for General Electronic Equipment
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October
2020. All
All of
of the
the
January 2021.
contents specified herein and production status of the products listed in
this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the latest
information carefully before practical application or use of our products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO YUD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
2
21
for General Electronic Equipment
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES(LB SERIES M TYPE)
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES(LB SERIES M TYPE)
REFLOW
■PARTS NUMBER
L
B
* Operating Temp.:-40~+105℃(Including self-generated heat)
M △
①
2
0
1
②
T
③
1
0 0
④
J △
⑤ ⑥
④Nominal inductance
Code
(example)
R12
1R0
100
101
※R=Decimal point
Series name
Wound chip inductor for signal line
②Dimensions(L×W)
Code
Type(inch)
2016
2016(0806)
Dimensions
(L×W)[mm]
2.0×1.6
⑤Inductance tolerance
Code
J
Packaging
Taping
Nominal inductance[μH]
0.12
1.0
10
100
STANDARD INDUCTORS
③Packaging
Code
T
△=Blank space
INDUCTORS
①Series name
Code
LBM△
6
Inductance tolerance
±5%
⑥Internal code
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
Type
A
B
C
LBM 2016
0.6
1.0
1.8
Unit:mm
W
L
T
e
C
A
B
A
Standard quantity [pcs]
Paper tape
Embossed tape
Type
L
W
T
e
LBM 2016
2.0±0.2
(0.08±0.008)
1.6±0.2
(0.063±0.008)
1.6±0.2
(0.063±0.008)
0.5±0.2
(0.02±0.008)
-
2000
Unit:mm(inch)
i_wound_LBM_e-E08R01.doc
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
21
79
for General Electronic Equipment
■PARTS NUMBER
●LBM2016(0806) type
INDUCTORS
STANDARD INDUCTORS
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
LBM
Parts number
EHS
Nominal inductance
[μH]
Inductance tolerance
Q
(min.)
Self-resonant
frequency
[MHz](min.)
DC Resistance
[Ω](±30%)
Rated current
[mA](max.)
Measuring
frequency
[MHz]
2016TR12J
2016TR15J
2016TR18J
2016TR22J
2016TR27J
2016TR33J
2016TR39J
2016TR47J
2016TR56J
2016TR68J
2016TR82J
2016T1R0J
2016T1R2J
2016T1R5J
2016T1R8J
2016T2R2J
2016T2R7J
2016T3R3J
2016T3R9J
2016T4R7J
2016T5R6J
2016T6R8J
2016T8R2J
2016T100J
2016T120J
2016T150J
2016T180J
2016T220J
2016T270J
2016T330J
2016T390J
2016T470J
2016T560J
2016T680J
2016T820J
2016T101J
2016T151J
2016T181J
2016T221J
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
150
180
220
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
±5%
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
25
25
25
25
25
25
25
25
25
25
20
20
20
20
20
15
15
15
15
600
550
500
450
425
400
375
350
300
270
250
220
180
135
100
75
55
48
43
40
36
33
30
27
23
20
18
17
16
15
14
13
12
11
10
9.0
6.5
6.0
5.5
0.13
0.15
0.15
0.20
0.21
0.21
0.26
0.26
0.29
0.32
0.34
0.38
0.41
0.47
0.48
0.54
0.59
0.68
0.74
0.78
0.88
0.97
1.1
1.2
1.4
1.5
2.5
2.8
3.2
3.6
3.9
4.1
5.9
7.0
7.7
8.0
13.5
15
18
610
570
560
520
510
490
440
430
410
400
390
385
370
350
345
340
310
290
275
270
255
240
225
215
200
190
150
140
130
125
120
115
95
90
85
80
69
67
65
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
※)Rated Current : The maximum DC value having inductance decrease within 10 % and temperature increase within 20 degC by the application of DC bias.
i_wound_LBM_e-E08R01.xls
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
80
21
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PACKAGING
①Minimum Quantity
Standard Quantity [pcs]
Paper Tape
Embossed Tape
Type
LB C3225
CB C3225
LB 3218
LB R2518
LB C2518
LB 2518
CB 2518
CB C2518
LBM2016
LB C2016
LB 2016
CB 2016
CB C2016
LB 2012
LB C2012
LB R2012
CB 2012
CB C2012
CB L2012
LB 1608
LBMF1608
CBMF1608
-
1000
-
2000
-
2000
-
2000
-
3000
4000
4000
-
-
-
3000
②Tape material
●Embossed tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
●Card board carrier tape
Top tape
Base tape
Chip Filled
Sprocket hole
Bottom tape
Chip cavity
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
③Taping Dimensions
●Embossed Tape (0.315 inches wide)
A
B
F
Type
LBM2016
LB C3225
CB C3225
LB
3218
LB 2518
CB 2518
LB C2518
CB C2518
LB R2518
LB 2016
CB 2016
LB C2016
CB C2016
LB 2012
CB 2012
LB C2012
CB C2012
LB R2012
LBMF1608
CBMF1608
1.75±0.1
(0.069±0.004)
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
3.5±0.05
(0.138±0.002)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip cavity
A
B
1.75±0.1
2.1±0.1
(0.069±0.004)
(0.083±0.004)
2.8±0.1
3.5±0.1
(0.110±0.004)
(0.138±0.004)
2.1±0.1
3.5±0.1
(0.083±0.004)
(0.138±0.004)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape thickness
T
K
0.3±0.05
1.9max.
(0.012±0.002)
(0.075max.)
0.3±0.05
4.0max.
(0.012±0.002)
(0.157max.)
0.3±0.05
2.2max.
(0.012±0.002)
(0.087max.)
2.15±0.1
(0.085±0.004)
2.7±0.1
(0.106±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
2.2max.
(0.087max.)
1.75±0.1
(0.069±0.004)
2.1±0.1
(0.083±0.004)
4.0±0.1
(0.157±0.004)
0.3±0.05
(0.012±0.002)
1.9max.
(0.075max.)
1.45±0.1
(0.057±0.004)
2.25±0.1
(0.089±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.45max.
(0.057max.)
1.1±0.1
(0.043±0.004)
1.9±0.1
(0.075±0.004)
4.0±0.1
(0.157±0.004)
0.25±0.05
(0.010±0.002)
1.2max.
(0.047max.)
Unit:mm(inch)
Insertion pitch
F
4.0±0.1
(0.157±0.004)
4.0±0.1
(0.157±0.004)
Tape thickness
T
1.1max.
(0.043max.)
1.1max.
(0.043max.)
Unit:mm(inch)
●Card board carrier tape(0.315 inches wide)
A
B
F
Type
CB L2012
LB
1608
1.75±0.1
(0.069±0.004)
T
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
3.5±0.05
(0.138±0.002)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip cavity
A
B
1.55±0.1
2.3±0.1
(0.061±0.004)
(0.091±0.004)
1.0±0.1
1.8±0.1
(0.039±0.004)
(0.071±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
④Leader and Blank Portion
⑤Reel Size
⑥Top Tape Strength
The top tape requires a peel-off force 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■RELIABILITY DATA
1.Operating temperature Range
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
-40~+105℃(Including self-generated heat)
LBM Series
2. Storage Temperature Range(after soldering)
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
-40~+85℃
LBM Series
Test Methods and
Remarks
LB, CB Series:
Please refer the term of "7. storage conditions" in precautions.
3.Rated Current
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
4.Inductance
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBMF・CBMF・LBM Series
Measuring equipment
:LCR Mater(HP4285A or its equivalent)
Measuring frequency
: Specified frequency
5.Q
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LBM Series
Measuring equipment
Measuring frequency
-
Within the specified tolerance
: LCR Mater(HP4285A or its equivalent)
: Specified frequency
6.DC Resisitance
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
Measuring equipment : DC Ohmmeter (HIOKI 3227 or its equivalent)
7.Self-Resonant Frequency
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
Measuring equipment : Impedance analyzer (HP4291A or its equivalent)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
8.Temperature Characteristic
LBM2016
Specified Value
Test Methods and
Remarks
Inductance change : Within±5%
LB1608
LB2012
LBR2012
CB2012
CBL2012
LB2016
CB2016
LB2518
LBR2518
CB2518
LBC3225
CBC3225
LBMF1608
CBMF1608
LBC2016
CBC2016
LBC2518
CBC2518
LB3218
LBC2012
CBC2012
Inductance change : Within±20%
Inductance change : Within±25%
Inductance change : Within±35%
Based on the inductance at 20℃ and Measured at the ambient of -40℃~+85℃.
9.Rasistance to Flexure of Substrate
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No damage.
LBM Series
Warp
: 2mm(LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF Series)
Test substrate : Glass epoxy-resin substrate
Thickness
: 0.8mm(LB1608・LBMF1608・CBMF1608)
: 1.0mm(Others)
Test Methods and
Remarks
10.Body Strength
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No damage.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM
Applied force : 10N
Duration
: 10sec.
LB1608・LBMF1608・CBMF1608
Applied force : 5N
Duration
: 10sec.
11.Adhesion of terminal electrode
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No abnormality.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF
Applied force
: 10N to X and Y directions
Duration
: 5 sec.
Test substrate
: Printed board
LB1608・CBMF1608・LBMF1608
Applied force
: 5N to X and Y directions
Duration
: 5 sec.
Test substrate
: Printed board
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
12.Resistance to vibration
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±5%
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Inductance change : Within±10%
No significant abnormality in appearance.
LB・LBR・LBC・CB・CBC・CBL・LBM・LBMF・CBMF:
The given sample is soldered to the board and then it is tested depending on the conditions of the following table.
Vibration Frequency
10~55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
13.Drop test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
-
LBM Series
14.Solderability
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
At least 90% of surface of terminal electrode is covered by new
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF:
Solder temperature
: 245±5℃
Duration
: 5±0.5sec
Flux
: Methanol solution with 25% of colophony
15.Resistance to soldering
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Inductance change : Within±10%
Inductance change : Within±5%
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF:
3 times of reflow oven at 230℃ MIN for 40sec. with peak temperature at 260 ℃ for 5sec.
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
16.Resisitance to solvent
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
-
LBM Series
Test Methods and
Remarks
Solvent temperature
Type of solvent
Cleaning conditions
: Room temperature
: Isopropyl alcohol
: 90s. Immersion and cleaning.
17.Thermal shock
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10%
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF:
The given sample is soldered to the board and then its Inductance is measured after 100cycles of the following conditions.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
-40±3
30±3
2
Room temperature
Within 3
3
+85±2
30±3
4
Room temperature
Within 3
Recovery
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
18.Damp heat life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10%
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Humidity
Duration
Recovery
: 60±2℃
: 90~95%RH
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19.Loading under damp heat life test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
Specified Value
Test Methods and
Remarks
Inductance change : Within±10%
No significant abnormality in appearance.
LBM Series
Temperature
Humidity
Duration
Applied current
Recovery
: 60±2℃
: 90~95%RH
: 1000 hrs
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
20.High temperature life test
Specified Value
LB, LBC, LBR, LBMF Series
-
CB, CBC, CBL, CBMF Series
Inductance change : Within±10%
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Duration
Recovery
: 85±2℃
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
21.Loading at high temperature life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Temperature
Duration
Applied current
Recovery
Inductance change : Within±10%
(LBC3225 Series : Within±20%)
No significant abnormality in appearance.
-
: 85±2℃
: 1000 hrs
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
22.Low temperature life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10%
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Duration
Recovery
: -40±2℃
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
23.Standard condition
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Standard test conditions
Unless specified, Ambient temperature is 20±15℃ and the Relative
humidity is 65±20%. If there is any doubt about the test results, further
measurement shall be had within the following limits:
Ambient Temperature: 20±2℃
Relative humidity: 65±5%
Inductance value is based on our standard measurement systems.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PRECAUTIONS
1.Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2.PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to those products is reflow soldering only.
3.Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4.Soldering
Precautions
◆Reflow soldering( LB and CB Types)
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
◆Reflow soldering( LB and CB Types)
1. Reflow profile
Technical
considerations
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5.Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
Washing by supersonic waves shall be avoided.
◆Cleaning conditions
If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E06R01
6.Handling
Precautions
Technical
considerations
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Breakaway PC boards( splitting along perforations)
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards( splitting along perforations)
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
7.Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0~40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E06R01