0.138±0.002)
Sprocket hole
A
B
F
1.75±0.1
(0.069±0.004）
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Type(EIA)
□MK105(0402)
□WK107(0306) ※
□MK212(0805)
□MF212(0805)
□MK316(1206)
□MF316(1206)
□MK325(1210)
□MF325(1210)
Note： ※ LW Reverse type.
Chip Cavity
Ａ
0.6
1.0
Ｂ
1.1
1.8
1.65
2.4
2.0
3.6
2.8
3.6
Insertion Pitch
Ｆ
2.0±0.1
4.0±0.1
Tape Thickness
K
0.6max
1.3max.
T
0.2±0.1
0.25±0.1
3.4max.
0.6max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape（12mm wide）
Unit：mm（inch）
5.5±0.05
(0.217±0.002)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
12.0±0.3
(0.472±0.012)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
2.0±0.1
(0.079±0.004)
F
Chip Cavity
Type(EIA)
Ａ
3.1
3.7
□MK325(1210)
□MK432(1812)
Ｂ
4.0
4.9
Insertion Pitch
Ｆ
8.0±0.1
8.0±0.1
K
4.0max.
4.0max.
Tape Thickness
E
2.0±0.5
T
0.6max.
0.6max.
Unit：mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
⑤Reel size
t
E
C
R
B
A
D
W
A
φ178±2.0
B
φ50min.
C
φ13.0±0.2
D
φ21.0±0.8
4mm wide tape
8mm wide tape
12mm wide tape
T
1.5max.
2.5max.
2.5max.
W
5±1.0
10±1.5
14±1.5
Unit：mm
R
1.0
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
B7
C6
C7
Specification
B
X5R
X7R
X6S
X7S
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
BJ
Specified
Value
High Permittivity （Class2）
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
Specification
Temperature Range
B
－25 to ＋85℃
BJ
X5R
－55 to ＋85℃
B7
X7R
－55 to ＋125℃
C6
X6S
－55 to ＋105℃
C7
X7S
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
Specified
Value
High Permittivity （Class2）
3. Rated Voltage
Specified
Value
Temperature
Compensating（Class1）
Standard
50VDC, 25VDC, 16VDC
High Frequency Type
50VDC, 25VDC, 16VDC
High Permittivity （Class2）
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
4. Withstanding Voltage （Between terminals）
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No breakdown or damage
High Permittivity （Class2）
Test
Methods and
Remarks
Class 1
Rated voltage×3
Applied voltage
Duration
Charge/discharge current
Class 2
Rated voltage×2.5
1 to 5 sec.
50mA max.
5. Insulation Resistance
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
Test
Methods and
Remarks
Applied voltage
Duration
Charge/discharge current
10000 MΩ min.
C≦0.047
F : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
: Rated voltage
: 60±5 sec.
: 50mA max.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E09R01
6. Capacitance （Tolerance）
Specified
Value
Standard
C□
U□
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
: ±0.5pF
: ±5% or ±10%
High Frequency Type
CG
0.2pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
Temperature
Compensating（Class1）
High Permittivity （Class2）
Test
Methods and
Remarks
±10% or ±20%
Standard
Preconditioning
Measuring frequency
Measuring voltage Nte
Bias application
Class 1
High Frequency Type
None
1ＭHz±10%
0.5 to 5Vrms
Class 2
C≦10μF
C＞10μF
Thermal treatment （at 150℃ for 1hr） Note 2
1kHz±10%
120±10Hz
1±0.2Vrms
0.5±0.1Vrms
None
7. Q or Dissipation Factor
Specified
Value
Temperature
Compensating（Class1）
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
（C：Nominal capacitance）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
Refer to detailed specification
BJ, B7, C6, C7：2.5% max.
Class 1
High Frequency Type
None
1ＭHz±10%
1GHz
0.5 to 5Vrms
Standard
Test
Methods and
Remarks
Preconditioning
Measuring frequency
Measuring voltage Note 1
Bias application
High Frequency Type
Measuring equipment
Measuring jig
Class 2
C≦10μF
C＞10μF
Thermal treatment （at 150℃ for 1hr） Note 2
1ｋHz±10%
120±10Hz
1±0.2Vrms
0.5±0.1Vrms
None
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
C□ : 0
CG
Standard
Temperature
Compensating（Class1）
U□ : －750
High Frequency Type
UJ, UK
Temperature Characteristic ［ppm/℃］
C□ : 0
CG
Specified
Value
Tolerance ［ppm/℃］
G : ±30
J：±120
K：±250
Tolerance ［ppm/℃］
G : ±30
Capacitance
Reference
Temperature Range
change
temperature
±10%
20℃
－25 to ＋85℃
±15%
25℃
－55 to ＋85℃
±15%
25℃
－55 to ＋125℃
±22%
25℃
－55 to ＋105℃
±22%
25℃
－55 to ＋125℃
±15%
25℃
－55 to ＋85℃
distortion high value multilayer ceramic capacitor
Specification
B
X5R
B7
X7R
C6
XS
C7
X7S
LD(※)
X5R
Note : ※LD Low
BJ
High Permittivity （Class2）
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
（C85－C20）
×106（ppm/℃）
△T＝65
C20×△T
Test
Methods and
Remarks
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step
B
X5R、X7R、X6S、X7S
1
Minimum operating temperature
2
20℃
25℃
3
Maximum operating temperature
（C－C2）
C2
×100（%）
C ：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E09R01
9. Deflection
Specified
Value
Temperature
Compensating（Class1）
Standard
Appearance
Capacitance change
: No abnormality
: Within ±5% or ±0.5 pF, whichever is larger.
High Frequency Type
Appearance
Capacitance change
: No abnormality
: Within±0.5 pF
Appearance
Capacitance change
: No abnormality
: Within ±12.5%
High Permittivity （Class2）
Board
Thickness
Warp
Duration
Test
Methods and
Remarks
Multilayer Ceramic Capacitors
021, 042, 063, ※105 Type
The other types
Glass epoxy-resin substrate
0.8mm
1.6mm
1mm
10 sec.
※
105 Type thickness, C： 0.2mm ,P： 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Specified
Value
Standard
Temperature
Compensating（Class1）
High Frequency Type
High Permittivity （Class2）
Test
Methods and
Remarks
－
No mechanical damage.
－
High Frequency 105Type
Applied force
: 5N
Duraton
: 10 sec.
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Standard
Temperature
Compensating（Class1）
High Frequency Type
No terminal separation or its indication.
High Permittivity （Class2）
Test
Methods and
Remarks
Applied force
Duration
Multilayer Ceramic Capacitors
021, 042, 063 Type
105 Type or more
2N
5N
30±5 sec.
12. Solderability
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
At least 95% of terminal electrode is covered by new solder.
High Permittivity （Class2）
Test
Methods and
Remarks
Solder type
Solder temperature
Duration
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E09R01
13. Resistance to Soldering
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5%
: Initial value
: Initial value
（between terminals） : No abnormality
Appearance
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±7.5%
: Initial value
: Initial value
（between terminals）: No abnormality
Temperature
Compensating（Class1）
Specified
Value
High Permittivity （Class2）
Note 1
Class 1
021, 042, 063 Type
105 Type
Preconditioning
Preheating
Test
Methods and
Remarks
None
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
150℃, 1 to 2 min.
Solder temp.
Duration
Recovery
270±5℃
3±0.5 sec.
6 to 24 hrs （Standard condition） Note 5
021, 042、063 Type
Preconditioning
Preheating
150℃, 1 to 2 min.
Solder temp.
Duration
Recovery
Class 2
105, 107, 212 Type
316, 325, 432 Type
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 2 to 5 min.
150 to 200℃, 5 to 10 min.
270±5℃
3±0.5 sec.
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±0.25pF
: Initial value
: Initial value
（between terminals） : No abnormality
Appearance
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±7.5%
: Initial value
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Specified
Value
High Permittivity （Class2）
Note 1
Class 1
Preconditioning
Test
Methods and
Remarks
1 cycle
Number of cycles
Recovery
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
None
Step
1
2
3
4
Temperature（℃）
Minimum operating temperature
Normal temperature
Maximum operating temperature
Normal temperature
Time（min.）
30±3
2 to 3
30±3
2 to 3
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E09R01
15. Humidity （Steady State）
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
High Permittivity （Class2）
Note 1
Insulation resistance
: No abnormality
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Appearance
Capacitance change
Dissipation factor
Insulation resistance
:
:
:
:
Class 1
Standard
Test
Methods and
Remarks
Preconditioning
Temperature
Humidity
Duration
Recovery
No abnormality
Within ±12.5%
5.0% max.
50 MΩμF or 1000 MΩ whichever is smaller.
Class 2
All items
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
90 to 95%RH
500＋24/－0 hrs
24±2 hrs （Standard condition） Note 5
High Frequency Type
None
40±2℃
60±2℃
90 to 95%RH
500＋24/－0 hrs
6 to 24 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
Capacitance change
Q
Standard
Insulation resistance
Temperature
Compensating（Class1）
Specified
Value
Appearance
Capacitance change
Note 1
Appearance
Capacitance change
Dissipation factor
Insulation resistance
:
:
:
:
90 to 95%RH
500＋24/－0 hrs
Rated voltage
50mA max.
50mA max.
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
Preconditioning
Temperature
Humidity
Duration
Applied voltage
Charge/discharge
current
Recovery
Class 1
High Frequency Type
No abnormality
Within ±12.5%
5.0% max.
25 MΩμF or 500 MΩ, whichever is smaller.
Class 2
All items
Voltage treatment
（Rated voltage are applied for 1 hour at 40℃） Note 3
40±2℃
90 to 95%RH
500＋24/－0 hrs
Rated voltage
Standard
Test
Methods and
Remarks
Insulation resistance
: No abnormality
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
: 500 MΩ min.
High Frequency Type
High Permittivity （Class2）
: No abnormality
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩ min.
None
40±2℃
60±2℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E09R01
17. High Temperature Loading
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
High Permittivity （Class2）
Note 1
Test
Methods and
Remarks
Temperature
Duration
Applied voltage
Charge/discharge
current
Recovery
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
Capacitance change
Dissipation factor
Insulation resistance
:
:
:
:
Class 1
High Frequency Type
No abnormality
Within ±12.5%
5.0% max.
50 MΩμF or 1000 MΩ, whichever is smaller.
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2 Note 4
Class 2
BJ, LD(※)
C6
B7, C7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2 Note 4
50mA max.
50mA max.
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Standard
Preconditioning
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
None
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
Land patterns for PCBs
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
212
316
325
L
1.6
2.0
3.2
3.2
C
Size
W
0.8
1.25
1.6
2.5
A
0.8 to 1.0
1.0 to 1.4
1.8 to 2.5
1.8 to 2.5
B
0.5 to 0.8
0.8 to 1.5
0.8 to 1.7
0.8 to 1.7
B
A
B
C
0.6 to 0.8
0.9 to 1.2
1.2 to 1.6
1.8 to 2.5
Chip capacitor
W
Technical
considerations
L
Reflow-soldering
Type
021
L
0.25
Size
W
0.125
A
0.095～0.135
B
0.085～0.125
C
0.110～0.150
Note：Recommended land
042
0.4
0.2
0.15～0.25
0.10～0.20
0.15～0.30
size might be
063
105
107
212
316
0.6
1.0
1.6
2.0
3.2
0.3
0.5
0.8
1.25
1.6
0.20～0.30 0.45～0.55
0.6～0.8
0.8～1.2
1.8～2.5
0.20～0.30 0.40～0.50
0.6～0.8
0.8～1.2
1.0～1.5
0.25～0.40 0.45～0.55
0.6～0.8
0.9～1.6
1.2～2.0
different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions
（unit: mm）
Type
105
107
L
0.52
0.8
Size
W
1.0
1.6
A
0.18～0.22
0.25～0.3
B
0.2～0.25
0.3～0.4
C
0.9～1.1
1.5～1.7
for reflow-soldering
212
1.25
2.0
0.5～0.7
0.4～0.5
1.9～2.1
325
3.2
2.5
1.8～2.5
1.0～1.5
1.8～3.2
432
4.5
3.2
2.5～3.5
1.5～1.8
2.3～3.5
LWDC
W
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
（2）Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
Items
Not recommended
Recommended
possible mechanical
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method
Single-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
After capacitor are bonded
Amount adhesive
［Recommended condition］
a
a
Figure
212/316 case sizes as examples
a
0.3mm min
b
b
100 to 120μm
c
Adhesives shall not contact land
c
c
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
300
300
200
Peak
260℃ Max.
Within 10sec.
230℃
Within 10sec.
60sec. 60sec
Min.
Min.
Slow cooling
100
Temperature（℃）
Temperature（℃）
Preheating
0
200
Slow
cooling
100
0
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
1/2T～1/3T
Capacitor
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible. soldering for 2 times.
［Wave soldering］
【Recommended conditions for eutectic
soldering】
300
100
Temperature（℃）
Temperature（℃）
Slow cooling
PC board
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
200
T
【Recommended condition for Pb-free
soldering】
300
Preheating
120sec. Min.
Solder
200
120sec. Min.
Preheating
150℃
100
Slow
cooling
0
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.
【Recommended condition for Pb-free
soldering】
400
400
300
200
Slow cooling
100
0
Preheating
60sec. Min.
Temperature（℃）
Temperature（℃）
300
⊿T
Slow cooling
200
Preheating
150℃ Min.
100
0
400
Peak
350℃ Max.
Within 3sec.
230～280℃
Within 3sec.
316type or less
200
0
Slow cooling
⊿T
Preheating
150℃ Min.
100
60sec. Min.
⊿T
⊿T≦150℃
Peak
280℃ Max.
Within 3sec.
300
温度（℃）
［Hand soldering］
【Recommended conditions for eutectic
soldering】
60sec. Min.
325type or more
⊿T
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors. soldering for 1 times.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of
capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully
checked;
Ultrasonic output :
20 W/ℓ or les
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to
design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for
1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E08R01
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