FI212P089213-T

for General Electronic Equipment Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product Information in this Catalog Product information in this catalog is as of October 2020. All All of of the the January 2021. contents specified herein and production status of the products listed in this catalog are subject to change without notice due to technical improvement of our products, etc. Therefore, please check for the latest information carefully before practical application or use of our products. (4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r, hydroelectric power, thermal power plant control system, etc.) (5) Undersea equipment (submarine repeating equipment, underwater work equipment, etc.) (6) Military equipment (7) Any other equipment requiring extremely high levels of safety and/or reliability equal to the equipment listed above Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. *Notes: 1. There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. 2. Implantable medical devices contain not only internal unit which is implanted in a body, but also external unit which is connected to the internal unit. ■ Approval of Product Specifications Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t specifications as the individual product specification sheets are available. When using our products, please be sure to approve our product specifications or make a written agreement on the product specification with TAIYO YUDEN in advance. ■ Pre-Evaluation in the Actual Equipment and Conditions Please conduct validation and verification of our products in actual conditions of mounting and operating environment before using our products. ■ Limited Application 1. Equipment Intended for Use The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and other equipment specified in this catalog or the individual product specification sheets. TAIYO YUDEN has the line-up of the products intended for use in automotive electronic equipment, telecommunications infrastructure and industrial equipment, or medical devices classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, please check available applications specified in this catalog or the individual product specification sheets and use the corresponding products. 2. Equipment Requiring Inquiry Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following equipment (excluding intended equipment as specified in this catalog or the individual product specification sheets) which may cause loss of human life, bodily injury, serious property damage and/or serious public impact due to a failure or defect of the products and/or malfunction attributed thereto. (1) Transportation equipment (automotive powertrain control system, train control system, and ship control system, etc.) (2) Traffic signal equipment (3) Disaster prevention equipment, crime prevention equipment (4) Medical devices classified as GHTF Class C (Japan Class III) (5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base station, etc.) (6) Any other equipment requiring high levels of quality and/or reliability equal to the equipment listed above 3. Equipment Prohibited for Use Please do not incorporate our products into the following equipment requiring extremely high levels of safety and/or reliability. (1) Aerospace equipment (artificial satellite, rocket, etc.) (2) Aviation equipment *1 (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 4. Limitation of Liability Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not intended for use by TAIYO YUDEN, or any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Safety Design When using our products for high safety and/or reliability-required equipment or circuits, please fully perform safety and/or reliability evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault for a failsafe design to ensure safety. ■ Intellectual Property Rights Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Limited Warranty Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a failure or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ TAIYO YUDEN’s Official Sales Channel The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter “TAIYO YUDEN’ s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’ s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law” of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 2 21 for General Electronic Equipment MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER REFLOW ■PARTS NUMBER F Q ① △ ② 1 0 5 ③ ①Series name Code ＦＩ ＦQ P ④ 0 8 2 9 D ⑤ Z - ⑥ T ⑤Frequency Code （example） 2450 0620 Series name High frequency devices High frequency devices – Fine Line ②Electrode code Code △ △＝Blank space ⑦ Frequency［MHz］ 2400～2500 470～770 ⑥Spec code Code 01～ Spec code Individual spec ③Dimensions Code 212 168 105 Dimensions［mm］ 2.0×1.25 1.6×0.8 1.0×0.5 ⑦Packaging Code -T Packaging Taping ④Special code Code B L H D C P W K Special code Band pass type Low pass type High pass type Dual type Balance type Diplexer 2 Branch Coupler Coupler HIGH FREQUENCY PRODUCTS Electrode code With plating ■EXTERNAL DIMENSIONS / STANDARD QUANTITY FI 105B/L Side 4Pins type A max. OUT GND GND OUT IN 0.30±0.10 IN 0.4max. 1.00±0.05 GND 0.10±0.05 0.30±0.20 GND 1.25±0.15 OUT IN 1.6±0.10 GND 1.25±0.15 (1) (2) (3) GND FI 168B/L Side 4Pins type 0.65max. 0.30±0.10 2.0±0.15 0.50±0.05 FI 212B LGA 3Pins type 0.9±0.10 0.80±0.10 FI 212B Side 4Pins type 2.0±0.15 0.70±0.10 0.687 0.687 (1) (2) (3) 0.275±0.10 (1) (2) (3) (1) (2) (3) 0.60±0.10 0.60±0.10 (1) (2) (3) (4) (1) (2) (3) 0.30±0.20 (8) 1.6±0.10 0.7max. (7) (6) (5) FI 168P Side 4Pins type 0.65max. (6) (5) (4) (1) (2) (3) 1.6±0.10 0.65 max. (1) (4) (2) (3) 0.65±0.20 0.2±0.1 0.3±0.20 0.3±0.20 FI 168P Side 6Pins type 0.15±0.10 0.65±0.20 2.0±0.15 1.25±0.15 (1) (2) (3) 0.2±0.15 FI 212C245075 0.30±0.20 (4) 1.25±0.15 (7) (6) (5) (1) (2) (3) 0.30±0.10 FI 212C245036 0.9±0.10 (4) 0.65±0.20 0.50±0.15 0.40±0.10 2.0±0.15 (8) 0.30±0.10 0.30±0.10 0.2±0.10 0.9±0.10 (7) (6) (5) 0.70±0.10 0.50±0.15 (8) (6) (5) (4) FI 212C245033 2.0±0.15 0.45max. 0.80±0.10 (6) (5) (4) 1.6±0.10 0.80±0.10 0.80±0.10 (1) (2) (3) FI 168D type 0.65max. 0.30±0.20 1.6±0.10 1.25±0.15 FI 168L/H LGA 3Pins type 0.65max. 0.30±0.10 0.80±0.10 FI 168L0628M4 1.6±0.10 0.10±0.05 0.7±0.10 0.60±0.10 1.6±0.20 A 0.5 0.45 0.80±0.10 0.275±0.10 FI 168B FI 168L 0.50±0.15 0.3±0.10 0.3±0.20 0.15±0.10 Unit：mm chipfilter_e-E09R01.doc ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 95 for General Electronic Equipment 0.9±0.10 FI 212P1700CL 1.0 max (1) (2) (3) (1) (2) (3) (6) (5) (4) (6) (5) (4) 0.65±0.10 FQ 105P0829DZ 0.7 max (1) (2) (3) 1.25±0.15 1.25±0.15 (6) (5) (4) 2.0±0.15 1.0±0.1 0.4 max (6) (5) (4) 1.25±0.15 2.0±0.15 2.0±0.15 (1) (2) (3) 0.50±0.10 FI 212P0829G2 FI 212P1955EN FI 212P Side 6Pins type 0.65±0.10 0.65±0.20 0.30±0.10 (6) (5) (4) (1) (2) (3) 0.3±0.20 0.05typ FI 168W type (2) (3) (6) (5) (4) 0.18±0.10 0.15±0.10 0.125±0.10 0.18±0.10 0.65max. (1) (2) (3) 0.80±0.10 (1) (2) (3) 1.6±0.10 (6) (5) (4) 0.20±0.15 (4) (8) 0.05typ (1) FI168K type 0.5max. 0.80±0.10 1.6±0.10 0.30±0.10 0.3±0.10 0.3±0.10 (7) (6) (5) (6) (5) (4) (1) (2) (3) 0.50±0.15 0.20±0.15 0.50±0.15 0.2±0.15 Unit：mm HIGH FREQUENCY PRODUCTS (1) (2) (3) (4) (5) (6) (7) (8) FI 212B LGA 3Pins type RF IN/OUT GND RF IN/OUT - FI 168P157519 FI 168L0628M4 I/O Port GND I/O Port GND GND GND - FI 168P157525 (1) (2) (3) (4) (5) (6) (7) (8) GND High Band Common Low Band - GND Low Band Common High Band - (1) (2) (3) (4) (5) (6) (7) (8) FI 168W type RF1 IN/OUT CPL2 RF1 CPL2 RF2 GND RF2 OUT/IN CPL1 RF2 CPL1 RF1 GND FI 168K type COUPLING GND ISOLATION RF OUT GND RF IN - Type 212 168 105 FI 168L/H LGA 3Pins type RF IN/OUT GND RF IN/OUT FI 212P082931 FI 212P082934 FI 212P089208 FI 212P085912 Low Band GND High Band GND Common Port GND - FI 168D087018 High Band IN GND Low Band IN Low Band OUT GND High Band OUT FI 212P082935 FI 212P089213 FI 212P085909 High Band GND Low Band GND Common Port GND - FI 212C2450** Balanced GND Balanced GND Unbalance DC NC GND FQ105P0829GZ FI 212P0829G2 FI 212P1700CL Low Band GND High Band GND Common Port GND - FI 168P245030 GND Common GND Low Band GND High Band - FI 212P1955EN GND Common Port GND High Band GND Low Band Standard quantity［pcs］ 3000～6000 4000～8000 10000 chipfilter_e-E09R01.doc ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 96 21 for General Electronic Equipment ■PARTS NUMBER ●Multilayer device band pass type Applications 2.4GHz W-LAN / Bluetooth ® 5G NR Sub 6 ●Multilayer device low pass type Applications Digtal TV 2.4GHｚ W-LAN / Bluetooth ® Cellular ●Multilayer device high pass type Applications Cellular Applications Other ●Multilayer device balance type Applications Bluetooth ® Cellular 4G , 5G NR GPS / 2.4GHｚ W-LAN ●Multilayer coupler Applications Cellular Part number FI 212B245026 FI 212B245027 FI 168B245001 FI 105B245024 FI 212B3750EQ FI 212B4700DQ Notes Side 4Pins Side 4Pins Side 4Pins Side 4Pins LGA 3Pins LGA 3Pins External dimensions ［mm］ 1.6×0.8×0.45max. 1.0×0.5×0.4max. 1.0×0.5×0.4max. 1.0×0.5×0.4max. 1.6×0.8×0.65max. 1.6×0.8×0.65max. 1.6×0.8×0.65max. Part number FI 168L062005 FI 105L250014 FI 105L186822 FI 105L087038 FI 168L0628M4 FI 168L2200G9 FI 168L1681G6 Notes Side 4Pins Side 4Pins Side 4Pins Side 4Pins Side 6Pins LGA 3Pins LGA 3Pins External dimensions ［mm］ 1.6×0.8×0.65max. Part number FI 168H2593GG Notes LGA 3Pins External dimensions ［mm］ 1.6×0.8×0.45max. Part number FI 168D087018 Notes Dual band LPF External dimensions ［mm］ 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×0.7max. Part number FI 212C245033 FI 212C245036 FI 212C245075 Notes Conjugated match to CSR BC3 Conjugated match to CSR BC5 Conjugated match to CSR BC5FM, BC6ROM External dimensions ［mm］ 1.6×0.8×0.65max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 2.0×1.25×1.0max. 1.0×0.5×0.4max. 2.0×1.25×1.0max. 2.0×1.25×0.7max. 1.6×0.8×0.65max. 1.6×0.8×0.65max. Part number FI 168P245030 FI 212P082931 FI 212P0829G2 FI 212P082934 FI 212P082935 FI 212P089208 FI 212P089213 FI 212P085909 FI 212P085912 FQ 105P0829DZ FI 212P1955EN FI 212P1700CL FI 168P157519 FI 168P157525 Notes Side 6Pins Side 6Pins LGA 6Pin Side 6Pins Side 6Pins Side 6Pins Side 6Pins Side 6Pins Side 6Pins LGA 6Pin LGA 6Pin LGA 6Pin Side 4Pins Side 4Pins External dimensions ［mm］ 1.6×0.8×0.5max. 1.6×0.8×0.5max. Part number FI 168W1697B1 FI 168K1687AA Notes Side 8Pins Side 6Pins HIGH FREQUENCY PRODUCTS ●Multilayer diplexer Applications W-LAN External dimensions ［mm］ 2.0×1.25×1.0max. 2.0×1.25×1.0max. 1.6×0.8×0.5max. 1.0×0.5×0.4max. 2.0×1.25×0.65max. 2.0×1.25×0.65max. chipfilter_e-E09R01.xls ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 97 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 212B245026 Pass band frequency Insertion loss at pass band Ripple at pass band V.S.W.R. at pass band Attenuation Impedance 2400 - 2500 MHz 2.6 dB max. (+25℃） 2.9 dB max. (-40～+85℃） 1.0 dB max. 2.0 max. 40 dB min. (800 - 960 MHz) 30 dB min. (1710 - 1990 MHz) 25 dB min. (2110 - 2170 MHz) 30 dB min. (4800 - 5000 MHz) 30 dB min. (7200 - 7500 MHz) 50 Ω FI 212B245027 Pass band frequency Insertion loss at pass band Ripple at pass band V.S.W.R. at pass band Attenuation 2400 - 2500 MHz 1.4 dB max. (+25℃） 1.7 dB max. (-40～+85℃） 1.0 dB max. 2.0 max. 30 dB min. (800 - 915 MHz) 30 dB min. (1710 - 1910 MHz) 6 dB min. (2110 - 2170 MHz) 20 dB min. (4800 - 5000 MHz) FI 168B245001 Pass band frequency Insertion loss at pass band HIGH FREQUENCY PRODUCTS Ripple at pass band V.S.W.R. at pass band Attenuation Impedance 2400 - 2500 MHz 2.2 dB max. (+25℃） 2.5 dB max. (-30～+85℃） 1.0 dB max. 2.1 max. 25 dB min. (800 - 960 MHz) 25 dB min. (1710 - 1910 MHz) 20 dB min. (4800 - 5000 MHz) 20 dB min. (7200 - 7500 MHz) 50 Ω FI 105B245024 Pass band frequency Insertion loss at pass band Ripple at pass band V.S.W.R. at pass band Attenuation 2400 - 2500 MHz 3.0 dB max. (+25℃） 3.3 dB max. (-40～+85℃） 1.0 dB max. 2.2 max. 25 dB min. (800 - 960 MHz) 22 dB min. (1710 - 1910 MHz) 20 dB min. (4800 - 5000 MHz) 20 dB min. (7200 - 7500 MHz) FI 212B3750EQ Pass band frequency Impedance 3300 - 4200 MHz 50 Ω FI 212B4700DQ Pass band frequency Impedance 4400 - 5000 MHz 50 Ω FI 168L062005 Pass band frequency Insertion loss at 470 - 600 MHz Insertion loss at 600 - 710 MHz Insertion loss at 710 - 770 MHz Ripple at 470 - 710 MHz V.S.W.R. Attenuation Impedance 470 - 770 MHz 1.2 dB max. (+25℃） 1.3 dB max. (-30～+85℃） 2.2 dB max. (+25℃） 2.4 dB max. (-30～+85℃） 4.0 dB max. (+25℃） 4.4 dB max. (-30～+85℃） 1.4 dB max. 2.0 max. (470 - 710 MHz) 2.5 max. (710 - 770 MHz) 25 dB min. (888 - 925 MHz) (+25℃) 21 dB min. (888 - 925 MHz) (-30～+85℃) 25 dB min. (940 - 960 MHz) 27 dB min. (1429 - 1453 MHz) 26 dB min. (1920 - 1980 MHz) 26 dB min. (2400 - 2500 MHz) 50 Ω chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 98 21 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 105L250014 Pass band frequency Insertion loss at 2400 - 2500 MHz V.S.W.R. at 2400 - 2500 MHz Attenuation Impedance 2400 - 2500 MHz 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 1.7 max. 21 dB min. (4800 - 5000 MHz) 21 dB min. (7200 - 7500 MHz) 50 Ω FI 105L186822 Impedance 824 - 915 MHz 0.75 dB max. (-30～+85℃） 1.5 max. 23 dB min. (1648 - 1830 MHz) 23 dB min. (2472 - 2745 MHz) 50 Ω 0 S11 -10 Attenuation[dB] Pass band frequency Insertion loss at 824 - 915 MHz V.S.W.R. at 2400 - 2500 MHz Attenuation S21 -20 -30 -40 -50 -60 1.0 2.0 3.0 4.0 5.0 6.0 7.0 Frequency[GHz] FI 105L087038 Impedance 824 - 915 MHz 0.75 dB max. (-30～+85℃） 1.5 max. 23 dB min. (1648 - 1830 MHz) 23 dB min. (2472 - 2745 MHz) 50 Ω HIGH FREQUENCY PRODUCTS Pass band frequency Insertion loss at 824 - 915 MHz V.S.W.R. at 2400 - 2500 MHz Attenuation FI 168L0628M4 Ripple at pass band V.S.W.R. at pass band Attenuation Impedance 470 - 787 MHz 0.5 dB max. (+25℃） 0.6 dB max. (-40～+90℃） 2.0 max. 26 dB min. (1429 - 1501 MHz) 30 dB min. (1565 - 1607 MHz) 35 dB min. (1570 - 1580 MHz) 18 dB min. (1920 - 1980 MHz) 0 ‐10 Attenuation [dB] Pass band frequency Insertion loss at pass band ‐20 ‐30 S11 ‐40 S21 ‐50 ‐60 50 Ω 0.4 0.8 1.2 1.6 2.0 Frequency [GHz] 2.4 2.8 FI 168L2200G9 Pass band frequency Insertion loss at 1700 - 2170 MHz Insertion loss at 2170 - 2500 MHz Insertion loss at 2500 - 2700 MHz Return loss. at 1700 - 2700 MHz Attenuation Impedance 1700 - 2170 MHz 2170 - 2500 MHz 2500 - 2700 MHz 0.5 dB max. (+25℃） 0.55 dB max. (-30～+85℃） 0.65 dB max. (+25℃） 0.75 dB max. (-30～+85℃） 0.9 dB max. (+25℃） 1.0 dB max. (-30～+85℃） 10 dB min. 25 dB min. (3400 MHz) 22 dB min. (3400 - 5400 MHz) 20 dB min. (5400 - 8100 MHz) 50 Ω FI 168L1681G6 Return loss. at 617 - 2690 MHz Attenuation Impedance 617 - 2690 MHz 0.5 dB max. (-40～+90℃） 10 dB min. 35 dB min. (4950 - 6000 MHz) 35 dB min. (6000 - 7500 MHz) 35 dB min. (7500 - 8100 MHz) 35 dB min. (8100 - 10500 MHz) 27 dB min. (10500 - 12500 MHz) 50 Ω 0 S11 -10 S21 Attenuation[dB] Pass band frequency -20 -30 -40 -50 -60 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 11.5 12.5 Frequency[GHz] chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 99 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 168H2593GG 2496 - 2690 MHz 0.9 dB max. (-40～+90℃） 15 dB min. 25 dB min. (1710 - 1995 MHz) 50 Ω 0 -10 Attenuation[dB] Pass band frequency Insertion loss at 2500 - 2700 MHz Return loss. at 1700 - 2700 MHz Attenuation Impedance -20 -30 S11 -40 S21 -50 0.5 1.5 2.5 3.5 4.5 5.5 6.5 Frequency[GHz] FI 168D087018 Low band Pass band frequency Insertion loss at 824 - 915 MHz V.S.W.R. at 824 - 915 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 1710 - 1910 MHz V.S.W.R. at 824 - 915 MHz Attenuation Impedance Isolation In to In/Out to Out HIGH FREQUENCY PRODUCTS In to Out 824 - 915 MHz 0.6 dB max. (-30～+85℃） 1.5 max. 25 dB min. (1648 - 1830 MHz) 25 dB min. (2472 - 2745 MHz) 50 Ω 1710 - 1910 MHz 0.6 dB max. (-30～+85℃） 1.5 max. 25 dB min. (3420 - 3820 MHz) 25 dB min. (5130 - 5730 MHz) 50 Ω 27 30 30 30 dB dB dB dB min. min. min. min. (824 - 915 MHz) (1710 - 1910 MHz) (824 - 915 MHz) (1710 - 1910 MHz) FI 212C245033 Pass band frequency Insertion loss at pass band Ripple at pass band Unbalanced port V.S.W.R. at pass band Balanced port V.S.W.R. at pass band Amplitude Imbalance at pass band Phase Imbalance at pass band Attenuation Unbalanced port Impedance Balanced port Impedance 2400 - 2500 MHz 2.7 dB (+25℃） 3.0 dB (-30～+85℃） 1.0 dB max. 2.0 max. 2.0 max. 2.0 dB max. 180 ±10℃ 25 dB min. (880 - 960 MHz) 15 dB min. (1710 - 1990 MHz) 15 dB min. (1990 - 2170 MHz) 15 dB min. (4800 - 5000 MHz) 50 Ω Conjugated match to CSR BC3 FI 212C245036 Pass band frequency Insertion loss at pass band Ripple at pass band Unbalanced port V.S.W.R. at pass band Balanced port V.S.W.R. at pass band Amplitude Imbalance at pass band Phase Imbalance at pass band Attenuation Unbalanced port Impedance Balanced port Impedance 2400 - 2500 MHz 3.7 dB (+25℃） 4.0 dB (-30～+85℃） 1.0 dB max. 2.0 max. 2.0 max. 2.0 dB max. 180 ±10℃ 35 dB min. (880 - 960 MHz) 20 dB min. (1710 - 1990 MHz) 15 dB min. (1990 - 2170 MHz) 20 dB min. (4800 - 5000 MHz) 50 Ω Conjugated match to CSR BC5 FI 212C245075 Pass band frequency Insertion loss at pass band Ripple at pass band Unbalanced port V.S.W.R. at pass band Balanced port V.S.W.R. at pass band Amplitude Imbalance at pass band Phase Imbalance at pass band Attenuation Unbalanced port Impedance Balanced port Impedance 2400 - 2500 MHz 3.7 dB (+25℃） 4.0 dB (-30～+85℃） 1.0 dB max. 2.2 max. 2.2 max. 2.0 dB max. 180 ±10℃ 40 dB min. (880 - 960 MHz) 18 dB min. (1710 - 1990 MHz) 12 dB min. (1990 - 2170 MHz) 30 dB min. (4800 - 5000 MHz) 50 Ω Conjugated match to CSR BC5FM, BC6ROM chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 100 21 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 168P245030 Impedance High band Pass band frequency Insertion loss at Pass band V.S.W.R. at Pass band Attenuation Impedance 1558 - 1610 MHz 2400 - 2500 MHz 0.50 dB max. 0.60 dB max. 2.0 dB max. 24 dB min. (4800 - 4900 MHz) 26 dB min. (4900 - 6000 MHz) 50Ω 0 Attenuation/Return Loss [dB] Low band Pass band frequency 1 Pass band frequency 2 Insertion loss at Pass band 1 Insertion loss at Pass band 2 V.S.W.R. at Pass band Attenuation -10 -20 -30 -40 -600 4900 - 5950 MHz 0.80 dB max. 2.0 dB max. 32 dB min. (30 - 2700 MHz) 50Ω Common Rlo High Band Low Band -50 2 4 6 8 10 12 14 16 18 Frequency. [GHz] FI 212P082931 Low band Pass band frequency 1 Pass band frequency 2 Insertion loss at 698 - 894 MHz Insertion loss at 880 - 960 MHz V.S.W.R. at 698 - 894 MHz V.S.W.R. at 880 - 960 MHz Attenuation Impedance Insertion loss at 1560 - 1610 MHz Insertion loss at 1710 - 2170 MHz Insertion loss at 2300 - 2690 MHz V.S.W.R. at 1420 - 2690 MHz Attenuation Impedance HIGH FREQUENCY PRODUCTS High band Pass band frequency 1 Pass band frequency 2 Pass band frequency 3 Pass band frequency 4 Insertion loss at 1420 - 1520 MHz 698 - 894 MHz 880 - 960 MHz 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 0.70 dB max. (+25℃） 0.80 dB max. (-40～+85℃） 2.0 max. 2.0 max. 13 dB min. (1420 - 2690 MHz) 50Ω 1420 - 1520 MHz 1560 - 1610 MHz 1710 - 2170 MHz 2300 - 2690 MHz 0.70 dB max. (+25℃） 0.80 dB max. (-40～+85℃） 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 2.0 max. 13 dB min. (698 - 960 MHz) 50Ω FI 212P0829G2 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 1710 - 2690 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance 698 - 960 MHz 0.27 dB max. (+25℃） 0.32 dB max. (-40～+85℃） 2.0 max. 13 dB min. (1710 - 2690 MHz) 50Ω 1710 - 2690 MHz 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 2.0 max. 19 dB min. (698 - 960 MHz) 50Ω chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 101 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 212P082934 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance 698 - 960 MHz 0.50 dB max. (-40～+85℃） 1.4 max. 15 dB min. (1554 - 1580 MHz) 25 dB min. (1710 - 2110 MHz) 25 dB min. (2110 - 2155 MHz) 25 dB min. (2155 - 2690 MHz) 12 dB min. (2155 - 7830 MHz) 50Ω High band Pass band frequency 1 Pass band frequency 2 Insertion loss at 1710 - 2170 MHz Insertion loss at 2500 - 2690 MHz V.S.W.R. at 1710 - 2170 MHz V.S.W.R. at 2500 - 2690 MHz Attenuation Impedance 1710 - 2170 MHz 2500 - 2690 MHz 0.50 dB max. (-40～+85℃） 0.55 dB max. (-40～+85℃） 1.4 max. 1.8 max. 17 dB min. (0.3 - 960 MHz) 50Ω FI 212P082935 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation HIGH FREQUENCY PRODUCTS Impedance 698 - 960 MHz 0.50 dB max. (-40～+85℃） 1.4 max. 15 dB min. (1554 - 1580 MHz) 25 dB min. (1710 - 2110 MHz) 25 dB min. (2110 - 2155 MHz) 25 dB min. (2155 - 2690 MHz) 12 dB min. (2155 - 7830 MHz) 50Ω High band Pass band frequency 1 Pass band frequency 2 Insertion loss at 1710 - 2170 MHz Insertion loss at 2500 - 2690 MHz V.S.W.R. at 1710 - 2170 MHz V.S.W.R. at 2500 - 2690 MHz Attenuation Impedance 1710 - 2170 MHz 2500 - 2690 MHz 0.50 dB max. (-40～+85℃） 0.55 dB max. (-40～+85℃） 1.4 max. 1.8 max. 17 dB min. (0.3 - 960 MHz) 50Ω FI 212P089208 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 1710 - 2170 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance 698 - 960 MHz 0.27 dB max. (+25℃） 0.32 dB max. (-40～+85℃） 2.0 max. 13 dB min. (1710 - 2170 MHz) 50Ω 1710 - 2170 MHz 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 2.0 max. 19 dB min. (698 - 960 MHz) 50Ω FI 212P089213 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 1710 - 2170 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance 698 - 960 MHz 0.27 dB max. (+25℃） 0.32 dB max. (-40～+85℃） 2.0 max. 13 dB min. (1710 - 2170 MHz) 50Ω 1710 - 2170 MHz 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 2.0 max. 19 dB min. (698 - 960 MHz) 50Ω chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 102 21 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 212P085909 Low band Pass band frequency Insertion loss at 698 - 960 MHz V.S.W.R. at 698 - 960 MHz Attenuation Impedance High band Pass band frequency 1 Pass band frequency 2 Pass band frequency 3 Insertion loss at 1558 - 1570 MHz Insertion loss at 1570 - 1580 MHz Insertion loss at 1580 - 1610 MHz V.S.W.R. at 1558 - 1570 MHz V.S.W.R. at 1570 - 1580 MHz V.S.W.R. at 1580 - 1610 MHz Attenuation Impedance 698 - 960 MHz 0.70 dB max. (+25℃） 0.75 dB max. (-30～+85℃） 1.6 max. 19 dB min. (1558 - 1570 MHz) 20 dB min. (1570 - 1580 MHz) 19 dB min. (1580 - 1610 MHz) 50Ω 1558 - 1570 MHz 1570 - 1580 MHz 1580 - 1610 MHz 0.75 dB max. (+25℃） 0.85 dB max. (-30～+85℃） 0.70 dB max. (+25℃） 0.80 dB max. (-30～+85℃） 0.70 dB max. (+25℃） 0.80 dB max. (-30～+85℃） 1.6 max. 1.6 max. 1.6 max. 35 dB min. (698 - 824 MHz) 42 dB min. (824 - 894 MHz) 25 dB min. (894 - 960 MHz) 50Ω FI 212P085912 V.S.W.R. at 698 - 960 MHz Attenuation Impedance High band Pass band frequency 1 Pass band frequency 2 Pass band frequency 3 Insertion loss at 1558 - 1570 MHz Insertion loss at 1570 - 1580 MHz Insertion loss at 1580 - 1610 MHz V.S.W.R. at 1558 - 1570 MHz V.S.W.R. at 1570 - 1580 MHz V.S.W.R. at 1580 - 1610 MHz Attenuation Impedance 698 - 960 MHz 0.70 dB max. (+25℃） 0.75 dB max. (-30～+85℃） 1.6 max. 19 dB min. (1558 - 1570 MHz) 20 dB min. (1570 - 1580 MHz) 19 dB min. (1580 - 1610 MHz) 50Ω HIGH FREQUENCY PRODUCTS Low band Pass band frequency Insertion loss at 698 - 960 MHz 1558 - 1570 MHz 1570 - 1580 MHz 1580 - 1610 MHz 0.75 dB max. (+25℃） 0.85 dB max. (-30～+85℃） 0.70 dB max. (+25℃） 0.80 dB max. (-30～+85℃） 0.70 dB max. (+25℃） 0.80 dB max. (-30～+85℃） 1.6 max. 1.6 max. 1.6 max. 35 dB min. (698 - 824 MHz) 42 dB min. (824 - 894 MHz) 25 dB min. (894 - 960 MHz) 50Ω FQ 105P0829DZ Pass band frequency 1 Pass band frequency 2 Impedance 699 - 960 MHz 1710 - 2690 MHz 50 Ω FI 212P1955EN Pass band frequency 1 Pass band frequency 2 Impedance 1427 - 2200 MHz 2496 - 5000 MHz 50 Ω FI 212P1700CL Pass band frequency 1 Pass band frequency 2 Impedance 699 - 2690 MHz 3300 - 5000 MHz 50 Ω chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 103 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 168P157519 Low band Pass band frequency 0 Pass band frequency 1 Pass band frequency 2 Insertion loss at 824 - 960 MHz Insertion loss at 1558 - 1585 MHz Insertion loss at 1585 - 1610 MHz V.S.W.R. at 824 - 960 MHz V.S.W.R. at 1558 - 1585 MHz V.S.W.R. at 1585 - 1610 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 2400 - 2500 MHz V.S.W.R. at 2400 - 2500 MHz Attenuation Impedance 824 - 960 MHz 1558 - 1585 MHz 1585 - 1610 MHz 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 0.40 dB max. (+25℃） 0.50 dB max. (-40～+85℃） 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 2.0 max. 2.0 max. 2.0 max. 13 dB min. (2400 - 2500 MHz) 50Ω 2400 - 2500 MHz 0.60 dB max. (+25℃） 0.70 dB max. (-40～+85℃） 2.0 max. 12 dB min. (824 - 960 MHz) 23 dB min. (1558 - 1585 MHz) 20 dB min. (1585 - 1610 MHz) 50Ω FI 168P157525 HIGH FREQUENCY PRODUCTS Low band Pass band frequency 0 Pass band frequency 1 Pass band frequency 2 Insertion loss at 824 - 960 MHz Insertion loss at 1558 - 1585 MHz Insertion loss at 1585 - 1610 MHz V.S.W.R. at 824 - 960 MHz V.S.W.R. at 1558 - 1585 MHz V.S.W.R. at 1585 - 1610 MHz Attenuation Impedance High band Pass band frequency Insertion loss at 2400 - 2500 MHz V.S.W.R. at 2400 - 2500 MHz Attenuation Impedance 824 - 960 MHz 1558 - 1585 MHz 1585 - 1610 MHz 0.50 dB max. (+25℃） 0.60 dB max. (-40～+85℃） 0.40 dB max. (+25℃） 0.50 dB max. (-40～+85℃） 0.45 dB max. (+25℃） 0.55 dB max. (-40～+85℃） 2.0 max. 2.0 max. 2.0 max. 13 dB min. (2400 - 2500 MHz) 50Ω 2400 - 2500 MHz 0.60 dB max. (+25℃） 0.70 dB max. (-40～+85℃） 2.0 max. 12 dB min. (824 - 960 MHz) 23 dB min. (1558 - 1585 MHz) 12 dB min. (1585 - 1610 MHz) 50Ω FI 168W1697B1 Pass band frequency Insertion loss at 699 - 960 MHz Insertion loss at 1000 - 2025 MHz Insertion loss at 2110 - 2690 MHz Ripple RF Coupling Coupling ration missmatch between Coupler branch 1 and Coupler branch 2 Directivity Impedance 699 - 2690 MHz 0.15 dB max. (+35~+85℃） 0.1 dB max. (+15~+35℃） 0.1 dB max. (-20～+15℃） 0.25 dB max. (+35~+85℃） 0.2 dB max. (+15~+35℃） 0.2 dB max. (-20～+15℃） 0.38 dB max. (+35~+85℃） 0.28 dB max. (+15~+35℃） 0.28 dB max. (-20～+15℃） 0.1 dB max. (699 - 746 MHz) 0.1 dB max. (791 - 862 MHz) 0.1 dB max. (824 - 960 MHz) 0.1 dB max. (1710 - 2170 MHz) 0.1 dB max. (2500 - 2690 MHz) 28.1～29.5 dB (699MHz） 25.8～27.2 dB (915MHz) 20.7～22.1 dB (1710MHz) 19.9～21.3 dB (1880MHz) 19.3～20.7 dB (2025MHz) 18.3～19.7 dB (2300MHz) 17.1～18.5 dB (2690MHz) -1～1 dB (699 - 2690 MHz) 18 dB min. (699 - 2690 MHz) 50 Ω chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 104 21 for General Electronic Equipment ■ELECTRICAL CHARACTERISTICS / TYPICAL CHARACTERISTICS FI 168K1687AA S11 Coupled port at 698 - 2690 MHz RF Coupling Isolation Impedance 698 - 2690 MHz 0.25 dB max. (+25℃） 0.30 dB max. (-40～+85℃） 0.25 dB max. (+25℃） 26.5～29.0 dB (698MHz） 24.0～27.0 dB (915MHz) 21.5～24.5 dB (1710MHz) 21.5～24.5 dB (2025MHz) 21.5～24.5 dB (2300MHz) 21.5～25.5 dB (2690MHz) 35 dB min. (698 - 2690 MHz) 50 Ω 0 CPL -10 Couple/Isolation[dB] Pass band frequency Insertion loss at 699 - 2690 MHz ISO -20 -30 -40 -50 0.5 1.0 1.5 2.0 2.5 3.0 Frequency[GHz] HIGH FREQUENCY PRODUCTS chipfilter_e-E09R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 21 105 MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER ■PACKAGING ①Minimum Quantity Type 212B-1.0 212C 212P-1.0 168B 168L 168D 168P 168L-G 168H 168P245030 212B-0.65 212P-0.7 168W 168K 105B 105L 105P Embossed tape / Paper tape [pcs] 3000 4000 5000 8000 10000 ②Tape Material ●Embossed Tape ●Card Board Cattier Tape Top tape Top tape Base tape Sprocket hole Sprocket hole Base tape Bottom tape Chip cavity Chip cavity Chip Filled Chip ③Taping Dimensions ●Embossed tape 0.315 inches wide A B T 8.0±0.3 （0.315±0.012） 1.75±0.1 (0.069±0.004） 3.5±0.05 （0.138±0.002） Sprocket hole Unit：mm（inch） φ1.5＋0.1/－0 (φ0.059＋0.004/-0) K F 2.0±0.1 (0.079±0.004) 4.0±0.1 (0.157±0.004) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_pack_e-E09R01 Type 212B-1.0 212B-0.65 212C 212C-0.7 212P-1.0 212P-0.7 Chip cavity A B 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） 1.45±0.2 2.25±0.2 （0.057±0.008） （0.089±0.008） Insertion Pitch F 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） Tape Thickness max. K T 1.1 Max 0.3 (0.043 Max) （0.012） 0.95 Max 0.3 (0.037 Max) （0.012） 1.1 Max 0.3 (0.043 Max) （0.012） 0.95 Max 0.3 (0.037 Max) （0.012） 1.1 Max 0.3 (0.043 Max) （0.012） 0.95 Max 0.3 (0.037 Max) （0.012） Unit：mm（inch） ●Paper tape 0.315 inches wide Unit：mm（inch） 3.5±0.05 (0.138±0.002) Sprocket hole A B F 1.75±0.1 (0.069±0.004） T 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) Type 168B 168L 168W 168K 168D 168P 168L-G 168H 105B 105L 105P Chip cavity Ａ Ｂ 1.00±0.05 1.80±0.05 （0.039±0.002） （0.071±0.002） 1.00±0.05 1.80±0.05 （0.039±0.002） （0.071±0.002） 1.00±0.05 1.80±0.05 （0.039±0.002） （0.071±0.002） 1.00±0.05 1.80±0.05 （0.039±0.002） （0.071±0.002） 1.00±0.05 1.80±0.05 （0.039±0.002） （0.071±0.002） 0.95±0.05 1.80±0.05 （0.037±0.002） （0.071±0.002） 0.95±0.05 1.80±0.05 （0.037±0.002） （0.071±0.002） 0.95±0.05 1.80±0.05 （0.037±0.002） （0.071±0.002） 0.62±0.03 1.12±0.03 （0.024±0.001） （0.044±0.001） 0.62±0.03 1.12±0.03 （0.024±0.001） （0.044±0.001） 0.62±0.03 1.12±0.03 （0.024±0.001） （0.044±0.001） Insertion Pitch Ｆ 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） Tape Thickness max. T 0.55 （0.022） 0.55 （0.022） 0.55 （0.022） 0.80 （0.031） 0.55 （0.022） 0.80 （0.031） 0.80 （0.031） 0.80 （0.031） 0.45 （0.018） 0.45 （0.018） 0.45 （0.018） Unit：mm（inch） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_pack_e-E09R01 ④Leader and Blank Portion ⑤Reel size t E C R B D A W A φ178±2.0 （φ7.01±0.079） B φ50min. （φ1.97 min.） C φ13.0±0.2 （φ0.512±0.008） 8mm width tape （0.315 inches width） 12mm width tape （0.472 inches width） t 2.5max. （0.098max.） 2.5max. （0.098max.） W 10±1.5 （0.394±0.059） 14±1.5 （0.551±0.059） D φ21.0±0.8 （φ0.827±0.031） E 2.0±0.5 （0.079±0.020） R 1.0 Unit：mm（inch） ⑥Top Tape Strength The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_pack_e-E09R01 MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER ■RELIABILITY DATA 1. Operating Temperature Range Specified Value －40～＋85℃ 2. Storage Temperature Range Specified Value －40～＋85℃ Test Methods and Remarks ※Note : －20 to +40℃ in taped packaging 3. Resistance to Flexure of Substrate Specified Value No mechanical damage. Warp Testing board Thickness : 2mm : Glass epoxy-resin substrate : 0.8mm Test Methods and Remarks 4. Adhesion of Electrode Specified Value Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Applied force Duration : 5N : 10 sec. Test Methods and Remarks 5. Solderability Specified Value 75% or more of immersed surface of terminal electrode shall be covered with fresh solder. Test Methods and Remarks Solder temperature Duration Preconditioning Immersion and Removal speed : 240±5℃ : 3±1 sec : Immersion into flux. : 25mm/sec. 6. Resistance to Solder Heat Specified Value Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Test Methods and Remarks Preheating Solder temperature Duration Preconditioning Immersion and Removal speed Recovery : : : : : : 150℃ for 2 min. 260±5℃ 5±0.5 sec. Immersion into flux. 25mm/sec. 2 to 3hrs of recovery under the standard condition after the removal from test chamber. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_reli_e-E09R01 7. Thermal Shock Specified Value Test Methods and Remarks Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. According to JIS C60068-2-14. Conditions for 1 cycle Step Temperature (℃) 1 －40±3 2 Room Temperature 3 85±2 4 Room Temperature Number of cycles Mounting method Recovery Duration (min) 30±3 Within 3 30±3 Within 3 : 100 : Soldering onto PC board. : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 8. Humidity (steady state) Specified Value Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Test Methods and Remarks Temperature Humidity Duration Recovery : : : : ＋85±2℃ 85±5％RH 1000 hrs 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 9. High temperature life test Specified Value Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Test Methods and Remarks Temperature Duration Recovery : ＋85±2℃ : 1000 hrs : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 10. Low temperature life test Specified Value Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Test Methods and Remarks Temperature Duration Recovery : －40±2℃ : 1000 hrs : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. Note on standard condition: "standard condition" referred to herein is defined as follows : 5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement result : In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_reli_e-E09R01 MULTILAYER CERAMIC DEVICES / DIPLEXERS / COUPLER / 2 BRANCH COUPLER ■PRECAUTIONS 1. PCB Design ◆Land pattern design Land pattern dimension examples FI 212B Side 4Pins type FI 212B LGA 3Pins type FI 168B/L Side 4Pins type FI 105B/L Side 4Pins type 0.825 0.55 0.475 0.3 Unit：mm FI 168L/FI 168P/FI 168D/FI 168K Side 4Pins type Unit：mm Unit：mm FI 168L/H LGA Type FI 212C Type Unit：mm FI 168P Side 4Pins type Technical considerations 0.70 Unit：mm FI 212P Side 6Pins type 0.40 0.25 0.30 Unit：mm FI 212P LGA 6Pins Type Unit：mm FI 168W Type 0.3500 0.15 0.6500 Unit：mm FQ 105P Type 0.4 0.30 0.25 0.3500 0.18 0.5000 Unit：mm 0.18 0.18 0.54 Unit：mm Unit：mm Unit：mm 2. Soldering ◆Conditions for Reflow soldering (for reference) ・ Pb Free Reflow Profile Technical considerations Temperature（℃） 300 200 Peak 260℃ Max. Within 10sec. Slow cooling 100 0 Preheating150℃ Heating above 230℃ 60sec. Min. 40sec. Max. ※ Components should be preheated to within 100 to 130℃ from soldering temperature. ※ Assured to be reflow soldering for 2 times. Note : The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_prec_e-E09R01 3. Storage conditions Precautions ◆Storage conditions 1. The Products must not be used in the following environments : ・ exposure to special gases such as (C12, NH3, SOx, NOx) ・ exposure to volatile gas or inflammable gas ・ exposure to a lot of dust ・ exposure to water or condensation ・ exposure to direct sunlight or freezing 2. The Products should be kept in the following conditions : ・ Temperature : －10～＋40℃ ・ Humidity : 15～85％RH max. 3. The products should be used within 6 months after delivery. In case of storage over 6 months, solderability shall be checked before actual usage. ■ Please contact of our offices for further details of specifications. All of the standard values listed here are subject to change without notice. Therefore, please check the specifications carefully before use. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . chipfilter_prec_e-E09R01