0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
EMK107BJ474MA-T

EMK107BJ474MA-T

  • 厂商:

    TAIYO-YUDEN(太诱)

  • 封装:

    0603

  • 描述:

    贴片电容(MLCC) 0603 470nF ±20% 16V X5R

  • 详情介绍
  • 数据手册
  • 价格&库存
EMK107BJ474MA-T 数据手册
Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product Information in this Catalog Product information in this catalog is as of October 2019. All of the contents specified herein and production status of the products listed in this catalog are subject to change without notice due to technical improvement of our products, etc. Therefore, please check for the latest information carefully before practical application or use of our products. (4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r, hydroelectric power, thermal power plant control system, etc.) (5) Undersea equipment (submarine repeating equipment, underwater work equipment, etc.) (6) Military equipment (7) Any other equipment requiring extremely high levels of safety and/or reliability equal to the equipment listed above Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. *Notes: 1. There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. 2. Implantable medical devices contain not only internal unit which is implanted in a body, but also external unit which is connected to the internal unit. ■ Approval of Product Specifications Ple a se c ont ac t TA IYO Y UD EN for fur the r det a ils of p ro duc t specifications as the individual product specification sheets are available. When using our products, please be sure to approve our product specifications or make a written agreement on the product specification with TAIYO YUDEN in advance. ■ Pre-Evaluation in the Actual Equipment and Conditions Please conduct validation and verification of our products in actual conditions of mounting and operating environment before using our products. ■ Limited Application 1. Equipment Intended for Use The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and other equipment specified in this catalog or the individual product specification sheets. TAIYO YUDEN has the line-up of the products intended for use in automotive electronic equipment, telecommunications infrastructure and industrial equipment, or medical devices classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, please check available applications specified in this catalog or the individual product specification sheets and use the corresponding products. 2. Equipment Requiring Inquiry Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following equipment (excluding intended equipment as specified in this catalog or the individual product specification sheets) which may cause loss of human life, bodily injury, serious property damage and/or serious public impact due to a failure or defect of the products and/or malfunction attributed thereto. (1) Transportation equipment (automotive powertrain control system, train control system, and ship control system, etc.) (2) Traffic signal equipment (3) Disaster prevention equipment, crime prevention equipment (4) Medical devices classified as GHTF Class C (Japan Class III) (5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base station, etc.) (6) Any other equipment requiring high levels of quality and/or reliability equal to the equipment listed above 3. Equipment Prohibited for Use Please do not incorporate our products into the following equipment requiring extremely high levels of safety and/or reliability. (1) Aerospace equipment (artificial satellite, rocket, etc.) (2) Aviation equipment *1 (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 4. Limitation of Liability Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not intended for use by TAIYO YUDEN, or any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Safety Design When using our products for high safety and/or reliability-required equipment or circuits, please fully perform safety and/or reliability evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault for a failsafe design to ensure safety. ■ Intellectual Property Rights Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Limited Warranty Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a failure or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ TAIYO YUDEN’s Official Sales Channel The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter “TAIYO YUDEN’ s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’ s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law” of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 20 for General Electronic Equipment for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS WAVE WAVE REFLOW REFLOW ■PARTS NUMBER J M K ① ② ③ 3 1 6 ④ MULTILAYER CERAMIC CAPACITORS ①Rated voltage Code P A J L E T G U H Q S X ②Series name Code M V W △ ⑤ B J 1 ⑥ 0 6 ⑦ ③End termination Code K S Rated voltage[VDC] 2.5 4 6.3 10 16 25 35 50 100 250 630 2000 A End termination Plated Cu Internal Electrodes (For High Frequency) ④Dimension(L×W) Dimensions (L×W)[mm] 021 0.25× 0.125 042 0.4 × 0.2 063 0.6 × 0.3 1.0 × 0.5 105 0.52× 1.0 ※ 1.6 × 0.8 107 0.8 × 1.6 ※ 2.0 × 1.25 212 1.25× 2.0 ※ 316 3.2 × 1.6 325 3.2 × 2.5 432 4.5 × 3.2 Note : ※LW reverse type(□WK) only Type Series name Multilayer ceramic capacitor Multilayer ceramic capacitor for high frequency LW reverse type multilayer capacitor ⑤Dimension tolerance Code Type △ ALL 063 105 107 △=Blank space M L - T △ ⑧ ⑨ ⑩ ⑪ ⑫ L[mm] Standard W[mm] Standard 0.6±0.05 1.0±0.10 1.6+0.15/-0.05 0.3±0.05 0.5±0.10 0.8+0.15/-0.05 212 2.0+0.15/-0.05 1.25+0.15/-0.05 316 3.2±0.20 1.6±0.20 325 063 105 3.2±0.30 0.6±0.09 1.0+0.15/-0.05 2.5±0.30 0.3±0.09 0.5+0.15/-0.05 107 1.6+0.20/-0 0.8+0.20/-0 212 2.0+0.20/-0 1.25+0.20/-0 316 105 063 105 E 008004 01005 0201 0402 0204 0603 0306 0805 0508 1206 1210 1812 T[mm] Standard 0.3±0.05 0.5±0.10 0.8+0.15/-0.05 0.45±0.05 0.85±0.10 1.25+0.15/-0.05 0.85±0.10 1.6±0.20 2.5±0.30 0.3±0.09 0.5+0.15/-0.05 0.45±0.05 0.8+0.20/-0 0.45±0.05 0.85±0.10 1.25+0.20/-0 1.6±0.30 0.5+0.20/-0 0.3 + 0.25/ - 0 0.5+0.30/-0 △= Blank space B C EIA(inch) 3.2±0.30 1.6±0.30 1.0+0.20/-0 0.5+0.20/-0 0.6 + 0.25/- 0 0.3 + 0.25/- 0 1.0+0.30/-0 0.5+0.30/-0 Note: cf. STANDARD EXTERNAL DIMENSIONS ⑥Temperature characteristics code ■High dielectric type(Excluding Super low distortion multilayer ceramic capacitor) Applicable Temperature Code Ref. Temp.[℃] Capacitance change standard range[℃] JIS B -25~+ 85 20 ±10% EIA X5R -55~+ 85 25 ±15% B7 EIA X7R -55~+125 25 ±15% C6 EIA X6S -55~+105 25 ±22% C7 EIA X7S -55~+125 25 ±22% LD(※) EIA X5R -55~+ 85 25 ±15% BJ Note : ※.LD Low distortion high value multilayer ceramic capacitor Capacitance tolerance ±10% ±20% ±10% ±20% ±10% ±20% ±10% ±20% ±10% ±20% ±10% ±20% Tolerance code K M K M K M K M K M K M △= Blank space c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 12 20 for General Electronic Equipment CG UK C0G JIS UJ EIA JIS EIA U2J UK U2K Ref. Temp.[℃] Capacitance change -55~+125 25 0±30ppm/℃ -55~+125 -55~+125 -55~+125 ⑥Series code ・Super low distortion multilayer ceramic capacitor Code Series code SD Standard ・Medium-High Voltage Multilayer Ceramic Capacitor Code Series code SD Standard ⑦Nominal capacitance Code (example) 0R5 010 100 101 102 103 104 105 106 107 Note : R=Decimal point ⑧Capacitance tolerance Code A B C D F G J K M Z Nominal capacitance 0.5pF 1pF 10pF 100pF 1,000pF 10,000pF 0.1μF 1.0μF 10μF 100μF Capacitance tolerance ±0.05pF ±0.1pF ±0.25pF ±0.5pF ±1pF ±2% ±5% ±10% ±20% +80/-20% 20 25 20 25 -750±120ppm/℃ -750±250ppm/℃ ⑨Thickness Code K H E C D P T K V W A D F G L N Y M ⑩Special code Code - ⑪Packaging Code F T P R W ⑫Internal code Code △ Capacitance tolerance ±0.05pF ±0.1pF ±0.25pF ±0.5pF ±5% ±0.25pF ±0.5pF ±5% Tolerance code A B C D J C D J ±0.25pF C Thickness[mm] 0.125 0.13 0.18 0.2 0.3 0.45(107type or more) 0.5 0.8 0.85(212type or more) 1.15 1.25 1.6 1.9 2.0 max 2.5 MULTILAYER CERAMIC CAPACITORS UJ EIA Temperature range[℃] CERAMIC CAPACITORS ■Temperature compensating type Applicable Code standard Special code Standard Packaging φ178mm Taping (2mm pitch) φ178mm Taping (4mm pitch) φ178mm Taping (4mm pitch, 1000 pcs/reel) 325 type(Thickness code M) φ178mm Taping (2mm pitch)105type only (Thickness code E,H) φ178mm Taping(1mm pitch)021/042type only Internal code Standard ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 c_mlcc_e-E08R01 13 for General Electronic Equipment ■STANDARD EXTERNAL DIMENSIONS W Type( EIA ) CERAMIC CAPACITORS T e Dimension [mm] T 0.125±0.013 0.125±0.013 □MK021(008004) □VS021(008004) L 0.25±0.013 0.25±0.013 W 0.125±0.013 0.125±0.013 □MK042(01005) 0.4±0.02 0.2±0.02 0.2±0.02 L □VS042(01005) 0.4±0.02 0.2±0.02 0.2±0.02 □MK063(0201) 0.6±0.03 0.3±0.03 0.3±0.03 MULTILAYER CERAMIC CAPACITORS L □MK105(0402) 1.0±0.05 0.5±0.05 □VK105(0402) □WK105(0204)※ 1.0±0.05 0.52±0.05 0.5±0.05 1.0±0.05 □MK107(0603) 1.6±0.10 0.8±0.10 □WK107(0306)※ 0.8±0.10 1.6±0.10 □MK212(0805) 2.0±0.10 1.25±0.10 □WK212(0508)※ 1.25±0.15 2.0±0.15 □MK316(1206) 3.2±0.15 1.6±0.15 □MK325(1210) 3.2±0.30 2.5±0.20 □MK432(1812) 4.5±0.40 3.2±0.30 W T e ※ LW reverse type 0.13±0.02 0.18±0.02 0.2±0.02 0.3±0.03 0.5±0.05 0.5±0.05 0.3±0.05 0.45±0.05 0.8±0.10 0.5±0.05 0.45±0.05 0.85±0.10 1.25±0.10 0.85±0.10 0.85±0.10 1.15±0.10 1.6±0.20 0.85±0.10 1.15±0.10 1.9±0.20 1.9+0.1/-0.2 2.5±0.20 2.0+0/-0.30 2.5±0.20 *1 K K C D C P T H E C P V W P K A V K D G D D F L D F N Y M Y M e 0.0675±0.0275 0.0675±0.0275 0.1±0.03 0.1±0.03 0.15±0.05 0.25±0.10 0.25±0.10 0.18±0.08 0.35±0.25 0.25±0.15 0.5±0.25 0.3±0.2 0.5+0.35/-0.25 0.6±0.3 0.6±0.4 0.9±0.6 Note : ※. LW reverse type, *1.Thickness code ■STANDARD QUANTITY Type EIA(inch) Dimension 021 008004 [mm] 0.125 042 01005 0.2 063 0201 0.3 105 0402 0.13 0.18 0.2 0.3 0.5 0204 ※ 107 0603 0306 ※ 212 0805 0508 ※ 316 1206 325 1210 432 1812 0.30 0.45 0.8 0.50 0.45 0.85 1.25 0.85 0.85 1.15 1.6 0.85 1.15 1.9 2.0 max 2.5 2.0 max 2.5 Code K C D P T H E C P V W P K A V K D G D D F L D F N Y M Y M Standard quantity[pcs] Paper tape Embossed tape - 50000 - 40000 15000 - - - 20000 15000 20000 15000 - - 10000 - 4000 - - 4000 4000 - - 4000 4000 - - 3000 - - 3000 2000 - 2000 - - - 1000 1000 500 Note : ※.LW Reverse type(□WK) c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 14 20 for General Electronic Equipment ■PARTS NUMBER Multilayer Ceramic Capacitors(Temperature compensating type) Part number 1 CG010[]K-W CG1R1[]K-W CG1R2[]K-W CG1R3[]K-W CG1R4[]K-W CG1R5[]K-W CG1R6[]K-W CG1R7[]K-W CG1R8[]K-W CG1R9[]K-W CG020[]K-W CG2R1[]K-W CG2R2[]K-W CG2R3[]K-W CG2R4[]K-W CG2R5[]K-W CG2R6[]K-W CG2R7[]K-W CG2R8[]K-W CG2R9[]K-W CG030[]K-W CG3R1[]K-W CG3R2[]K-W CG3R3[]K-W CG3R4[]K-W CG3R5[]K-W CG3R6[]K-W CG3R7[]K-W CG3R8[]K-W CG3R9[]K-W CG040[]K-W CG4R1[]K-W CG4R2[]K-W CG4R3[]K-W CG4R4[]K-W CG4R5[]K-W CG4R6[]K-W CG4R7[]K-W CG4R8[]K-W CG4R9[]K-W CG050[]K-W CG5R1[]K-W CG5R2[]K-W CG5R3[]K-W CG5R4[]K-W CG5R5[]K-W CG5R6[]K-W CG5R7[]K-W CG5R8[]K-W CG5R9[]K-W CG060[]K-W CG6R1[]K-W CG6R2[]K-W CG6R3[]K-W CG6R4[]K-W CG6R5[]K-W CG6R6[]K-W CG6R7[]K-W CG6R8[]K-W CG6R9[]K-W CG070[]K-W CG7R1[]K-W CG7R2[]K-W CG7R3[]K-W CG7R4[]K-W CG7R5[]K-W CG7R6[]K-W CG7R7[]K-W CG7R8[]K-W CG7R9[]K-W CG080[]K-W CG8R1[]K-W CG8R2[]K-W CG8R3[]K-W CG8R4[]K-W CG8R5[]K-W CG8R6[]K-W CG8R7[]K-W CG8R8[]K-W CG8R9[]K-W CG090[]K-W CG9R1[]K-W CG9R2[]K-W CG9R3[]K-W CG9R4[]K-W Rated voltage [V] 25 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 9.1 9.2 9.3 9.4 p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 420 200 0.125±0.013 422 200 0.125±0.013 424 200 0.125±0.013 426 200 0.125±0.013 428 200 0.125±0.013 430 200 0.125±0.013 432 200 0.125±0.013 434 200 0.125±0.013 436 200 0.125±0.013 438 200 0.125±0.013 440 200 0.125±0.013 442 200 0.125±0.013 444 200 0.125±0.013 446 200 0.125±0.013 448 200 0.125±0.013 450 200 0.125±0.013 452 200 0.125±0.013 454 200 0.125±0.013 456 200 0.125±0.013 458 200 0.125±0.013 460 200 0.125±0.013 462 200 0.125±0.013 464 200 0.125±0.013 466 200 0.125±0.013 468 200 0.125±0.013 470 200 0.125±0.013 472 200 0.125±0.013 474 200 0.125±0.013 476 200 0.125±0.013 478 200 0.125±0.013 480 200 0.125±0.013 482 200 0.125±0.013 484 200 0.125±0.013 486 200 0.125±0.013 488 200 0.125±0.013 490 200 0.125±0.013 492 200 0.125±0.013 494 200 0.125±0.013 496 200 0.125±0.013 498 200 0.125±0.013 500 200 0.125±0.013 502 200 0.125±0.013 504 200 0.125±0.013 506 200 0.125±0.013 508 200 0.125±0.013 510 200 0.125±0.013 512 200 0.125±0.013 514 200 0.125±0.013 516 200 0.125±0.013 518 200 0.125±0.013 520 200 0.125±0.013 522 200 0.125±0.013 524 200 0.125±0.013 526 200 0.125±0.013 528 200 0.125±0.013 530 200 0.125±0.013 532 200 0.125±0.013 534 200 0.125±0.013 536 200 0.125±0.013 538 200 0.125±0.013 540 200 0.125±0.013 542 200 0.125±0.013 544 200 0.125±0.013 546 200 0.125±0.013 548 200 0.125±0.013 550 200 0.125±0.013 552 200 0.125±0.013 554 200 0.125±0.013 556 200 0.125±0.013 558 200 0.125±0.013 560 200 0.125±0.013 562 200 0.125±0.013 564 200 0.125±0.013 566 200 0.125±0.013 568 200 0.125±0.013 570 200 0.125±0.013 572 200 0.125±0.013 574 200 0.125±0.013 576 200 0.125±0.013 578 200 0.125±0.013 580 200 0.125±0.013 582 200 0.125±0.013 584 200 0.125±0.013 586 200 0.125±0.013 588 200 0.125±0.013 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R MULTILAYER CERAMIC CAPACITORS TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 TMK021 Part number 2 CERAMIC CAPACITORS ●021TYPE 【Temperature Characteristic CG : CG/C0G(-55~+125℃)】 0.125mm thickness(K) c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 23 for General Electronic Equipment ■PARTS NUMBER Part number 1 Part number 2 CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS TMK021 CG9R5[]K-W TMK021 CG9R6[]K-W TMK021 CG9R7[]K-W TMK021 CG9R8[]K-W TMK021 CG9R9[]K-W TMK021 CG100DK-W TMK021 CG120JK-W TMK021 CG150JK-W TMK021 CG180JK-W TMK021 CG220JK-W TMK021 CG270JK-W EMK021 CG330JK-W EMK021 CG390JK-W EMK021 CG470JK-W EMK021 CG560JK-W LMK021 CG680JK-W LMK021 CG820JK-W LMK021 CG101JK-W Rated voltage [V] 25 16 10 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 9.5 9.6 9.7 9.8 9.9 10 12 15 18 22 27 33 39 47 56 68 82 100 p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.25pF, ±0.5pF ±0.5pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 590 200 0.125±0.013 592 200 0.125±0.013 594 200 0.125±0.013 596 200 0.125±0.013 598 200 0.125±0.013 600 200 0.125±0.013 640 200 0.125±0.013 700 200 0.125±0.013 760 200 0.125±0.013 840 200 0.125±0.013 940 200 0.125±0.013 1000 150 0.125±0.013 1000 150 0.125±0.013 1000 150 0.125±0.013 1000 150 0.125±0.013 1000 200 0.125±0.013 1000 200 0.125±0.013 1000 200 0.125±0.013 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 420 200 0.2±0.02 422 200 0.2±0.02 424 200 0.2±0.02 426 200 0.2±0.02 428 200 0.2±0.02 430 200 0.2±0.02 432 200 0.2±0.02 434 200 0.2±0.02 436 200 0.2±0.02 438 200 0.2±0.02 440 200 0.2±0.02 442 200 0.2±0.02 444 200 0.2±0.02 446 200 0.2±0.02 448 200 0.2±0.02 450 200 0.2±0.02 452 200 0.2±0.02 454 200 0.2±0.02 456 200 0.2±0.02 458 200 0.2±0.02 460 200 0.2±0.02 462 200 0.2±0.02 464 200 0.2±0.02 466 200 0.2±0.02 468 200 0.2±0.02 470 200 0.2±0.02 472 200 0.2±0.02 474 200 0.2±0.02 476 200 0.2±0.02 478 200 0.2±0.02 480 200 0.2±0.02 482 200 0.2±0.02 484 200 0.2±0.02 486 200 0.2±0.02 488 200 0.2±0.02 490 200 0.2±0.02 492 200 0.2±0.02 494 200 0.2±0.02 496 200 0.2±0.02 498 200 0.2±0.02 500 200 0.2±0.02 502 200 0.2±0.02 504 200 0.2±0.02 506 200 0.2±0.02 508 200 0.2±0.02 510 200 0.2±0.02 512 200 0.2±0.02 514 200 0.2±0.02 516 200 0.2±0.02 518 200 0.2±0.02 520 200 0.2±0.02 522 200 0.2±0.02 524 200 0.2±0.02 526 200 0.2±0.02 528 200 0.2±0.02 530 200 0.2±0.02 532 200 0.2±0.02 534 200 0.2±0.02 536 200 0.2±0.02 538 200 0.2±0.02 540 200 0.2±0.02 542 200 0.2±0.02 544 200 0.2±0.02 546 200 0.2±0.02 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R ●042TYPE 【Temperature Characteristic CG : CG/C0G(-55~+125℃)】 0.2mm thickness(C,D) Part number 1 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 TMK042 CG010[]D-W CG1R1[]D-W CG1R2[]D-W CG1R3[]D-W CG1R4[]D-W CG1R5[]D-W CG1R6[]D-W CG1R7[]D-W CG1R8[]D-W CG1R9[]D-W CG020[]D-W CG2R1[]D-W CG2R2[]D-W CG2R3[]D-W CG2R4[]D-W CG2R5[]D-W CG2R6[]D-W CG2R7[]D-W CG2R8[]D-W CG2R9[]D-W CG030[]D-W CG3R1[]D-W CG3R2[]D-W CG3R3[]D-W CG3R4[]D-W CG3R5[]D-W CG3R6[]D-W CG3R7[]D-W CG3R8[]D-W CG3R9[]D-W CG040[]D-W CG4R1[]D-W CG4R2[]D-W CG4R3[]D-W CG4R4[]D-W CG4R5[]D-W CG4R6[]D-W CG4R7[]D-W CG4R8[]D-W CG4R9[]D-W CG050[]D-W CG5R1[]D-W CG5R2[]D-W CG5R3[]D-W CG5R4[]D-W CG5R5[]D-W CG5R6[]D-W CG5R7[]D-W CG5R8[]D-W CG5R9[]D-W CG060[]D-W CG6R1[]D-W CG6R2[]D-W CG6R3[]D-W CG6R4[]D-W CG6R5[]D-W CG6R6[]D-W CG6R7[]D-W CG6R8[]D-W CG6R9[]D-W CG070[]D-W CG7R1[]D-W CG7R2[]D-W CG7R3[]D-W Part number 2 Rated voltage [V] 25 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 6 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 7.1 7.2 7.3 p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 24 20 for General Electronic Equipment ■PARTS NUMBER Part number 1 Part number 2 CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 7.4 7.5 7.6 7.7 7.8 7.9 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 9.9 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.1pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.25pF, ±0.5pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 548 200 0.2±0.02 550 200 0.2±0.02 552 200 0.2±0.02 554 200 0.2±0.02 556 200 0.2±0.02 558 200 0.2±0.02 560 200 0.2±0.02 562 200 0.2±0.02 564 200 0.2±0.02 566 200 0.2±0.02 568 200 0.2±0.02 570 200 0.2±0.02 572 200 0.2±0.02 574 200 0.2±0.02 576 200 0.2±0.02 578 200 0.2±0.02 580 200 0.2±0.02 582 200 0.2±0.02 584 200 0.2±0.02 586 200 0.2±0.02 588 200 0.2±0.02 590 200 0.2±0.02 592 200 0.2±0.02 594 200 0.2±0.02 596 200 0.2±0.02 598 200 0.2±0.02 600 200 0.2±0.02 620 200 0.2±0.02 640 200 0.2±0.02 660 200 0.2±0.02 700 200 0.2±0.02 720 200 0.2±0.02 760 200 0.2±0.02 800 200 0.2±0.02 840 200 0.2±0.02 880 200 0.2±0.02 940 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 420 200 0.2±0.02 422 200 0.2±0.02 424 200 0.2±0.02 426 200 0.2±0.02 428 200 0.2±0.02 430 200 0.2±0.02 432 200 0.2±0.02 434 200 0.2±0.02 436 200 0.2±0.02 438 200 0.2±0.02 440 200 0.2±0.02 442 200 0.2±0.02 444 200 0.2±0.02 446 200 0.2±0.02 448 200 0.2±0.02 450 200 0.2±0.02 452 200 0.2±0.02 454 200 0.2±0.02 456 200 0.2±0.02 458 200 0.2±0.02 460 200 0.2±0.02 462 200 0.2±0.02 464 200 0.2±0.02 466 200 0.2±0.02 468 200 0.2±0.02 470 200 0.2±0.02 472 200 0.2±0.02 474 200 0.2±0.02 476 200 0.2±0.02 478 200 0.2±0.02 480 200 0.2±0.02 482 200 0.2±0.02 484 200 0.2±0.02 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R MULTILAYER CERAMIC CAPACITORS 25 Temperature characteristics CERAMIC CAPACITORS TMK042 CG7R4[]D-W TMK042 CG7R5[]D-W TMK042 CG7R6[]D-W TMK042 CG7R7[]D-W TMK042 CG7R8[]D-W TMK042 CG7R9[]D-W TMK042 CG080[]D-W TMK042 CG8R1[]D-W TMK042 CG8R2[]D-W TMK042 CG8R3[]D-W TMK042 CG8R4[]D-W TMK042 CG8R5[]D-W TMK042 CG8R6[]D-W TMK042 CG8R7[]D-W TMK042 CG8R8[]D-W TMK042 CG8R9[]D-W TMK042 CG090[]D-W TMK042 CG9R1[]D-W TMK042 CG9R2[]D-W TMK042 CG9R3[]D-W TMK042 CG9R4[]D-W TMK042 CG9R5[]D-W TMK042 CG9R6[]D-W TMK042 CG9R7[]D-W TMK042 CG9R8[]D-W TMK042 CG9R9[]D-W TMK042 CG100DD-W TMK042 CG110JD-W TMK042 CG120JD-W TMK042 CG130JD-W TMK042 CG150JD-W TMK042 CG160JC-W TMK042 CG180JC-W TMK042 CG200JC-W TMK042 CG220JC-W TMK042 CG240JC-W TMK042 CG270JC-W TMK042 CG300JC-W TMK042 CG330JC-W TMK042 CG360JC-W TMK042 CG390JC-W TMK042 CG430JC-W TMK042 CG470JC-W TMK042 CG510JC-W TMK042 CG560JC-W TMK042 CG620JC-W TMK042 CG680JC-W TMK042 CG750JC-W TMK042 CG820JC-W TMK042 CG910JC-W TMK042 CG101JC-W Rated voltage [V] 【Temperature Characteristic CG : CG/C0G(-55~+125℃)】 0.2mm thickness(C,D) Part number 1 EMK042 CG010[]D-W EMK042 CG1R1[]D-W EMK042 CG1R2[]D-W EMK042 CG1R3[]D-W EMK042 CG1R4[]D-W EMK042 CG1R5[]D-W EMK042 CG1R6[]D-W EMK042 CG1R7[]D-W EMK042 CG1R8[]D-W EMK042 CG1R9[]D-W EMK042 CG020[]D-W EMK042 CG2R1[]D-W EMK042 CG2R2[]D-W EMK042 CG2R3[]D-W EMK042 CG2R4[]D-W EMK042 CG2R5[]D-W EMK042 CG2R6[]D-W EMK042 CG2R7[]D-W EMK042 CG2R8[]D-W EMK042 CG2R9[]D-W EMK042 CG030[]D-W EMK042 CG3R1[]D-W EMK042 CG3R2[]D-W EMK042 CG3R3[]D-W EMK042 CG3R4[]D-W EMK042 CG3R5[]D-W EMK042 CG3R6[]D-W EMK042 CG3R7[]D-W EMK042 CG3R8[]D-W EMK042 CG3R9[]D-W EMK042 CG040[]D-W EMK042 CG4R1[]D-W EMK042 CG4R2[]D-W Part number 2 Rated voltage [V] 16 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.05pF, ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 25 for General Electronic Equipment ■PARTS NUMBER Part number 1 CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS EMK042 CG4R3[]D-W EMK042 CG4R4[]D-W EMK042 CG4R5[]D-W EMK042 CG4R6[]D-W EMK042 CG4R7[]D-W EMK042 CG4R8[]D-W EMK042 CG4R9[]D-W EMK042 CG050[]D-W EMK042 CG5R1[]D-W EMK042 CG5R2[]D-W EMK042 CG5R3[]D-W EMK042 CG5R4[]D-W EMK042 CG5R5[]D-W EMK042 CG5R6[]D-W EMK042 CG5R7[]D-W EMK042 CG5R8[]D-W EMK042 CG5R9[]D-W EMK042 CG060[]D-W EMK042 CG6R1[]D-W EMK042 CG6R2[]D-W EMK042 CG6R3[]D-W EMK042 CG6R4[]D-W EMK042 CG6R5[]D-W EMK042 CG6R6[]D-W EMK042 CG6R7[]D-W EMK042 CG6R8[]D-W EMK042 CG6R9[]D-W EMK042 CG070[]D-W EMK042 CG7R1[]D-W EMK042 CG7R2[]D-W EMK042 CG7R3[]D-W EMK042 CG7R4[]D-W EMK042 CG7R5[]D-W EMK042 CG7R6[]D-W EMK042 CG7R7[]D-W EMK042 CG7R8[]D-W EMK042 CG7R9[]D-W EMK042 CG080[]D-W EMK042 CG8R1[]D-W EMK042 CG8R2[]D-W EMK042 CG8R3[]D-W EMK042 CG8R4[]D-W EMK042 CG8R5[]D-W EMK042 CG8R6[]D-W EMK042 CG8R7[]D-W EMK042 CG8R8[]D-W EMK042 CG8R9[]D-W EMK042 CG090[]D-W EMK042 CG9R1[]D-W EMK042 CG9R2[]D-W EMK042 CG9R3[]D-W EMK042 CG9R4[]D-W EMK042 CG9R5[]D-W EMK042 CG9R6[]D-W EMK042 CG9R7[]D-W EMK042 CG9R8[]D-W EMK042 CG9R9[]D-W EMK042 CG100DD-W EMK042 CG110JD-W EMK042 CG120JD-W EMK042 CG130JD-W EMK042 CG150JD-W EMK042 CG160JC-W EMK042 CG180JC-W EMK042 CG200JC-W EMK042 CG220JC-W EMK042 CG240JC-W EMK042 CG270JC-W EMK042 CG300JC-W EMK042 CG330JC-W EMK042 CG360JC-W EMK042 CG390JC-W EMK042 CG430JC-W EMK042 CG470JC-W EMK042 CG510JC-W EMK042 CG560JC-W EMK042 CG620JC-W EMK042 CG680JC-W EMK042 CG750JC-W EMK042 CG820JC-W EMK042 CG910JC-W EMK042 CG101JC-W EMK042 CG221JC-W EMK042 CG241JC-W EMK042 CG271JC-W EMK042 CG331JC-W Part number 2 Rated voltage [V] 16 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] 4.3 p 4.4 p 4.5 p 4.6 p 4.7 p 4.8 p 4.9 p 5p 5.1 p 5.2 p 5.3 p 5.4 p 5.5 p 5.6 p 5.7 p 5.8 p 5.9 p 6p 6.1 p 6.2 p 6.3 p 6.4 p 6.5 p 6.6 p 6.7 p 6.8 p 6.9 p 7p 7.1 p 7.2 p 7.3 p 7.4 p 7.5 p 7.6 p 7.7 p 7.8 p 7.9 p 8p 8.1 p 8.2 p 8.3 p 8.4 p 8.5 p 8.6 p 8.7 p 8.8 p 8.9 p 9p 9.1 p 9.2 p 9.3 p 9.4 p 9.5 p 9.6 p 9.7 p 9.8 p 9.9 p 10 p 11 p 12 p 13 p 15 p 16 p 18 p 20 p 22 p 24 p 27 p 30 p 33 p 36 p 39 p 43 p 47 p 51 p 56 p 62 p 68 p 75 p 82 p 91 p 100 p 220 p 240 p 270 p 330 p Capacitance tolerance ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.1pF, ±0.25pF, ±0.5pF ±0.5pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% Q HTLT (at 1MHz) Thickness *3 [mm] Rated voltage x % min 486 200 0.2±0.02 488 200 0.2±0.02 490 200 0.2±0.02 492 200 0.2±0.02 494 200 0.2±0.02 496 200 0.2±0.02 498 200 0.2±0.02 500 200 0.2±0.02 502 200 0.2±0.02 504 200 0.2±0.02 506 200 0.2±0.02 508 200 0.2±0.02 510 200 0.2±0.02 512 200 0.2±0.02 514 200 0.2±0.02 516 200 0.2±0.02 518 200 0.2±0.02 520 200 0.2±0.02 522 200 0.2±0.02 524 200 0.2±0.02 526 200 0.2±0.02 528 200 0.2±0.02 530 200 0.2±0.02 532 200 0.2±0.02 534 200 0.2±0.02 536 200 0.2±0.02 538 200 0.2±0.02 540 200 0.2±0.02 542 200 0.2±0.02 544 200 0.2±0.02 546 200 0.2±0.02 548 200 0.2±0.02 550 200 0.2±0.02 552 200 0.2±0.02 554 200 0.2±0.02 556 200 0.2±0.02 558 200 0.2±0.02 560 200 0.2±0.02 562 200 0.2±0.02 564 200 0.2±0.02 566 200 0.2±0.02 568 200 0.2±0.02 570 200 0.2±0.02 572 200 0.2±0.02 574 200 0.2±0.02 576 200 0.2±0.02 578 200 0.2±0.02 580 200 0.2±0.02 582 200 0.2±0.02 584 200 0.2±0.02 586 200 0.2±0.02 588 200 0.2±0.02 590 200 0.2±0.02 592 200 0.2±0.02 594 200 0.2±0.02 596 200 0.2±0.02 598 200 0.2±0.02 600 200 0.2±0.02 620 200 0.2±0.02 640 200 0.2±0.02 660 200 0.2±0.02 700 200 0.2±0.02 720 200 0.2±0.02 760 200 0.2±0.02 800 200 0.2±0.02 840 200 0.2±0.02 880 200 0.2±0.02 940 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 1000 200 0.2±0.02 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 26 20 for General Electronic Equipment ■PARTS NUMBER ●063TYPE 【Temperature Characteristic CG : CG/C0G(-55~+125℃)】 0.3mm thickness(T) Part number 2 50 25 Temperature characteristics CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Capacitance [F] Capacitance tolerance 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 1000 ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 800 200 0.3±0.03 840 200 0.3±0.03 880 200 0.3±0.03 940 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 1000 200 0.3±0.03 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Q HTLT (at 1MHz) Thickness*3 [mm] Rated voltage x % min 410 200 0.5±0.05 420 200 0.5±0.05 430 200 0.5±0.05 440 200 0.5±0.05 460 200 0.5±0.05 480 200 0.5±0.05 500 200 0.5±0.05 520 200 0.5±0.05 540 200 0.5±0.05 560 200 0.5±0.05 580 200 0.5±0.05 600 200 0.5±0.05 640 200 0.5±0.05 700 200 0.5±0.05 760 200 0.5±0.05 840 200 0.5±0.05 940 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 1000 200 0.5±0.05 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R MULTILAYER CERAMIC CAPACITORS UMK063 CG200JT-F UMK063 CG220JT-F UMK063 CG240JT-F UMK063 CG270JT-F UMK063 CG300JT-F UMK063 CG330JT-F UMK063 CG360JT-F UMK063 CG390JT-F UMK063 CG430JT-F UMK063 CG470JT-F UMK063 CG510JT-F UMK063 CG560JT-F UMK063 CG620JT-F UMK063 CG680JT-F UMK063 CG750JT-F UMK063 CG820JT-F UMK063 CG910JT-F UMK063 CG101JT-F UMK063 CG111JT-F UMK063 CG121JT-F UMK063 CG131JT-F UMK063 CG151JT-F UMK063 CG181JT-F UMK063 CG201JT-F UMK063 CG221JT-F TMK063 CG241JT-F TMK063 CG271JT-F TMK063 CG301JT-F TMK063 CG331JT-F TMK063 CG361JT-F TMK063 CG391JT-F TMK063 CG431JT-F TMK063 CG471JT-F TMK063 CG511JT-F TMK063 CG561JT-F TMK063 CG621JT-F TMK063 CG681JT-F TMK063 CG751JT-F TMK063 CG821JT-F TMK063 CG911JT-F TMK063 CG102JT-F Rated voltage [V] CERAMIC CAPACITORS Part number 1 ●105TYPE 【Temperature Characteristic U△ : U△/U2△(-55~+125℃)】 0.5mm thickness(V) Part number 1 UMK105 UK0R5CV-F UMK105 UK010CV-F UMK105 UK1R5CV-F UMK105 UK020CV-F UMK105 UK030CV-F UMK105 UJ040CV-F UMK105 UJ050CV-F UMK105 UJ060DV-F UMK105 UJ070DV-F UMK105 UJ080DV-F UMK105 UJ090DV-F UMK105 UJ100DV-F UMK105 UJ120JV-F UMK105 UJ150JV-F UMK105 UJ180JV-F UMK105 UJ220JV-F UMK105 UJ270JV-F UMK105 UJ330JV-F UMK105 UJ390JV-F UMK105 UJ470JV-F UMK105 UJ560JV-F UMK105 UJ680JV-F UMK105 UJ820JV-F UMK105 UJ101JV-F UMK105 UJ121JV-F UMK105 UJ151JV-F UMK105 UJ181JV-F UMK105 UJ221JV-F UMK105 UJ271JV-F UMK105 UJ331JV-F Part number 2 Rated voltage [V] 50 Temperature characteristics UK UK UK UK UK UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ UJ U2K U2K U2K U2K U2K U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J U2J Capacitance [F] 0.5 1 1.5 2 3 4 5 6 7 8 9 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 p p p p p p p p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±0.5pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 27 Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity ●Taped package Thickness Type(EIA) □MK021(008004) □VS021(008004) □MK042(01005) □VS042(01005) □MK063(0201) □WK105(0204) ※ □MK105(0402) □MF105(0402) □VK105(0402) □MK107(0603) □WK107(0306) ※ □MF107(0603) □VS107(0603) □MJ107(0603) □MK212(0805) □WK212(0508) ※ □MF212(0805) □VS212(0805) □MJ212(0805) □MK316(1206) □MF316(1206) □MJ316(1206) □MK325(1210) □MF325(1210) □MJ325(1210) □MK432(1812) Note : ※ LW Reverse type. mm code 0.125 K 0.2 0.2 0.3 0.3 0.13 0.18 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.7 0.8 0.45 0.85 1.25 0.85 0.85 1.25 0.85 1.15 1.6 1.15 1.6 0.85 1.15 1.9 2.0max. 2.5 1.9 2.5 2.5 C, D C P,T P H E C P V W K V A C A K D G D D G D F L F L D F N Y M N M M Standard quantity [pcs] Paper tape Embossed tape - 50000 - 40000 15000 10000 - - 20000 15000 10000 10000 4000 - 4000 4000 3000 - - 20000 15000 - - - - - 4000 - - 3000 4000 - - 4000 4000 - 4000 - - - - 3000 - - 2000 - 3000 2000 3000 2000 - 2000 - - - - 1000 2000 500(T), 1000(P) 500 ②Taping material ※No bottom tape for pressed carrier tape ●Card board carrier tape ●Embossed tape Top tape Top tape Base tape Sprocket hole Sprocket hole Bottom tape Chip cavity Base tape Chip cavity ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Chip filled Chip ※ LW Reverse type. ③Representative taping dimensions ●Paper Tape(8mm wide) ●Pressed carrier tape( 2mm pitch) Unit:mm(inch) A B T 8.0±0.3 (0.315±0.012) Sprocket hole 1.75±0.1 (0.069±0.004) 3.5±0.05 (0.138±0.002) φ1.5+0.1/-0 (φ0.059+0.004/-0) T1 2.0±0.05 (0.079±0.002) F 4.0±0.1 (0.157±0.004) Chip Cavity Type(EIA) A 0.37 Insertion Pitch F B 0.67 □MK063(0201) □WK105(0204) ※ 0.65 1.15 □MK105(0402) (*1 C) □MK105(0402) (*1 P) Note *1 Thickness, C:0.2mm ,P:0.3mm. ※ LW Reverse type. 2.0±0.05 ●Punched carrier tape (2mm pitch) 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. Unit:mm T 8.0±0.3 (0.315±0.012) B 2.0±0.05 (0.079±0.002) 1.75±0.1 (0.069±0.004) 3.5±0.05 (0.138±0.002) A F T1 Unit:mm(inch) φ1.5+0.1/-0 (φ0.059+0.004/-0) Sprocket hole Tape Thickness T 4.0±0.1 (0.157±0.004) A Chip Cavity B Insertion Pitch F Tape Thickness T 0.65 1.15 2.0±0.05 0.8max. Type(EIA) □MK105 (0402) □MF105 (0402) □VK105 (0402) Unit:mm ●Punched carrier tape (4mm pitch) B T 8.0±0.3 (0.315±0.012) A F Unit:mm(inch) 1.75±0.1 (0.069±0.004) 3.5±0.05 (0.138±0.002) Sprocket hole φ1.5+0.1/-0 (φ0.059+0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Chip Cavity Type(EIA) A Insertion Pitch F B □MK107(0603) □WK107(0306) ※ 1.0 1.8 □MF107(0603) 4.0±0.1 □MK212(0805) 1.65 2.4 □WK212(0508) ※ □MK316(1206) 2.0 3.6 Note:Taping size might be different depending on the size of the product. ※ LW Reverse type. ●Embossed tape(4mm wide) Unit:mm 4.0±0.05 (0.157±0.002) B 1.0±0.02 (0.039±0.001) 1.1max. 0.9±0.05 (0.035±0.002) 1.8±0.02 (0.071±0.001) A F 1.1max. Unit:mm(inch) φ0.8±0.04 (φ0.031±0.002) Sprocket hole Tape Thickness T 2.0±0.04 (0.079±0.002) Chip Cavity Type(EIA) □MK021(008004) □VS021(008004) □MK042(01005) □VS042(01005) A B 0.135 0.27 0.23 0.43 Insertion Pitch F K Tape Thickness T 1.0±0.02 0.5max. 0.25max. Unit:mm ●Embossed tape(8mm wide) Unit:mm(inch) 3.5±0.05 (0.138±0.002) Sprocket hole A B F 1.75±0.1 (0.069±0.004) 8.0±0.3 (0.315±0.012) φ1.5+0.1/-0 (φ0.059+0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) Type(EIA) □MK105(0402) □WK107(0306) ※ □MK212(0805) □MF212(0805) □MK316(1206) □MF316(1206) □MK325(1210) □MF325(1210) Note: ※ LW Reverse type. Chip Cavity A 0.6 1.0 B 1.1 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch F 2.0±0.1 4.0±0.1 Tape Thickness K 0.6max 1.3max. T 0.2±0.1 0.25±0.1 3.4max. 0.6max. Unit:mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 ●Embossed tape(12mm wide) Unit:mm(inch) 5.5±0.05 (0.217±0.002) Sprocket hole A B 4.0±0.1 (0.157±0.004) 12.0±0.3 (0.472±0.012) 1.75±0.1 (0.069±0.004) φ1.5+0.1/-0 (φ0.059+0.004/-0) 2.0±0.1 (0.079±0.004) F Chip Cavity Type(EIA) A 3.1 3.7 □MK325(1210) □MK432(1812) B 4.0 4.9 Insertion Pitch F 8.0±0.1 8.0±0.1 K 4.0max. 4.0max. Tape Thickness E 2.0±0.5 T 0.6max. 0.6max. Unit:mm ④Trailer and Leader Blank portion Chip cavity Blank portion Leader 100mm or more (3.94inches or more) 160mm or more (6.3inches or more) Direction of tape feed 400mm or more (15.7inches or more) ⑤Reel size t E C R B A D W A φ178±2.0 B φ50min. C φ13.0±0.2 D φ21.0±0.8 4mm wide tape 8mm wide tape 12mm wide tape T 1.5max. 2.5max. 2.5max. W 5±1.0 10±1.5 14±1.5 Unit:mm R 1.0 ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. Pull direction 0~20° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Temperature Compensating(Class1) Standard High Frequency Type -55 to +125℃ B7 C6 C7 Specification B X5R X7R X6S X7S Temperature Range -25 to +85℃ -55 to +85℃ -55 to +125℃ -55 to +105℃ -55 to +125℃ LD(※) X5R -55 to +85℃ BJ Specified Value High Permittivity (Class2) Note: ※LD Low distortion high value multilayer ceramic capacitor 2. Storage Conditions Temperature Compensating(Class1) Standard High Frequency Type -55 to +125℃ Specification Temperature Range B -25 to +85℃ BJ X5R -55 to +85℃ B7 X7R -55 to +125℃ C6 X6S -55 to +105℃ C7 X7S -55 to +125℃ LD(※) X5R -55 to +85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity (Class2) 3. Rated Voltage Specified Value Temperature Compensating(Class1) Standard 50VDC, 25VDC, 16VDC High Frequency Type 50VDC, 25VDC, 16VDC High Permittivity (Class2) 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage (Between terminals) Specified Value Temperature Compensating(Class1) Standard High Frequency Type No breakdown or damage High Permittivity (Class2) Test Methods and Remarks Class 1 Rated voltage×3 Applied voltage Duration Charge/discharge current Class 2 Rated voltage×2.5 1 to 5 sec. 50mA max. 5. Insulation Resistance Specified Value Temperature Compensating(Class1) Standard High Frequency Type High Permittivity (Class2) Note 1 Test Methods and Remarks Applied voltage Duration Charge/discharge current 10000 MΩ min. C≦0.047 F : 10000 MΩ min. C>0.047μF : 500MΩ・μF : Rated voltage : 60±5 sec. : 50mA max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 6. Capacitance (Tolerance) Specified Value Standard C□ U□ 0.2pF≦C≦5pF 0.2pF≦C≦10pF C>10pF : ±0.25pF : ±0.5pF : ±5% or ±10% High Frequency Type CG 0.2pF≦C≦2pF C>2pF : ±0.1pF : ±5% Temperature Compensating(Class1) High Permittivity (Class2) Test Methods and Remarks ±10% or ±20% Standard Preconditioning Measuring frequency Measuring voltage Nte Bias application Class 1 High Frequency Type None 1MHz±10% 0.5 to 5Vrms Class 2 C≦10μF C>10μF Thermal treatment (at 150℃ for 1hr) Note 2 1kHz±10% 120±10Hz 1±0.2Vrms 0.5±0.1Vrms None 7. Q or Dissipation Factor Specified Value Temperature Compensating(Class1) C<30pF : Q≧400+20C C≧30pF : Q≧1000 (C:Nominal capacitance) Standard High Frequency Type High Permittivity (Class2) Note 1 Refer to detailed specification BJ, B7, C6, C7:2.5% max. Class 1 High Frequency Type None 1MHz±10% 1GHz 0.5 to 5Vrms Standard Test Methods and Remarks Preconditioning Measuring frequency Measuring voltage Note 1 Bias application High Frequency Type Measuring equipment Measuring jig Class 2 C≦10μF C>10μF Thermal treatment (at 150℃ for 1hr) Note 2 1kHz±10% 120±10Hz 1±0.2Vrms 0.5±0.1Vrms None : HP4291A : HP16192A 8. Temperature Characteristic (Without voltage application) Temperature Characteristic [ppm/℃] C□ : 0 CG Standard Temperature Compensating(Class1) U□ : -750 High Frequency Type UJ, UK Temperature Characteristic [ppm/℃] C□ : 0 CG Specified Value Tolerance [ppm/℃] G : ±30 J:±120 K:±250 Tolerance [ppm/℃] G : ±30 Capacitance Reference Temperature Range change temperature ±10% 20℃ -25 to +85℃ ±15% 25℃ -55 to +85℃ ±15% 25℃ -55 to +125℃ ±22% 25℃ -55 to +105℃ ±22% 25℃ -55 to +125℃ ±15% 25℃ -55 to +85℃ distortion high value multilayer ceramic capacitor Specification B X5R B7 X7R C6 XS C7 X7S LD(※) X5R Note : ※LD Low BJ High Permittivity (Class2) Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. (C85-C20) ×106(ppm/℃) △T=65 C20×△T Test Methods and Remarks Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Step B X5R、X7R、X6S、X7S 1 Minimum operating temperature 2 20℃ 25℃ 3 Maximum operating temperature (C-C2) C2 ×100(%) C :Capacitance in Step 1 or Step 3 C2 :Capacitance in Step 2 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 9. Deflection Specified Value Temperature Compensating(Class1) Standard Appearance Capacitance change : No abnormality : Within ±5% or ±0.5 pF, whichever is larger. High Frequency Type Appearance Capacitance change : No abnormality : Within±0.5 pF Appearance Capacitance change : No abnormality : Within ±12.5% High Permittivity (Class2) Board Thickness Warp Duration Test Methods and Remarks Multilayer Ceramic Capacitors 021, 042, 063, ※105 Type The other types Glass epoxy-resin substrate 0.8mm 1.6mm 1mm 10 sec. ※ 105 Type thickness, C: 0.2mm ,P: 0.3mm. Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Standard Temperature Compensating(Class1) High Frequency Type High Permittivity (Class2) Test Methods and Remarks - No mechanical damage. - High Frequency 105Type Applied force : 5N Duraton : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Standard Temperature Compensating(Class1) High Frequency Type No terminal separation or its indication. High Permittivity (Class2) Test Methods and Remarks Applied force Duration Multilayer Ceramic Capacitors 021, 042, 063 Type 105 Type or more 2N 5N 30±5 sec. 12. Solderability Specified Value Temperature Compensating(Class1) Standard High Frequency Type At least 95% of terminal electrode is covered by new solder. High Permittivity (Class2) Test Methods and Remarks Solder type Solder temperature Duration Eutectic solder H60A or H63A 230±5℃ Lead-free solder Sn-3.0Ag-0.5Cu 245±3℃ 4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 13. Resistance to Soldering Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value (between terminals) : No abnormality High Frequency Type Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% : Initial value : Initial value (between terminals) : No abnormality Appearance Capacitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : Within ±7.5% : Initial value : Initial value (between terminals): No abnormality Temperature Compensating(Class1) Specified Value High Permittivity (Class2) Note 1 Class 1 021, 042, 063 Type 105 Type Preconditioning Preheating Test Methods and Remarks None 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 150℃, 1 to 2 min. Solder temp. Duration Recovery 270±5℃ 3±0.5 sec. 6 to 24 hrs (Standard condition) Note 5 021, 042、063 Type Preconditioning Preheating 150℃, 1 to 2 min. Solder temp. Duration Recovery Class 2 105, 107, 212 Type 316, 325, 432 Type Thermal treatment (at 150℃ for 1 hr) Note 2 80 to 100℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 2 to 5 min. 150 to 200℃, 5 to 10 min. 270±5℃ 3±0.5 sec. 24±2 hrs (Standard condition) Note 5 14. Temperature Cycle (Thermal Shock) Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value (between terminals) : No abnormality High Frequency Type Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±0.25pF : Initial value : Initial value (between terminals) : No abnormality Appearance Capacitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : Within ±7.5% : Initial value : Initial value (between terminals) : No abnormality Temperature Compensating(Class1) Specified Value High Permittivity (Class2) Note 1 Class 1 Preconditioning Test Methods and Remarks 1 cycle Number of cycles Recovery Class 2 Thermal treatment (at 150℃ for 1 hr) Note 2 None Step 1 2 3 4 Temperature(℃) Minimum operating temperature Normal temperature Maximum operating temperature Normal temperature Time(min.) 30±3 2 to 3 30±3 2 to 3 5 times 6 to 24 hrs (Standard condition) Note 5 24±2 hrs (Standard condition) Note 5 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 15. Humidity (Steady State) Appearance Capacitance change Q Standard Temperature Compensating(Class1) Specified Value High Frequency Type High Permittivity (Class2) Note 1 Insulation resistance : No abnormality : Within ±5% or ±0.5pF, whichever is larger. : C<10pF : Q≧200+10C 10≦C<30pF : Q≧275+2.5C C≧30pF:Q≧350(C:Nominal capacitance) : 1000 MΩ min. Appearance Capacitance change Insulation resistance : No abnormality : Within ±0.5pF, : 1000 MΩ min. Appearance Capacitance change Dissipation factor Insulation resistance : : : : Class 1 Standard Test Methods and Remarks Preconditioning Temperature Humidity Duration Recovery No abnormality Within ±12.5% 5.0% max. 50 MΩμF or 1000 MΩ whichever is smaller. Class 2 All items Thermal treatment( at 150℃ for 1 hr) Note 2 40±2℃ 90 to 95%RH 500+24/-0 hrs 24±2 hrs (Standard condition) Note 5 High Frequency Type None 40±2℃ 60±2℃ 90 to 95%RH 500+24/-0 hrs 6 to 24 hrs (Standard condition) Note 5 16. Humidity Loading Appearance Capacitance change Q Standard Insulation resistance Temperature Compensating(Class1) Specified Value Appearance Capacitance change Note 1 Appearance Capacitance change Dissipation factor Insulation resistance : : : : 90 to 95%RH 500+24/-0 hrs Rated voltage 50mA max. 50mA max. 6 to 24 hrs (Standard condition) Note 5 24±2 hrs(Standard condition) Note 5 Preconditioning Temperature Humidity Duration Applied voltage Charge/discharge current Recovery Class 1 High Frequency Type No abnormality Within ±12.5% 5.0% max. 25 MΩμF or 500 MΩ, whichever is smaller. Class 2 All items Voltage treatment (Rated voltage are applied for 1 hour at 40℃) Note 3 40±2℃ 90 to 95%RH 500+24/-0 hrs Rated voltage Standard Test Methods and Remarks Insulation resistance : No abnormality : C≦2pF:Within ±0.4 pF C>2pF:Within ±0.75 pF (C:Nominal capacitance) : 500 MΩ min. High Frequency Type High Permittivity (Class2) : No abnormality : Within ±7.5% or ±0.75pF, whichever is larger. : C<30pF:Q≧100+10C/3 C≧30pF:Q≧200 (C:Nominal capacitance) : 500 MΩ min. None 40±2℃ 60±2℃ ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 17. High Temperature Loading Appearance Capacitance change Q Standard Temperature Compensating(Class1) Specified Value High Frequency Type High Permittivity (Class2) Note 1 Test Methods and Remarks Temperature Duration Applied voltage Charge/discharge current Recovery Appearance Capacitance change Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : 1000 MΩ min. Appearance Capacitance change Dissipation factor Insulation resistance : : : : Class 1 High Frequency Type No abnormality Within ±12.5% 5.0% max. 50 MΩμF or 1000 MΩ, whichever is smaller. Maximum operating temperature 1000+48/-0 hrs Rated voltage×2 Note 4 Class 2 BJ, LD(※) C6 B7, C7 Voltage treatment(Twice the rated voltage shall be applied for 1 hour at 85℃, 105℃ or 125℃) Note 3, 4 Maximum operating temperature 1000+48/-0 hrs Rated voltage×2 Note 4 50mA max. 50mA max. 6 to 24hr (Standard condition) Note 5 24±2 hrs (Standard condition) Note 5 Standard Preconditioning Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : C<10pF: Q≧200+10C 10≦C<30pF:Q≧275+2.5C C≧30pF: Q≧350(C:Nominal capacitance) : 1000 MΩ min. None Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150+0/-10℃ for an hour and kept at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E08R01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. ◆Operating Voltage (Verification of Rated voltage) 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern configurations (Design of Land-patterns) 1. When capacitors are mounted on PCBs, the amount of solder used (size of fillet) can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: (1)Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. (2)When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern configurations (Capacitor layout on PCBs) After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.). For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. ◆Pattern configurations (Design of Land-patterns) The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. (1)Recommended land dimensions for typical chip capacitors Land patterns for PCBs ●Multilayer Ceramic Capacitors : Recommended land dimensions Land pattern (unit: mm) Solder-resist Wave-soldering Chip capacitor Type 107 212 316 325 L 1.6 2.0 3.2 3.2 C Size W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 B A B C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor W Technical considerations L Reflow-soldering Type 021 L 0.25 Size W 0.125 A 0.095~0.135 B 0.085~0.125 C 0.110~0.150 Note:Recommended land 042 0.4 0.2 0.15~0.25 0.10~0.20 0.15~0.30 size might be 063 105 107 212 316 0.6 1.0 1.6 2.0 3.2 0.3 0.5 0.8 1.25 1.6 0.20~0.30 0.45~0.55 0.6~0.8 0.8~1.2 1.8~2.5 0.20~0.30 0.40~0.50 0.6~0.8 0.8~1.2 1.0~1.5 0.25~0.40 0.45~0.55 0.6~0.8 0.9~1.6 1.2~2.0 different according to the allowance of the size of the product. ●LWDC: Recommended land dimensions (unit: mm) Type 105 107 L 0.52 0.8 Size W 1.0 1.6 A 0.18~0.22 0.25~0.3 B 0.2~0.25 0.3~0.4 C 0.9~1.1 1.5~1.7 for reflow-soldering 212 1.25 2.0 0.5~0.7 0.4~0.5 1.9~2.1 325 3.2 2.5 1.8~2.5 1.0~1.5 1.8~3.2 432 4.5 3.2 2.5~3.5 1.5~1.8 2.3~3.5 LWDC W L ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 (2)Examples of good and bad solder application Item Not recommended Lead wire of component Recommended Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded components near mounted components Solder-resist Solder-resist Horizontal component placement ◆Pattern configurations (Capacitor layout on PCBs) 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any stresses from board warp or deflection. Items Not recommended Recommended possible mechanical Place the product at a right angle to the direction of the anticipated mechanical stress. Deflection of board 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D Perforation C A B Slit Magnitude of stress A>B=C>D>E 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 ◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. (1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. (2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads. (3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Item Improper method Proper method Single-sided mounting chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking Technical considerations supporting pins or back-up pins 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. (1)Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. (2)The recommended amount of adhesives is as follows; After capacitor are bonded Amount adhesive [Recommended condition] a a Figure 212/316 case sizes as examples a 0.3mm min b b 100 to 120μm c Adhesives shall not contact land c c 4. Soldering Precautions ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; (1)Flux used shall be less than or equal to 0.1 wt%( in Cl equivalent) of halogenated content. Flux having a strong acidity content shall not be applied. (2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. (3)When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations ◆Selection of Flux 1-1. When too much halogenated substance(Chlorine, etc.) content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 ◆Soldering ・ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ・ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. ・ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 130℃. ・ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃. [Reflow soldering] 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 300 200 Peak 260℃ Max. Within 10sec. 230℃ Within 10sec. 60sec. 60sec Min. Min. Slow cooling 100 Temperature(℃) Temperature(℃) Preheating 0 200 Slow cooling 100 0 Preheating150℃ Heating above 230℃ 60sec. Min. 40sec. Max. 1/2T~1/3T Capacitor Caution ①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the thickness of a capacitor. ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. soldering for 2 times. [Wave soldering] 【Recommended conditions for eutectic soldering】 300 100 Temperature(℃) Temperature(℃) Slow cooling PC board Peak 260℃ Max. Within 10sec. 230~250℃ Within 3sec. 200 T 【Recommended condition for Pb-free soldering】 300 Preheating 120sec. Min. Solder 200 120sec. Min. Preheating 150℃ 100 Slow cooling 0 0 Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times. 【Recommended condition for Pb-free soldering】 400 400 300 200 Slow cooling 100 0 Preheating 60sec. Min. Temperature(℃) Temperature(℃) 300 ⊿T Slow cooling 200 Preheating 150℃ Min. 100 0 400 Peak 350℃ Max. Within 3sec. 230~280℃ Within 3sec. 316type or less 200 0 Slow cooling ⊿T Preheating 150℃ Min. 100 60sec. Min. ⊿T ⊿T≦150℃ Peak 280℃ Max. Within 3sec. 300 温度(℃) [Hand soldering] 【Recommended conditions for eutectic soldering】 60sec. Min. 325type or more ⊿T ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. soldering for 1 times. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 5. Cleaning Precautions Technical considerations ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. (e.g. to remove soldering flux or other materials from the production process.) 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance). 2. Inappropriate cleaning conditions( insufficient or excessive cleaning) may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ℓ or les Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Precautions ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. (1)If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. (2)Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. ※RCR-2335B(Safety Application Guide for fixed ceramic capacitors for use in electronic equipment)is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Taiyo Yuden: TMK316ABJ106KD-T LMK042B7101KC-FW LMK042B7101MC-FW LMK042B7102KC-FW LMK042B7102MC-FW LMK042B7151KC-FW LMK042B7151MC-FW LMK042B7221KC-FW LMK042B7221MC-FW LMK042B7331KC-FW LMK042B7331MC-FW LMK042B7471KC-FW LMK042B7471MC-FW LMK042B7681KC-FW LMK042B7681MC-FW LMK042BJ101KC-FW LMK042BJ102KC-FW LMK042BJ103KC-FW LMK042BJ103MC-FW LMK042BJ221KC-FW LMK042BJ471KC-FW LMK063BJ103KP-F LMK063BJ103MP-F LMK063BJ104KP-F LMK063BJ104MP-F LMK063BJ152KP-F LMK063BJ222KP-F LMK063BJ222MP-F LMK063BJ223KP-F LMK063BJ223MP-F LMK063BJ224MP-F LMK063BJ472KP-F LMK063BJ472MP-F LMK063BJ473KP-F LMK063C6273KP-F LMK063C6273MP-F LMK063C6473MP-F LMK105B7104KV-F LMK105B7223KV-F LMK105B7333KV-F LMK105B7473KV-F LMK105BJ104KC-F LMK105BJ104KV-F LMK105BJ104MV-F LMK105BJ105KV-F LMK105BJ105MV-F LMK105BJ224KV-F LMK105BJ225MV-F LMK105BJ474KV-F LMK105BJ683KV-F LMK105BJ683MV-F LMK105BJ823MV-F LMK105F223ZV-F LMK105F224ZV-F LMK105F473ZV-F LMK105SD332JV-F LMK105SD332KV-F LMK105SD392JV-F LMK105SD392KV-F LMK105SD472JV-F LMK105SD472KV-F LMK107B7105KA-T LMK107B7105MA-T LMK107B7154KA-T LMK107B7154MA-T LMK107B7224KA-T LMK107B7224MA-T LMK107B7225KA-T LMK107B7334KA-T LMK107B7334MA-T LMK107B7474KA-T LMK107B7474MA-T LMK107BJ105KA-T LMK107BJ105KK-T LMK107BJ105MA-T LMK107BJ105MK-T LMK107BJ106MALTD LMK107BJ225KA-T LMK107BJ225MA-T LMK107BJ335KA-T LMK107BJ475KA-T LMK107BJ684KA-T LMK107BJ684MA-T LMK107F105ZA-T LMK107F225ZA-T LMK107SD123JA-T LMK107SD123KA-T LMK107SD153JA-T LMK107SD153KA-T LMK107SD183JA-T LMK107SD183KA-T LMK107SD223JA-T LMK107SD223KA-T LMK212B7105KD-T LMK212B7105KG-T LMK212B7105MD-T LMK212B7105MG-T LMK212B7106KG-TD LMK212B7225KD-T LMK212B7225KG-T
EMK107BJ474MA-T
1. 物料型号:文档中列出了多种型号的陶瓷电容器,例如“TMK021 CG0100K-W”、“TMK042 CG010D-W”等,这些型号代表了不同尺寸、电容值和温度特性的产品。

2. 器件简介:文档是由TAIYO YUDEN公司发布的,介绍了他们的多层陶瓷电容器产品。这些产品具有不同的额定电压、温度特性、电容值和电容公差。

3. 引脚分配:文档中没有直接提到引脚分配,但是提到了电容器的端头处理,例如“K”代表镀层端头,“S”代表铜内部电极(用于高频)。

4. 参数特性:详细列出了电容器的各种参数,包括额定电压、温度特性、电容值、电容公差、尺寸公差、端头类型等。

5. 功能详解:文档中没有具体的功能详解,但是提到了电容器的应用范围和限制,例如适用于一般电子设备,不适用于需要极高安全性和可靠性的设备,如航空设备、医疗器械等。

6. 应用信息:强调了在实际应用中需要验证和确认产品在实际安装和操作环境中的性能,并指出了某些特定设备在使用这些电容器前需要联系TAIYO YUDEN获取更多信息。

7. 封装信息:提供了电容器的尺寸信息,包括长度、宽度和厚度,以及一些特殊封装的说明,如“LW reverse type”。
EMK107BJ474MA-T 价格&库存

很抱歉,暂时无法提供与“EMK107BJ474MA-T”相匹配的价格&库存,您可以联系我们找货

免费人工找货