26-May.-2015 Ver.1.41
EYSFCNZXX
TAIYO YUDEN
Bluetooth ® 4.0 Low Energy Module
Bluetooth® 4.0 Low Energy
EYSFCNZXX
Data Report
The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of
such marks by TAIYO YUDEN CO., LTD. is under license.
TAIYO YUDEN
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EYSFCNZXX
TAIYO YUDEN
Document constituent list
Control name
Control No.
General Items
Absolute maximum ratings
Electrical characteristics
Circuit schematic
Outline / Appearance
Pin Layout
Handling Precaution
Packaging Specification
Notes
HD-AG-A121277
HD-AM-A121277
HD-AE-A121277
HD-MC-A121277
HD-AD-A121277
HD-BA-A121277
HQ-BA-523
HD-BB-A121277
Document Page
1/4 - 4/4
1/1
1/5 - 5/5
1/2 - 2/2
1/3 - 3/3
1/2 - 2/2
1/2 - 2/2
1/3 - 3/3
1/1
Revision History
29-Aug.-2013 > Ver.0.01 Draft
18-Sep.-2013 > Ver.0.02 Draft
11-Nov.-2013 > Ver.0.03 Draft
29-Nov.-2013 > Ver.1.0 Release
09-Jan.-2014 > Ver.1.1 Update
03-Feb.-2014 > Ver.1.2 Update
04-Feb.-2014 > Ver.1.21 Update
18-Feb.-2014 > Ver.1.3 Update
24-Feb.-2014 > Ver.1.31 Update
10-Mar.-2014 > Ver.1.32 Update
19-May.-2015 > Ver.1.4 Update
26-May.-2015 > Ver.1.41 Update
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EYSFCNZXX
TAIYO YUDEN
Control No.
HD-AG-A121277
(1/4)
Control name
General Items
Scope
This specification (“Specification”) applies to the hybrid IC “EYSFCNZXX”, a Bluetooth® 4.0 Low
Energy module (“Product”) manufactured by TAIYO YUDEN Co., Ltd. (“TAIYO YUDEN”)
1. Model: EYSFCN
Version Code: EYSFCNZXX
Digit3: Customer Code
ex) S: TAIYO YUDEN Standard
Digit8: Firmware Code
ex) X: TAIYO YUDEN Standard
*Version Code may be changed for mass production or other cases.
2. Function:
Radio frequency module.
Bluetooth® standard Ver 4.0 Low Energy conformity
3. Application: Health & Fitness Equipment, Sensor, Toys
4. Structure:
Hybrid IC loaded with silicon monolithic semiconductor
Compatible with industrial standard reflow profile for Pb-free solders
+6
Can meet with RoHS compliance (Pb, Cd, Hg, Cr , PBB, PBDE)
5. Outline: 12.9x 9.6 x 2.0 mm
49-pin Land Grid Array
6. Marking: Part number, Lot number, Japan ID, FCC ID, IC ID
7. Features:
- Small outline by PCB substrate
- Low power consumption
- Integrated antenna
- Integrated system and sleep clock
- Bluetooth® 4.0 Low Energy conformity
- Slave Role
8. Packaging:
Packaging method: Tape & reel + aluminum moisture barrier bag
Packaging unit: 1000
*It might be provided as tray at sample stage.
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EYSFCNZXX
Control No.
HD-AG-A121277
TAIYO YUDEN
(2/4)
Control name
General Items
9. Note:
a. Any question arising from this Specification shall be solved through mutual discussion by the
parties hereof.
b. This Product is not designed to be radiation durable and should not be used under the
circumstance of radiation.
c. The operating conditions of this Product are as shown in this Specification. Please note that
TAIYO YUDEN shall not be liable for a failure and/or abnormality which is caused by use under
the conditions other than the operating conditions hereof.
d. The Product mentioned in this Specification is manufactured for use in Health & Fitness
Equipment, Sensor and Toys. Before using this Product in any special equipment (such as
medical equipment, space equipment, air craft, disaster prevention equipment), where higher
safety and reliability are duly required, the applicability and suitability of this Product must be
fully evaluated by the customer at its sole risk to ensure correct and safe operation of these
special equipments. Also, evaluation of the safety function of this Product even for use in
general electronics equipment shall be thoroughly made and when necessary, a protective
circuit shall be added during the design stage, all at the customer’s sole risk.
e. i) You are requested to fully check and confirm by the start of mass production of this Product
that (1) no bug, defect or other failure is included in firmware incorporated in this Product
(“Incorporated Software”), (2) no bug defect or other failure arising from installation of this
Product in which is contained Incorporated Software into your products is included in
Incorporated Software, and that Incorporated Software fully meets your intended use, although
TAIYO YUDEN sufficiently inspects or verifies quality of Incorporated Software.
ii) Please note that TAIYO YUDEN is not responsible for any failure arising out of bugs or
defects in Incorporated Software.
f. TAIYO YUDEN warrants only that this Product is in conformity with this Specification for one
year after purchase and shall in no event give any other warranty.
g. Communication between this Product and others might not be established nor maintained
depending on radio environment or operating conditions of this Product and other Bluetooth®
products.
h. In order to test for Radio Law certification with a device incorporating this module, the Host
Software must be able to put the module into test mode. Please contact TAIYO YUDEN for
further details.
i. This Product operates in the unlicensed ISM band at 2.4GHz. In case this Product is used
around the other wireless devices which operate in same frequency band of this Product, there
is a possibility that interference may occur between this Product and such other devices. If
such interference occurs, please stop the operation of other devices or relocate this Product
before using this Product or do not use this Product around the other wireless devices.
j. Please thoroughly evaluate our module with your products before going mass production.
k. User Code Modification Notice.
User Code for sample modules or part numbers in this Specification are TAIYO YUDEN
standard part numbers. When any modification is made to a module to meet requested
specifications, the part number will be changed. Please contact TAIYO YUDEN to confirm
whether your part number needs to be modified.
Please see the following examples for cases when part numbers are modified:
- for specific firmware version (our standard item firmware will be upgraded occasionally)
- for other relevant cases (specific or different setting, form, sizes, or display etc..)
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EYSFCNZXX
Control No.
HD-AG-A121277
TAIYO YUDEN
(3/4)
Control name
General Items
l. Alternative components may used to this module. The intended components is used within the
warranty written in this document (characteristics, size, operating condition, reliability, public
regulation such as radio type approval) and Taiyo Yuden confirmed there are not any
problems with the replacement. The traceability of the components is secured each production
lot.
m. Caution for Export Control
This Product may be subject to governmental approvals, consents, licenses, authorizations,
declarations, filings, and registrations for export or re-export of the Product, required by
Japanese Foreign Exchange and Foreign Trade Law (including related laws and regulations)
and/or any other country’s applicable laws or regulations related to export control.
If you plan to export or re-export this Product, it is strongly recommended that you check and
confirm, the necessary procedures to export or re-export of this Product as required by
applicable laws and regulations, and if necessary, you have to obtain necessary and
appropriate approvals or licenses from governmental authority at your own risk and expense.
n. Japan Regulatory Information
This module is approved with the specific antenna on this module.
Please ensure that the sentence below is clearly stated on your product or product manual.
This product has a radio system which was approved as a radio station in a low power data
communication system based on the Radio Law and the Telecommunication Business Law.
Name of the radio system: 001-A01718
o. Canada Regulatory Information
a) This device complies with Industry Canada license-exempt RSS standards.
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that
may cause undesired operation of the device.
L'utilisation de ce dispositif est autorisée seulement aux conditions suivantes: (1) il ne doit
pas produire de brouillage et (2) l'utilisateur du dispositif doit être prêt à accepter tout
brouillage radioélectrique reçu, même si ce brouillage est susceptible de compromettre le
fonctionnement du dispositif.
b) This product is certified as type of the portable device with Industry Canada.
c) Please ensure that one of the following is clearly stated on your product.
-Contains Transmitter module IC : 4389B-EYSFCN
-Contains IC : 4389B-EYSFCN
p. FCC Regulatory Information
a) This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
b) Please ensure that one of the following is clearly stated on your product.
-Contains Transmitter Module FCC ID: RYYEYSFCN
-Contains FCC ID: RYYEYSFCN
c) CAUTION: changes or modifications not expressly approved by the party responsible for
compliance could void the use’s authority to operate the equipment
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EYSFCNZXX
Control No.
HD-AG-A121277
TAIYO YUDEN
(4/4)
Control name
General Items
d) This product is certified as type of the portable device with FCC.
q. This Product is designed for use in products which comply with Bluetooth® Specifications
(Ver 4.0 LE) (“Bluetooth Specifications”). TAIYO YUDEN disclaims and is not responsible
for any liability concerning infringement by this Product under any intellectual property right
owned by third party in case the customer uses this Product in any product which does not
comply with Bluetooth Specifications (the “non-complying products”). Furthermore, TAIYO
YUDEN warrants only that this Product complies with this Specification and does not grant
any other warranty including warranty for application of the non-complying products.
This module is still under development, thus specifications do not guarantee both the quality
and reliability at the time of shipment. Since the specifications and mass production of the
module are not confirmed either, the contents of the technical notes are subject to change
without any prior notice.
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TAIYO YUDEN
Control No.
HD-AM-A121277
(1/1)
Control name
Absolute maximum ratings
Absolute maximum ratings
Symbol
Parameter
VCC_NRF
Min.
Max.
Units
-0.3
+3.6
V
0
V
GND
VIO
-0.3
VCC_NRF+ 0.3
V
Storage temperature
-40
+85
Deg-C
1
kV
100
V
MSL
Moisture Sensitivity Level
2
ESD HBM
Human Body Model
ESD CDM
Charged Device Model
Endurance
Flash Memory Endurance
20000
Retention
Flash Memory Retention
10 years
write/erase
cycles
At 40 deg-C
Number of times an
address can be written
2
times
between erase cycles
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EYSFCNZXX
TAIYO YUDEN
Control No.
HD-AE-A121277
(1/5)
Control name
Electrical characteristics
Electrical characteristics
Recommendation operating range
Symbol
Parameter
VCC_NRF
Min.
Typ.
Max.
Units
1.8
3.0
3.6
V
2.1
3.0
3.6
V
60
ms
75
Deg-C
Supply voltage, normal mode
Supply voltage, normal mode,
VCC_NRF
DC/DC converter output voltage 1.9 V
tR_VCC_NRF
Supply rise time (0V to 1.8V)
TA
Operation temperature
-25
25
The on-chip power-on reset circuitry may not function properly for rise times outside the specified
interval.
DC Specifications
The Specification applies for Topr.= 25 degrees C, VCC_NRF = 3.0V
Symbol
Parameter (condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.7 VCC_NRF
VCC_NRF
V
VIL
Input low voltage
GND
0.3 VCC_NRF
V
VOH
Output high voltage (std. drive, 0.5 mA)
VCC_NRF-0.3
VCC_NRF
V
VOH
Output high voltage (high-drive, 5 mA)
VCC_NRF-0.3
VCC_NRF
V
VOL
Output low voltage (std. drive, 0.5 mA)
GND
0.3
V
VOL
Output low voltage (high-drive, 5 mA)
GND
0.3
V
RPU
Pull-up resistance
11
13
16
kohm
RPD
Pull-down resistance
11
13
16
kohm
ITX,+4dBm
TX only run current @ POUT =+4 dBm
16
mA
ITX,0dBm
TX only run current @ POUT = 0 dBm
10.5
mA
IRX
RX only run current
13
mA
0.4
uA
0.6
uA
2.3
uA
IOFF
IOFF,8k
ION
Current in SYSTEM-OFF, no RAM
retention
Current in SYSTEM-OFF
mode 8 kB SRAM retention
SYSTEM-ON base current
Internal DC/DC converter operation is not recommended due to long startup time.
Please refer to chapter 11 on "nRF51 Series Reference Manual v2.1" by Nordic Semiconductor for more
information regarding DC/DC converter characteristics.
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EYSFCNZXX
Control No.
HD-AE-A121277
TAIYO YUDEN
(2/5)
Control name
Electrical characteristics
UART specifications
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EYSFCNZXX
Control No.
HD-AE-A121277
TAIYO YUDEN
(3/5)
Control name
Electrical characteristics
SPI specifications
TAIYO YUDEN
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EYSFCNZXX
Control No.
HD-AE-A121277
TAIYO YUDEN
(4/5)
Control name
Electrical characteristics
TWI specifications
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EYSFCNZXX
TAIYO YUDEN
Control No.
HD-AE-A121277
(5/5)
Control name
Electrical characteristics
GPIOTE specifications
RF Specifications
Symbol
Description
Min.
Typ.
Fop
Operating frequencies
2402
PLLres
PLL programming resolution
Df
Frequency deviation
PRF
Maximum output power
PRFC
RF power control range
PRFCR
RF power accuracy
PWHISP
RF power whisper mode
-30
PBW
20 dB bandwidth for modulated carrier
950
PRF1
Max.
Units
2480
MHz
1
+/-225
20
+/-250
MHz
+/-275
kHz
4
dBm
24
dB
+/-4
dB
dBm
1100
kHz
1st Adjacent Channel Transmit Power 1 MHz
-20
dBc
PRF2
2nd Adjacent Channel Transmit Power 2 MHz
-40
dBc
PRXMAX
Maximum received signal strength at < 0.1% PER
0
dBm
PSENS IT
Receiver sensitivity (0.1% BER) Ideal transmitter
-93
dBm
PSENS DT
Receiver sensitivity (0.1% BER) dirty transmitter
-91
dBm
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EYSFCNZXX
TAIYO YUDEN
Control No.
HD-MC-A121277
(1/2)
Control name
Circuit Schematic
Block Diagram
DCC
AVDD
DC/DC LC filter
OUT_ANT
OUT_MOD
VCC_NRF
SWDCLK
SWDIO
nRF51822
QFN48
Filter
P0.00 to P0.25
P0.28 to P0.30
X'tal
32MHz
X'tal
32.768KHz
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EYSFCNZXX
Control No.
HD-MC-A121277
TAIYO YUDEN
(2/2)
Control name
Circuit Schematic
Sample circuits
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EYSFCNZXX
Control No.
HD-AD-A121277
TAIYO YUDEN
(1/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit : (mm)
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EYSFCNZXX
Control No.
HD-AD-A121277
TAIYO YUDEN
(2/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit: mm
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EYSFCNZXX
Control No.
HD-AD-A121277
TAIYO YUDEN
(3/3)
Control name
Outline/Appearance
LAND PATTERN EXAMPLE
Recommended metal mask for solder printing
Pad size
Mask opening
Signal pad 43 – 0.6 x 1.0 mm
0.5 x 0.9 mm
Corner pad 4 – 1.5 x 1.0 mm
1.0 x 0.7 mm
Center pad 2 – 3.0 x 3.4 mm
2.6 x 3.0 mm
The center of each mask opening is same as the pad center.
The metal mask thickness: t=0.1mm
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EYSFCNZXX
TAIYO YUDEN
Control No.
HD-BA-A121277
(1/2)
Control name
Pin Layout
Pin Descriptions
Pin
Pin name
Description
DCC
Pin
function
Power
1
2
AVDD
Power
Analog Power supply
3
GND
Ground
Ground (0 V)
4
VCC_NRF
Power
Power supply
5
GND
Ground
Ground (0 V)
6
P0.00
AREF0
Digital I/O
General purpose I/O pin
Analog input ADC Reference voltage
7
P0.01
AIN2
Digital I/O
General purpose I/O pin
Analog input ADC input 2
8
P0.02
AIN3
Digital I/O
General purpose I/O pin
Analog input ADC input 3
9
P0.06
AIN7
AREF1
Digital I/O
General purpose I/O pin
Analog input ADC input 7
Analog input ADC Reference voltage
10
P0.05
AIN6
Digital I/O
General purpose I/O pin
Analog input ADC input 6
11
P0.04
AIN5
Digital I/O
General purpose I/O pin
Analog input ADC input 5
12
P0.03
AIN4
Digital I/O
General purpose I/O pin
Analog input ADC input 4
13
GND
Ground
Ground (0 V)
14
SWDIO
Digital I/O
System reset (active low). Also HW debug and flash programming
I/O
15
SWDCLK
Digital input
HW debug and flash programming I/O
16
P0.17
Digital I/O
General purpose I/O pin
17
P0.19
Digital I/O
General purpose I/O pin
18
P0.21
Digital I/O
General purpose I/O pin
19
P0.23
Digital I/O
General purpose I/O pin
20
P0.25
Digital I/O
General purpose I/O pin
21
GND
Ground
Ground (0 V)
22
OUT_MOD RF In/Out
DC/DC output (built-in LC for DC/DC)
RF I/O pin. It should be connected to Pin 23 OUT_ANT for normal
operation.
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EYSFCNZXX
Control No.
HD-BA-A121277
Pin
TAIYO YUDEN
(2/2)
Control name
Pin Layout
Pin name Pin
function
Description
23
OUT_AN
T
Antenna
In/Out
Internal antenna. It should be connected to Pin 22 OUT_MOD for
normal operation.
24
P0.28
Digital I/O
General purpose I/O pin
25
P0.29
Digital I/O
General purpose I/O pin
26
P0.30
Digital I/O
General purpose I/O pin
27
P0.07
Digital I/O
General purpose I/O pin
28
P0.11
Digital I/O
General purpose I/O pin
29
P0.10
Digital I/O
General purpose I/O pin
30
P0.09
Digital I/O
General purpose I/O pin
31
P0.08
Digital I/O
General purpose I/O pin
32
P0.12
Digital I/O
General purpose I/O pin
33
P0.13
Digital I/O
General purpose I/O pin
34
P0.14
Digital I/O
General purpose I/O pin
35
P0.15
Digital I/O
General purpose I/O pin
36
P0.16
Digital I/O
General purpose I/O pin
37
P0.18
Digital I/O
General purpose I/O pin
38
P0.20
Digital I/O
General purpose I/O pin
39
P0.22
Digital I/O
General purpose I/O pin
40
P0.24
Digital I/O
General purpose I/O pin
41 to 45
GND
Ground
Ground (0 V)
46
NC
Not
Connected
Isolated pad on PCB for mechanical stability
47 to 48
GND
Ground
Ground (0 V)
49
NC
Not
Connected
Isolated pad on PCB for mechanical stability
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EYSFCNZXX
TAIYO YUDEN
Control No.
Control name
HQ-BA-523
(1/2)
Handling Precaution
This specification describes desire and conditions especially for mounting.
Desire/Conditions
(1)
Environment conditions for use and storage
%RH if they are in a moisture
1. Store the components in an environment of < 40deg-C/90%
barrier bag packed by TAIYO YUDEN.
2. Keep the factory ambient conditions at < 30deg-C/60%
%RH .
3. Store the components in an environment of < 25±5deg-C/10%RH after the bag is opened.
(The condition is also applied to a stay in the manufacture process).
(2)
Conditions for handling of products
Make sure all of the moisture barrier bags have no holes, cracks or damages at receiving. If
an abnormality is found on the bag, its moisture level must be checked in accordance with 2
in (2).
Refer to the label on the bag.
1. All of the surface mounting process (reflow process) must be completed in 12 months
from the bag sea date.
2. Make sure humidity in the bag is less than 10%RH immediately after open, using a
humidity indicator card sealed with the components.
3. All of the surface mounting process (reflow process including rework process) must be
completed in 168 hours after the bag is opened (inclusive of any other processes).
4. If any conditions in (1) or condition 2 and 3 in (2) are not met, bake the components in
accordance with the conditions at 125deg-C 24hours
5. As a rule, baking the components in accordance with conditions 4 in (2) shall be once.
6. Since semi-conductors are inside of the components, they must be free from static
electricity while handled.(CONFIG = NVMC_CONFIG_WEN_Wen READY == NVMC_READY_READY_Busy){}
*(uint32_t *)0x10001008 = 0xFFFFFF00;
NRF_NVMC->CONFIG = NVMC_CONFIG_WEN_Ren READY == NVMC_READY_READY_Busy){}
NVIC_SystemReset();
while (true){}
}
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