for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for General Electronic Equipment
MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER
MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER
REFLOW
■PARTS NUMBER
F
Q
①
△
②
1
0 5
③
①Series name
Code
FI
FQ
P
④
0
8
2
9
D
⑤
Z
-
⑥
T
⑤Frequency
Code
(example)
2450
0620
Series name
High frequency devices
High frequency devices – Fine Line
②Electrode code
Code
△
△=Blank space
⑦
Frequency[MHz]
2400~2500
470~770
⑥Spec code
Code
01~
Spec code
Individual spec
③Dimensions
Code
212
168
105
Dimensions[mm]
2.0×1.25
1.6×0.8
1.0×0.5
⑦Packaging
Code
-T
Packaging
Taping
④Special code
Code
B
L
H
D
C
P
W
K
Special code
Band pass type
Low pass type
High pass type
Dual type
Balance type
Diplexer
2 Branch Coupler
Coupler
HIGH FREQUENCY
PRODUCTS
Electrode code
With plating
■EXTERNAL DIMENSIONS / STANDARD QUANTITY
FI 105B/L Side 4Pins type
A max.
OUT
GND
GND
OUT
IN
0.30±0.10
IN
0.4max.
1.00±0.05
GND
0.10±0.05
0.30±0.20
GND
1.25±0.15
OUT
IN
1.6±0.10
GND
1.25±0.15
(1) (2) (3)
GND
FI 168B/L Side 4Pins type
0.65max.
0.30±0.10
2.0±0.15
0.50±0.05
FI 212B LGA 3Pins type
0.9±0.10
0.80±0.10
FI 212B Side 4Pins type
2.0±0.15
0.70±0.10
0.687 0.687
(1) (2) (3)
0.275±0.10
(1) (2) (3)
(1) (2) (3)
0.60±0.10 0.60±0.10
(1) (2) (3)
(4)
(1) (2) (3)
0.30±0.20
(8)
1.6±0.10
0.7max.
(7) (6) (5)
FI 168P Side 4Pins type
0.65max.
(6) (5) (4)
(1) (2) (3)
1.6±0.10
0.65 max.
(1)
(4)
(2)
(3)
0.65±0.20
0.2±0.1
0.3±0.20
0.3±0.20
FI 168P Side 6Pins type
0.15±0.10
0.65±0.20
2.0±0.15
1.25±0.15
(1) (2) (3)
0.2±0.15
FI 212C245075
0.30±0.20
(4)
1.25±0.15
(7) (6) (5)
(1) (2) (3)
0.30±0.10
FI 212C245036
0.9±0.10
(4)
0.65±0.20
0.50±0.15
0.40±0.10
2.0±0.15
(8)
0.30±0.10
0.30±0.10
0.2±0.10
0.9±0.10
(7) (6) (5)
0.70±0.10
0.50±0.15
(8)
(6) (5) (4)
FI 212C245033
2.0±0.15
0.45max.
0.80±0.10
(6) (5) (4)
1.6±0.10
0.80±0.10
0.80±0.10
(1) (2) (3)
FI 168D type
0.65max.
0.30±0.20
1.6±0.10
1.25±0.15
FI 168L/H LGA 3Pins type
0.65max.
0.30±0.10
0.80±0.10
FI 168L0628M4
1.6±0.10
0.10±0.05
0.7±0.10
0.60±0.10
1.6±0.20
A
0.5
0.45
0.80±0.10
0.275±0.10
FI 168B
FI 168L
0.50±0.15
0.3±0.10
0.3±0.20
0.15±0.10
Unit:mm
chipfilter_e-E09R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
95
for General Electronic Equipment
0.9±0.10
FI 212P1700CL
1.0 max
(1) (2) (3)
(1) (2) (3)
(6) (5) (4)
(6) (5) (4)
0.65±0.10
FQ 105P0829DZ
0.7 max
(1) (2) (3)
1.25±0.15
1.25±0.15
(6) (5) (4)
2.0±0.15
1.0±0.1
0.4 max
(6) (5) (4)
1.25±0.15
2.0±0.15
2.0±0.15
(1) (2) (3)
0.50±0.10
FI 212P0829G2
FI 212P1955EN
FI 212P Side 6Pins type
0.65±0.10
0.65±0.20
0.30±0.10
(6) (5) (4)
(1) (2) (3)
0.3±0.20
0.05typ
FI 168W type
(2)
(3)
(6)
(5)
(4)
0.18±0.10
0.15±0.10
0.125±0.10
0.18±0.10
0.65max.
(1) (2) (3)
0.80±0.10
(1) (2) (3)
1.6±0.10
(6) (5) (4)
0.20±0.15
(4)
(8)
0.05typ
(1)
FI168K type
0.5max.
0.80±0.10
1.6±0.10
0.30±0.10
0.3±0.10
0.3±0.10
(7) (6) (5)
(6) (5) (4)
(1) (2) (3)
0.50±0.15
0.20±0.15
0.50±0.15
0.2±0.15
Unit:mm
HIGH FREQUENCY
PRODUCTS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
FI 212B LGA 3Pins
type
RF IN/OUT
GND
RF IN/OUT
-
FI 168P157519
FI 168L0628M4
I/O Port
GND
I/O Port
GND
GND
GND
-
FI 168P157525
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
GND
High Band
Common
Low Band
-
GND
Low Band
Common
High Band
-
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
FI 168W type
RF1 IN/OUT
CPL2 RF1
CPL2 RF2
GND
RF2 OUT/IN
CPL1 RF2
CPL1 RF1
GND
FI 168K type
COUPLING
GND
ISOLATION
RF OUT
GND
RF IN
-
Type
212
168
105
FI 168L/H LGA 3Pins
type
RF IN/OUT
GND
RF IN/OUT
FI 212P082931
FI 212P082934
FI 212P089208
FI 212P085912
Low Band
GND
High Band
GND
Common Port
GND
-
FI 168D087018
High Band IN
GND
Low Band IN
Low Band OUT
GND
High Band OUT
FI 212P082935
FI 212P089213
FI 212P085909
High Band
GND
Low Band
GND
Common Port
GND
-
FI 212C2450**
Balanced
GND
Balanced
GND
Unbalance
DC
NC
GND
FQ105P0829GZ
FI 212P0829G2
FI 212P1700CL
Low Band
GND
High Band
GND
Common Port
GND
-
FI 168P245030
GND
Common
GND
Low Band
GND
High Band
-
FI 212P1955EN
GND
Common Port
GND
High Band
GND
Low Band
Standard quantity[pcs]
3000~6000
4000~8000
10000
chipfilter_e-E09R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
96
21
for General Electronic Equipment
■PARTS NUMBER
●Multilayer device band pass type
Applications
2.4GHz W-LAN / Bluetooth ®
5G NR Sub 6
●Multilayer device low pass type
Applications
Digtal TV
2.4GHz W-LAN / Bluetooth ®
Cellular
●Multilayer device high pass type
Applications
Cellular
Applications
Other
●Multilayer device balance type
Applications
Bluetooth ®
Cellular
4G , 5G NR
GPS / 2.4GHz W-LAN
●Multilayer coupler
Applications
Cellular
Part number
FI 212B245026
FI 212B245027
FI 168B245001
FI 105B245024
FI 212B3750EQ
FI 212B4700DQ
Notes
Side 4Pins
Side 4Pins
Side 4Pins
Side 4Pins
LGA 3Pins
LGA 3Pins
External dimensions [mm]
1.6×0.8×0.45max.
1.0×0.5×0.4max.
1.0×0.5×0.4max.
1.0×0.5×0.4max.
1.6×0.8×0.65max.
1.6×0.8×0.65max.
1.6×0.8×0.65max.
Part number
FI 168L062005
FI 105L250014
FI 105L186822
FI 105L087038
FI 168L0628M4
FI 168L2200G9
FI 168L1681G6
Notes
Side 4Pins
Side 4Pins
Side 4Pins
Side 4Pins
Side 6Pins
LGA 3Pins
LGA 3Pins
External dimensions [mm]
1.6×0.8×0.65max.
Part number
FI 168H2593GG
Notes
LGA 3Pins
External dimensions [mm]
1.6×0.8×0.45max.
Part number
FI 168D087018
Notes
Dual band LPF
External dimensions [mm]
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×0.7max.
Part number
FI 212C245033
FI 212C245036
FI 212C245075
Notes
Conjugated match to CSR BC3
Conjugated match to CSR BC5
Conjugated match to CSR BC5FM, BC6ROM
External dimensions [mm]
1.6×0.8×0.65max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
2.0×1.25×1.0max.
1.0×0.5×0.4max.
2.0×1.25×1.0max.
2.0×1.25×0.7max.
1.6×0.8×0.65max.
1.6×0.8×0.65max.
Part number
FI 168P245030
FI 212P082931
FI 212P0829G2
FI 212P082934
FI 212P082935
FI 212P089208
FI 212P089213
FI 212P085909
FI 212P085912
FQ 105P0829DZ
FI 212P1955EN
FI 212P1700CL
FI 168P157519
FI 168P157525
Notes
Side 6Pins
Side 6Pins
LGA 6Pin
Side 6Pins
Side 6Pins
Side 6Pins
Side 6Pins
Side 6Pins
Side 6Pins
LGA 6Pin
LGA 6Pin
LGA 6Pin
Side 4Pins
Side 4Pins
External dimensions [mm]
1.6×0.8×0.5max.
1.6×0.8×0.5max.
Part number
FI 168W1697B1
FI 168K1687AA
Notes
Side 8Pins
Side 6Pins
HIGH FREQUENCY
PRODUCTS
●Multilayer diplexer
Applications
W-LAN
External dimensions [mm]
2.0×1.25×1.0max.
2.0×1.25×1.0max.
1.6×0.8×0.5max.
1.0×0.5×0.4max.
2.0×1.25×0.65max.
2.0×1.25×0.65max.
chipfilter_e-E09R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
97
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 212B245026
Pass band frequency
Insertion loss at pass band
Ripple at pass band
V.S.W.R. at pass band
Attenuation
Impedance
2400 - 2500 MHz
2.6 dB max. (+25℃)
2.9 dB max. (-40~+85℃)
1.0 dB max.
2.0 max.
40 dB min. (800 - 960 MHz)
30 dB min. (1710 - 1990 MHz)
25 dB min. (2110 - 2170 MHz)
30 dB min. (4800 - 5000 MHz)
30 dB min. (7200 - 7500 MHz)
50 Ω
FI 212B245027
Pass band frequency
Insertion loss at pass band
Ripple at pass band
V.S.W.R. at pass band
Attenuation
2400 - 2500 MHz
1.4 dB max. (+25℃)
1.7 dB max. (-40~+85℃)
1.0 dB max.
2.0 max.
30 dB min. (800 - 915 MHz)
30 dB min. (1710 - 1910 MHz)
6 dB min. (2110 - 2170 MHz)
20 dB min. (4800 - 5000 MHz)
FI 168B245001
Pass band frequency
Insertion loss at pass band
HIGH FREQUENCY
PRODUCTS
Ripple at pass band
V.S.W.R. at pass band
Attenuation
Impedance
2400 - 2500 MHz
2.2 dB max. (+25℃)
2.5 dB max. (-30~+85℃)
1.0 dB max.
2.1 max.
25 dB min. (800 - 960 MHz)
25 dB min. (1710 - 1910 MHz)
20 dB min. (4800 - 5000 MHz)
20 dB min. (7200 - 7500 MHz)
50 Ω
FI 105B245024
Pass band frequency
Insertion loss at pass band
Ripple at pass band
V.S.W.R. at pass band
Attenuation
2400 - 2500 MHz
3.0 dB max. (+25℃)
3.3 dB max. (-40~+85℃)
1.0 dB max.
2.2 max.
25 dB min. (800 - 960 MHz)
22 dB min. (1710 - 1910 MHz)
20 dB min. (4800 - 5000 MHz)
20 dB min. (7200 - 7500 MHz)
FI 212B3750EQ
Pass band frequency
Impedance
3300 - 4200 MHz
50 Ω
FI 212B4700DQ
Pass band frequency
Impedance
4400 - 5000 MHz
50 Ω
FI 168L062005
Pass band frequency
Insertion loss at 470 - 600 MHz
Insertion loss at 600 - 710 MHz
Insertion loss at 710 - 770 MHz
Ripple at 470 - 710 MHz
V.S.W.R.
Attenuation
Impedance
470 - 770 MHz
1.2 dB max. (+25℃)
1.3 dB max. (-30~+85℃)
2.2 dB max. (+25℃)
2.4 dB max. (-30~+85℃)
4.0 dB max. (+25℃)
4.4 dB max. (-30~+85℃)
1.4 dB max.
2.0 max. (470 - 710 MHz)
2.5 max. (710 - 770 MHz)
25 dB min. (888 - 925 MHz) (+25℃)
21 dB min. (888 - 925 MHz) (-30~+85℃)
25 dB min. (940 - 960 MHz)
27 dB min. (1429 - 1453 MHz)
26 dB min. (1920 - 1980 MHz)
26 dB min. (2400 - 2500 MHz)
50 Ω
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
98
21
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 105L250014
Pass band frequency
Insertion loss at 2400 - 2500 MHz
V.S.W.R. at 2400 - 2500 MHz
Attenuation
Impedance
2400 - 2500 MHz
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
1.7 max.
21 dB min. (4800 - 5000 MHz)
21 dB min. (7200 - 7500 MHz)
50 Ω
FI 105L186822
Impedance
824 - 915 MHz
0.75 dB max. (-30~+85℃)
1.5 max.
23 dB min. (1648 - 1830 MHz)
23 dB min. (2472 - 2745 MHz)
50 Ω
0
S11
-10
Attenuation[dB]
Pass band frequency
Insertion loss at 824 - 915 MHz
V.S.W.R. at 2400 - 2500 MHz
Attenuation
S21
-20
-30
-40
-50
-60
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Frequency[GHz]
FI 105L087038
Impedance
824 - 915 MHz
0.75 dB max. (-30~+85℃)
1.5 max.
23 dB min. (1648 - 1830 MHz)
23 dB min. (2472 - 2745 MHz)
50 Ω
HIGH FREQUENCY
PRODUCTS
Pass band frequency
Insertion loss at 824 - 915 MHz
V.S.W.R. at 2400 - 2500 MHz
Attenuation
FI 168L0628M4
Ripple at pass band
V.S.W.R. at pass band
Attenuation
Impedance
470 - 787 MHz
0.5 dB max. (+25℃)
0.6 dB max. (-40~+90℃)
2.0 max.
26 dB min. (1429 - 1501 MHz)
30 dB min. (1565 - 1607 MHz)
35 dB min. (1570 - 1580 MHz)
18 dB min. (1920 - 1980 MHz)
0
‐10
Attenuation [dB]
Pass band frequency
Insertion loss at pass band
‐20
‐30
S11
‐40
S21
‐50
‐60
50 Ω
0.4
0.8
1.2
1.6
2.0
Frequency [GHz]
2.4
2.8
FI 168L2200G9
Pass band frequency
Insertion loss at 1700 - 2170 MHz
Insertion loss at 2170 - 2500 MHz
Insertion loss at 2500 - 2700 MHz
Return loss. at 1700 - 2700 MHz
Attenuation
Impedance
1700 - 2170 MHz
2170 - 2500 MHz
2500 - 2700 MHz
0.5 dB max. (+25℃)
0.55 dB max. (-30~+85℃)
0.65 dB max. (+25℃)
0.75 dB max. (-30~+85℃)
0.9 dB max. (+25℃)
1.0 dB max. (-30~+85℃)
10 dB min.
25 dB min. (3400 MHz)
22 dB min. (3400 - 5400 MHz)
20 dB min. (5400 - 8100 MHz)
50 Ω
FI 168L1681G6
Return loss. at 617 - 2690 MHz
Attenuation
Impedance
617 - 2690 MHz
0.5 dB max. (-40~+90℃)
10 dB min.
35 dB min. (4950 - 6000 MHz)
35 dB min. (6000 - 7500 MHz)
35 dB min. (7500 - 8100 MHz)
35 dB min. (8100 - 10500 MHz)
27 dB min. (10500 - 12500 MHz)
50 Ω
0
S11
-10
S21
Attenuation[dB]
Pass band frequency
-20
-30
-40
-50
-60
0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 11.5 12.5
Frequency[GHz]
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
99
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 168H2593GG
2496 - 2690 MHz
0.9 dB max. (-40~+90℃)
15 dB min.
25 dB min. (1710 - 1995 MHz)
50 Ω
0
-10
Attenuation[dB]
Pass band frequency
Insertion loss at 2500 - 2700 MHz
Return loss. at 1700 - 2700 MHz
Attenuation
Impedance
-20
-30
S11
-40
S21
-50
0.5
1.5
2.5
3.5
4.5
5.5
6.5
Frequency[GHz]
FI 168D087018
Low band
Pass band frequency
Insertion loss at 824 - 915 MHz
V.S.W.R. at 824 - 915 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 1710 - 1910 MHz
V.S.W.R. at 824 - 915 MHz
Attenuation
Impedance
Isolation
In to In/Out to Out
HIGH FREQUENCY
PRODUCTS
In to Out
824 - 915 MHz
0.6 dB max. (-30~+85℃)
1.5 max.
25 dB min. (1648 - 1830 MHz)
25 dB min. (2472 - 2745 MHz)
50 Ω
1710 - 1910 MHz
0.6 dB max. (-30~+85℃)
1.5 max.
25 dB min. (3420 - 3820 MHz)
25 dB min. (5130 - 5730 MHz)
50 Ω
27
30
30
30
dB
dB
dB
dB
min.
min.
min.
min.
(824 - 915 MHz)
(1710 - 1910 MHz)
(824 - 915 MHz)
(1710 - 1910 MHz)
FI 212C245033
Pass band frequency
Insertion loss at pass band
Ripple at pass band
Unbalanced port V.S.W.R. at pass band
Balanced port V.S.W.R. at pass band
Amplitude Imbalance at pass band
Phase Imbalance at pass band
Attenuation
Unbalanced port Impedance
Balanced port Impedance
2400 - 2500 MHz
2.7 dB (+25℃)
3.0 dB (-30~+85℃)
1.0 dB max.
2.0 max.
2.0 max.
2.0 dB max.
180 ±10℃
25 dB min. (880 - 960 MHz)
15 dB min. (1710 - 1990 MHz)
15 dB min. (1990 - 2170 MHz)
15 dB min. (4800 - 5000 MHz)
50 Ω
Conjugated match to CSR BC3
FI 212C245036
Pass band frequency
Insertion loss at pass band
Ripple at pass band
Unbalanced port V.S.W.R. at pass band
Balanced port V.S.W.R. at pass band
Amplitude Imbalance at pass band
Phase Imbalance at pass band
Attenuation
Unbalanced port Impedance
Balanced port Impedance
2400 - 2500 MHz
3.7 dB (+25℃)
4.0 dB (-30~+85℃)
1.0 dB max.
2.0 max.
2.0 max.
2.0 dB max.
180 ±10℃
35 dB min. (880 - 960 MHz)
20 dB min. (1710 - 1990 MHz)
15 dB min. (1990 - 2170 MHz)
20 dB min. (4800 - 5000 MHz)
50 Ω
Conjugated match to CSR BC5
FI 212C245075
Pass band frequency
Insertion loss at pass band
Ripple at pass band
Unbalanced port V.S.W.R. at pass band
Balanced port V.S.W.R. at pass band
Amplitude Imbalance at pass band
Phase Imbalance at pass band
Attenuation
Unbalanced port Impedance
Balanced port Impedance
2400 - 2500 MHz
3.7 dB (+25℃)
4.0 dB (-30~+85℃)
1.0 dB max.
2.2 max.
2.2 max.
2.0 dB max.
180 ±10℃
40 dB min. (880 - 960 MHz)
18 dB min. (1710 - 1990 MHz)
12 dB min. (1990 - 2170 MHz)
30 dB min. (4800 - 5000 MHz)
50 Ω
Conjugated match to CSR BC5FM, BC6ROM
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
100
21
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 168P245030
Impedance
High band
Pass band frequency
Insertion loss at Pass band
V.S.W.R. at Pass band
Attenuation
Impedance
1558 - 1610 MHz
2400 - 2500 MHz
0.50 dB max.
0.60 dB max.
2.0 dB max.
24 dB min. (4800 - 4900 MHz)
26 dB min. (4900 - 6000 MHz)
50Ω
0
Attenuation/Return Loss [dB]
Low band
Pass band frequency 1
Pass band frequency 2
Insertion loss at Pass band 1
Insertion loss at Pass band 2
V.S.W.R. at Pass band
Attenuation
-10
-20
-30
-40
-600
4900 - 5950 MHz
0.80 dB max.
2.0 dB max.
32 dB min. (30 - 2700 MHz)
50Ω
Common Rlo
High Band
Low Band
-50
2
4
6
8
10
12
14
16
18
Frequency. [GHz]
FI 212P082931
Low band
Pass band frequency 1
Pass band frequency 2
Insertion loss at 698 - 894 MHz
Insertion loss at 880 - 960 MHz
V.S.W.R. at 698 - 894 MHz
V.S.W.R. at 880 - 960 MHz
Attenuation
Impedance
Insertion loss at 1560 - 1610 MHz
Insertion loss at 1710 - 2170 MHz
Insertion loss at 2300 - 2690 MHz
V.S.W.R. at 1420 - 2690 MHz
Attenuation
Impedance
HIGH FREQUENCY
PRODUCTS
High band
Pass band frequency 1
Pass band frequency 2
Pass band frequency 3
Pass band frequency 4
Insertion loss at 1420 - 1520 MHz
698 - 894 MHz
880 - 960 MHz
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
0.70 dB max. (+25℃)
0.80 dB max. (-40~+85℃)
2.0 max.
2.0 max.
13 dB min. (1420 - 2690 MHz)
50Ω
1420 - 1520 MHz
1560 - 1610 MHz
1710 - 2170 MHz
2300 - 2690 MHz
0.70 dB max. (+25℃)
0.80 dB max. (-40~+85℃)
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
2.0 max.
13 dB min. (698 - 960 MHz)
50Ω
FI 212P0829G2
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 1710 - 2690 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
698 - 960 MHz
0.27 dB max. (+25℃)
0.32 dB max. (-40~+85℃)
2.0 max.
13 dB min. (1710 - 2690 MHz)
50Ω
1710 - 2690 MHz
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
2.0 max.
19 dB min. (698 - 960 MHz)
50Ω
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
101
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 212P082934
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
698 - 960 MHz
0.50 dB max. (-40~+85℃)
1.4 max.
15 dB min. (1554 - 1580 MHz)
25 dB min. (1710 - 2110 MHz)
25 dB min. (2110 - 2155 MHz)
25 dB min. (2155 - 2690 MHz)
12 dB min. (2155 - 7830 MHz)
50Ω
High band
Pass band frequency 1
Pass band frequency 2
Insertion loss at 1710 - 2170 MHz
Insertion loss at 2500 - 2690 MHz
V.S.W.R. at 1710 - 2170 MHz
V.S.W.R. at 2500 - 2690 MHz
Attenuation
Impedance
1710 - 2170 MHz
2500 - 2690 MHz
0.50 dB max. (-40~+85℃)
0.55 dB max. (-40~+85℃)
1.4 max.
1.8 max.
17 dB min. (0.3 - 960 MHz)
50Ω
FI 212P082935
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
HIGH FREQUENCY
PRODUCTS
Impedance
698 - 960 MHz
0.50 dB max. (-40~+85℃)
1.4 max.
15 dB min. (1554 - 1580 MHz)
25 dB min. (1710 - 2110 MHz)
25 dB min. (2110 - 2155 MHz)
25 dB min. (2155 - 2690 MHz)
12 dB min. (2155 - 7830 MHz)
50Ω
High band
Pass band frequency 1
Pass band frequency 2
Insertion loss at 1710 - 2170 MHz
Insertion loss at 2500 - 2690 MHz
V.S.W.R. at 1710 - 2170 MHz
V.S.W.R. at 2500 - 2690 MHz
Attenuation
Impedance
1710 - 2170 MHz
2500 - 2690 MHz
0.50 dB max. (-40~+85℃)
0.55 dB max. (-40~+85℃)
1.4 max.
1.8 max.
17 dB min. (0.3 - 960 MHz)
50Ω
FI 212P089208
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 1710 - 2170 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
698 - 960 MHz
0.27 dB max. (+25℃)
0.32 dB max. (-40~+85℃)
2.0 max.
13 dB min. (1710 - 2170 MHz)
50Ω
1710 - 2170 MHz
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
2.0 max.
19 dB min. (698 - 960 MHz)
50Ω
FI 212P089213
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 1710 - 2170 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
698 - 960 MHz
0.27 dB max. (+25℃)
0.32 dB max. (-40~+85℃)
2.0 max.
13 dB min. (1710 - 2170 MHz)
50Ω
1710 - 2170 MHz
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
2.0 max.
19 dB min. (698 - 960 MHz)
50Ω
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
102
21
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 212P085909
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
High band
Pass band frequency 1
Pass band frequency 2
Pass band frequency 3
Insertion loss at 1558 - 1570 MHz
Insertion loss at 1570 - 1580 MHz
Insertion loss at 1580 - 1610 MHz
V.S.W.R. at 1558 - 1570 MHz
V.S.W.R. at 1570 - 1580 MHz
V.S.W.R. at 1580 - 1610 MHz
Attenuation
Impedance
698 - 960 MHz
0.70 dB max. (+25℃)
0.75 dB max. (-30~+85℃)
1.6 max.
19 dB min. (1558 - 1570 MHz)
20 dB min. (1570 - 1580 MHz)
19 dB min. (1580 - 1610 MHz)
50Ω
1558 - 1570 MHz
1570 - 1580 MHz
1580 - 1610 MHz
0.75 dB max. (+25℃)
0.85 dB max. (-30~+85℃)
0.70 dB max. (+25℃)
0.80 dB max. (-30~+85℃)
0.70 dB max. (+25℃)
0.80 dB max. (-30~+85℃)
1.6 max.
1.6 max.
1.6 max.
35 dB min. (698 - 824 MHz)
42 dB min. (824 - 894 MHz)
25 dB min. (894 - 960 MHz)
50Ω
FI 212P085912
V.S.W.R. at 698 - 960 MHz
Attenuation
Impedance
High band
Pass band frequency 1
Pass band frequency 2
Pass band frequency 3
Insertion loss at 1558 - 1570 MHz
Insertion loss at 1570 - 1580 MHz
Insertion loss at 1580 - 1610 MHz
V.S.W.R. at 1558 - 1570 MHz
V.S.W.R. at 1570 - 1580 MHz
V.S.W.R. at 1580 - 1610 MHz
Attenuation
Impedance
698 - 960 MHz
0.70 dB max. (+25℃)
0.75 dB max. (-30~+85℃)
1.6 max.
19 dB min. (1558 - 1570 MHz)
20 dB min. (1570 - 1580 MHz)
19 dB min. (1580 - 1610 MHz)
50Ω
HIGH FREQUENCY
PRODUCTS
Low band
Pass band frequency
Insertion loss at 698 - 960 MHz
1558 - 1570 MHz
1570 - 1580 MHz
1580 - 1610 MHz
0.75 dB max. (+25℃)
0.85 dB max. (-30~+85℃)
0.70 dB max. (+25℃)
0.80 dB max. (-30~+85℃)
0.70 dB max. (+25℃)
0.80 dB max. (-30~+85℃)
1.6 max.
1.6 max.
1.6 max.
35 dB min. (698 - 824 MHz)
42 dB min. (824 - 894 MHz)
25 dB min. (894 - 960 MHz)
50Ω
FQ 105P0829DZ
Pass band frequency 1
Pass band frequency 2
Impedance
699 - 960 MHz
1710 - 2690 MHz
50 Ω
FI 212P1955EN
Pass band frequency 1
Pass band frequency 2
Impedance
1427 - 2200 MHz
2496 - 5000 MHz
50 Ω
FI 212P1700CL
Pass band frequency 1
Pass band frequency 2
Impedance
699 - 2690 MHz
3300 - 5000 MHz
50 Ω
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
103
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 168P157519
Low band
Pass band frequency 0
Pass band frequency 1
Pass band frequency 2
Insertion loss at 824 - 960 MHz
Insertion loss at 1558 - 1585 MHz
Insertion loss at 1585 - 1610 MHz
V.S.W.R. at 824 - 960 MHz
V.S.W.R. at 1558 - 1585 MHz
V.S.W.R. at 1585 - 1610 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 2400 - 2500 MHz
V.S.W.R. at 2400 - 2500 MHz
Attenuation
Impedance
824 - 960 MHz
1558 - 1585 MHz
1585 - 1610 MHz
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
0.40 dB max. (+25℃)
0.50 dB max. (-40~+85℃)
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
2.0 max.
2.0 max.
2.0 max.
13 dB min. (2400 - 2500 MHz)
50Ω
2400 - 2500 MHz
0.60 dB max. (+25℃)
0.70 dB max. (-40~+85℃)
2.0 max.
12 dB min. (824 - 960 MHz)
23 dB min. (1558 - 1585 MHz)
20 dB min. (1585 - 1610 MHz)
50Ω
FI 168P157525
HIGH FREQUENCY
PRODUCTS
Low band
Pass band frequency 0
Pass band frequency 1
Pass band frequency 2
Insertion loss at 824 - 960 MHz
Insertion loss at 1558 - 1585 MHz
Insertion loss at 1585 - 1610 MHz
V.S.W.R. at 824 - 960 MHz
V.S.W.R. at 1558 - 1585 MHz
V.S.W.R. at 1585 - 1610 MHz
Attenuation
Impedance
High band
Pass band frequency
Insertion loss at 2400 - 2500 MHz
V.S.W.R. at 2400 - 2500 MHz
Attenuation
Impedance
824 - 960 MHz
1558 - 1585 MHz
1585 - 1610 MHz
0.50 dB max. (+25℃)
0.60 dB max. (-40~+85℃)
0.40 dB max. (+25℃)
0.50 dB max. (-40~+85℃)
0.45 dB max. (+25℃)
0.55 dB max. (-40~+85℃)
2.0 max.
2.0 max.
2.0 max.
13 dB min. (2400 - 2500 MHz)
50Ω
2400 - 2500 MHz
0.60 dB max. (+25℃)
0.70 dB max. (-40~+85℃)
2.0 max.
12 dB min. (824 - 960 MHz)
23 dB min. (1558 - 1585 MHz)
12 dB min. (1585 - 1610 MHz)
50Ω
FI 168W1697B1
Pass band frequency
Insertion loss at 699 - 960 MHz
Insertion loss at 1000 - 2025 MHz
Insertion loss at 2110 - 2690 MHz
Ripple
RF Coupling
Coupling ration missmatch between Coupler
branch 1 and Coupler branch 2
Directivity
Impedance
699 - 2690 MHz
0.15 dB max. (+35~+85℃)
0.1 dB max. (+15~+35℃)
0.1 dB max. (-20~+15℃)
0.25 dB max. (+35~+85℃)
0.2 dB max. (+15~+35℃)
0.2 dB max. (-20~+15℃)
0.38 dB max. (+35~+85℃)
0.28 dB max. (+15~+35℃)
0.28 dB max. (-20~+15℃)
0.1 dB max. (699 - 746 MHz)
0.1 dB max. (791 - 862 MHz)
0.1 dB max. (824 - 960 MHz)
0.1 dB max. (1710 - 2170 MHz)
0.1 dB max. (2500 - 2690 MHz)
28.1~29.5 dB (699MHz)
25.8~27.2 dB (915MHz)
20.7~22.1 dB (1710MHz)
19.9~21.3 dB (1880MHz)
19.3~20.7 dB (2025MHz)
18.3~19.7 dB (2300MHz)
17.1~18.5 dB (2690MHz)
-1~1 dB (699 - 2690 MHz)
18 dB min. (699 - 2690 MHz)
50 Ω
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
104
21
for General Electronic Equipment
■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS
FI 168K1687AA
S11 Coupled port at 698 - 2690 MHz
RF Coupling
Isolation
Impedance
698 - 2690 MHz
0.25 dB max. (+25℃)
0.30 dB max. (-40~+85℃)
0.25 dB max. (+25℃)
26.5~29.0 dB (698MHz)
24.0~27.0 dB (915MHz)
21.5~24.5 dB (1710MHz)
21.5~24.5 dB (2025MHz)
21.5~24.5 dB (2300MHz)
21.5~25.5 dB (2690MHz)
35 dB min. (698 - 2690 MHz)
50 Ω
0
CPL
-10
Couple/Isolation[dB]
Pass band frequency
Insertion loss at 699 - 2690 MHz
ISO
-20
-30
-40
-50
0.5
1.0
1.5
2.0
2.5
3.0
Frequency[GHz]
HIGH FREQUENCY
PRODUCTS
chipfilter_e-E09R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
105
MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER
■PACKAGING
①Minimum Quantity
Type
212B-1.0
212C
212P-1.0
168B
168L
168D
168P
168L-G
168H
168P245030
212B-0.65
212P-0.7
168W
168K
105B
105L
105P
Embossed tape / Paper tape [pcs]
3000
4000
5000
8000
10000
②Tape Material
●Embossed Tape
●Card Board Cattier Tape
Top tape
Top tape
Base tape
Sprocket hole
Sprocket hole
Base tape
Bottom tape
Chip cavity
Chip cavity
Chip Filled
Chip
③Taping Dimensions
●Embossed tape 0.315 inches wide
A
B
T
8.0±0.3
(0.315±0.012)
1.75±0.1
(0.069±0.004)
3.5±0.05
(0.138±0.002)
Sprocket hole
Unit:mm(inch)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
K
F
2.0±0.1
(0.079±0.004)
4.0±0.1
(0.157±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E09R01
Type
212B-1.0
212B-0.65
212C
212C-0.7
212P-1.0
212P-0.7
Chip cavity
A
B
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
1.45±0.2
2.25±0.2
(0.057±0.008)
(0.089±0.008)
Insertion Pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape Thickness max.
K
T
1.1 Max
0.3
(0.043 Max)
(0.012)
0.95 Max
0.3
(0.037 Max)
(0.012)
1.1 Max
0.3
(0.043 Max)
(0.012)
0.95 Max
0.3
(0.037 Max)
(0.012)
1.1 Max
0.3
(0.043 Max)
(0.012)
0.95 Max
0.3
(0.037 Max)
(0.012)
Unit:mm(inch)
●Paper tape 0.315 inches wide
Unit:mm(inch)
3.5±0.05
(0.138±0.002)
Sprocket hole
A
B
F
1.75±0.1
(0.069±0.004)
T
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Type
168B
168L
168W
168K
168D
168P
168L-G
168H
105B
105L
105P
Chip cavity
A
B
1.00±0.05
1.80±0.05
(0.039±0.002)
(0.071±0.002)
1.00±0.05
1.80±0.05
(0.039±0.002)
(0.071±0.002)
1.00±0.05
1.80±0.05
(0.039±0.002)
(0.071±0.002)
1.00±0.05
1.80±0.05
(0.039±0.002)
(0.071±0.002)
1.00±0.05
1.80±0.05
(0.039±0.002)
(0.071±0.002)
0.95±0.05
1.80±0.05
(0.037±0.002)
(0.071±0.002)
0.95±0.05
1.80±0.05
(0.037±0.002)
(0.071±0.002)
0.95±0.05
1.80±0.05
(0.037±0.002)
(0.071±0.002)
0.62±0.03
1.12±0.03
(0.024±0.001)
(0.044±0.001)
0.62±0.03
1.12±0.03
(0.024±0.001)
(0.044±0.001)
0.62±0.03
1.12±0.03
(0.024±0.001)
(0.044±0.001)
Insertion Pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
2.0±0.05
(0.079±0.002)
2.0±0.05
(0.079±0.002)
Tape Thickness max.
T
0.55
(0.022)
0.55
(0.022)
0.55
(0.022)
0.80
(0.031)
0.55
(0.022)
0.80
(0.031)
0.80
(0.031)
0.80
(0.031)
0.45
(0.018)
0.45
(0.018)
0.45
(0.018)
Unit:mm(inch)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E09R01
④Leader and Blank Portion
⑤Reel size
t
E
C
R
B
D
A
W
A
φ178±2.0
(φ7.01±0.079)
B
φ50min.
(φ1.97 min.)
C
φ13.0±0.2
(φ0.512±0.008)
8mm width tape
(0.315 inches width)
12mm width tape
(0.472 inches width)
t
2.5max.
(0.098max.)
2.5max.
(0.098max.)
W
10±1.5
(0.394±0.059)
14±1.5
(0.551±0.059)
D
φ21.0±0.8
(φ0.827±0.031)
E
2.0±0.5
(0.079±0.020)
R
1.0
Unit:mm(inch)
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1~0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E09R01
MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
-40~+85℃
2. Storage Temperature Range
Specified Value
-40~+85℃
Test Methods and
Remarks
※Note : -20 to +40℃ in taped packaging
3. Resistance to Flexure of Substrate
Specified Value
No mechanical damage.
Warp
Testing board
Thickness
: 2mm
: Glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
4. Adhesion of Electrode
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Applied force
Duration
: 5N
: 10 sec.
Test Methods and
Remarks
5. Solderability
Specified Value
75% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Test Methods and
Remarks
Solder temperature
Duration
Preconditioning
Immersion and Removal speed
: 240±5℃
: 3±1 sec
: Immersion into flux.
: 25mm/sec.
6. Resistance to Solder Heat
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Test Methods and
Remarks
Preheating
Solder temperature
Duration
Preconditioning
Immersion and Removal speed
Recovery
:
:
:
:
:
:
150℃ for 2 min.
260±5℃
5±0.5 sec.
Immersion into flux.
25mm/sec.
2 to 3hrs of recovery under the standard condition after the removal from test chamber.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_reli_e-E09R01
7. Thermal Shock
Specified Value
Test Methods and
Remarks
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
According to JIS C60068-2-14.
Conditions for 1 cycle
Step
Temperature (℃)
1
-40±3
2
Room Temperature
3
85±2
4
Room Temperature
Number of cycles
Mounting method
Recovery
Duration (min)
30±3
Within 3
30±3
Within 3
: 100
: Soldering onto PC board.
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
8. Humidity (steady state)
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Test Methods and
Remarks
Temperature
Humidity
Duration
Recovery
:
:
:
:
+85±2℃
85±5%RH
1000 hrs
2 to 3hrs of recovery under the standard condition after the removal from test chamber.
9. High temperature life test
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Test Methods and
Remarks
Temperature
Duration
Recovery
: +85±2℃
: 1000 hrs
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
10. Low temperature life test
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Test Methods and
Remarks
Temperature
Duration
Recovery
: -40±2℃
: 1000 hrs
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
Note on standard condition:
"standard condition" referred to herein is defined as follows :
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement result :
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_reli_e-E09R01
MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER
■PRECAUTIONS
1. PCB Design
◆Land pattern design
Land pattern dimension examples
FI 212B Side 4Pins type
FI 212B LGA 3Pins type
FI 168B/L Side 4Pins type
FI 105B/L Side 4Pins type
0.825
0.55
0.475
0.3
Unit:mm
FI 168L/FI 168P/FI 168D/FI 168K
Side 4Pins type
Unit:mm
Unit:mm
FI 168L/H LGA Type
FI 212C Type
Unit:mm
FI 168P Side 4Pins type
Technical
considerations
0.70
Unit:mm
FI 212P Side 6Pins type
0.40
0.25 0.30
Unit:mm
FI 212P LGA 6Pins Type
Unit:mm
FI 168W Type
0.3500
0.15
0.6500
Unit:mm
FQ 105P Type
0.4
0.30 0.25
0.3500
0.18
0.5000
Unit:mm
0.18
0.18
0.54
Unit:mm
Unit:mm
Unit:mm
2. Soldering
◆Conditions for Reflow soldering (for reference)
・ Pb Free Reflow Profile
Technical
considerations
Temperature(℃)
300
200
Peak
260℃ Max.
Within 10sec.
Slow
cooling
100
0
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
※ Components should be preheated to within 100 to 130℃ from soldering temperature.
※ Assured to be reflow soldering for 2 times.
Note : The above profiles are the maximum allowable soldering condition, therefore these profiles are not always
recommended.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_prec_e-E09R01
3. Storage conditions
Precautions
◆Storage conditions
1. The Products must not be used in the following environments :
・ exposure to special gases such as (C12, NH3, SOx, NOx)
・ exposure to volatile gas or inflammable gas
・ exposure to a lot of dust
・ exposure to water or condensation
・ exposure to direct sunlight or freezing
2. The Products should be kept in the following conditions :
・ Temperature : -10~+40℃
・ Humidity : 15~85%RH max.
3. The products should be used within 6 months after delivery. In case of storage over 6 months, solderability shall be checked before
actual usage.
■ Please contact of our offices for further details of specifications.
All of the standard values listed here are subject to change without notice.
Therefore, please check the specifications carefully before use.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_prec_e-E09R01